Product Information

P1014NXN5FFB

P1014NXN5FFB electronic component of NXP

Datasheet
Microprocessors - MPU QorIQ, 32-Bit Power Arch, SoC, 667 MHz, USB, SATA, SEC, GbE, PCIe, DDR3, -40C to 105C, Rev2.01

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - Global Stock

MOQ : 1
Multiples : 1
1 : USD 56.7725
10 : USD 55.6126
25 : USD 55.043
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Core
Data Bus Width
Maximum Clock Frequency
Interface Type
Operating Supply Voltage
Number of Cores
Mounting Style
Package / Case
L1 Cache Instruction Memory
L1 Cache Data Memory
Minimum Operating Temperature
Maximum Operating Temperature
Memory Type
Brand
Number Of I/Os
I/O Voltage
Instruction Type
L2 Cache Instruction / Data Memory
Number Of Timers/Counters
Processor Series
Factory Pack Quantity :
Watchdog Timers
Cnhts
Hts Code
Mxhts
Taric
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Freescale Semiconductor Document Number: P1014EC Data Sheet: Advance Information Rev. 4, 05/2014 P1014 P1014 QorIQ Integrated Processor Hardware TePBGA1-425 19 mm x 19 mm Specifications The following list provides an overview of the P1014 feature Programmable interrupt controller (PIC) compliant with set: OpenPIC standard One 4-channel DMA controller High-performance 32-bit Book E-enhanced core based on 2 Two I C interfaces the Power Architecture technology: Four UART interfaces 36-bit physical addressing Integrated Flash controller (IFC) Double-precision floating-point support TDM 32-Kbyte L1 instruction cache and 32-Kbyte L1 data 16 general-purpose I/O signals cache Operating temperature (Ta - T ) range: 0105 C (standard) 400- to 1000-MHz clock frequency j and 40 C to 105 C (extended) 256-Kbyte L2 cache with ECC. Also configurable as 19 19 mm 425-ball wirebond TePBGA-1 package with SRAM and stashing memory 0.8 mm pitch Two enhanced three-speed Ethernet controllers (eTSECs) 10/100/1000 Mbps support TCP/IP acceleration, quality of service, and classification capabilities IEEE Std 1588 support RGMII, SGMII eTSEC1 supports both RGMII/SGMII interfaces and eTSEC2 support SGMII interface High-speed interfaces supporting the following multiplexing options: Two PCI Express 1.1 interfaces Two SATA Revision 2.0 interfaces Five lanes of high-speed serial interfaces to be shared between PCI Express, SATA, and SGMII High-speed USB controller (USB 2.0) Host and device support On-chip USB 2.0 high-speed PHY Enhanced host controller interface (EHCI) ULPI interface Enhanced secure digital host controller (SD/MMC) Enhanced serial peripheral interface (eSPI) Integrated security engine (ULE CAAM) Protocol support includes DES, AES, RNG, CRC, MDE, PKE, SHA, and MD5. DDR3/DDR3L SDRAM memory controller supports and 16-bit with ECC This document contains information on a new product. Specifications and information herein are subject to change without notice. Freescale Semiconductor, Inc., 2011-2014. All rights reserved.Table of Contents 1 Pin assignments and reset states .4 2.21 PCI Express . 76 1.1 Ball layout diagrams 4 2.22 Serial ATA (SATA) 80 1.2 Pinout assignments 11 3 Hardware design considerations 84 2 Electrical characteristics .21 3.1 System clocking 84 2.1 Overall DC electrical characteristics .21 3.2 Supply power default setting 87 2.2 Power sequencing .25 3.3 Power supply design and sequencing . 88 2.3 Power-down Requirements 25 3.4 Decoupling recommendations . 89 2.4 Reset Initialization .25 3.5 SerDes block power supply decoupling 2.5 Power-on ramp rate 26 recommendations 89 2.6 Power characteristics 26 3.6 Connection recommendations . 89 2.7 Input clocks 28 3.7 Pull-up and pull-down resistor requirements 89 2.8 DDR3, and DDR3L SDRAM controller .31 3.8 Output buffer DC impedance . 90 2.9 eSPI .38 3.9 Configuration pin muxing . 90 2.10 DUART .39 3.10 JTAG configuration signals . 91 2.11 Ethernet: Enhanced Three-Speed Ethernet (eTSEC) .40 3.11 Guidelines for high-speed interface termination . 93 2.12 USB 51 3.12 Thermal 94 2.13 Integrated flash controller .55 4 Package information . 96 2.14 Enhanced secure digital host controller (eSDHC) 59 4.1 Package parameters for P1014 96 2.15 Programmable Interrupt Controller (PIC) 4.2 Mechanical dimensions of P1014 WB-TePBGA . 96 specifications 61 5 Ordering information . 98 2.16 JTAG .62 5.1 Part marking 98 2 2.17 I C .64 6 Product documentation . 98 2.18 GPIO .66 7 Revision history . 99 2.19 TDM .68 2.20 High-Speed Serial Interfaces (HSSI) 70 P1014 QorIQ Integrated Processor Hardware Specifications, Rev. 4 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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