NX30P6093UKAZ

NX30P6093A 2 High-voltage I C controlled OVP load switch with OTG Rev. 1 16 August 2018 Product data sheet 1. General description 2 The NX30P6093A is a 5.6A I C controlled overvoltage protection Load switch for USB Type-C and PD applications. It includes undervoltage lockout, overvoltage lockout and overtemperature protection circuits, designed to automatically isolate the power switch terminals when a fault condition occurs. It features input pin impedance detection function, providing USB power supply pin status to system to avoid short circuit damage for the Type-C port power supply pin. NX30P6093A has a default overvoltage protection threshold, and the OVLO threshold can 2 be adjusted by both external resistor divider on ADJ pin and internal I C register. A 13ms debounce time is deployed every time before the device is switched ON, followed by a soft start to limit the inrush current. USB OTG is supported when the plugged accessory is recognized as an OTG device by system and a 5V source is applied on VOUT pin of NX30P6093A. The current capability in USB OTG mode is limited to max 1.5A. Designed for operation from 2.8V to 20.0V, it can be used in USB Type-C and PD power control applications to offer essential protection and enhance system reliability. NX30P6093A is offered in a small 20-bump 1.7 x 2.16 mm, 0.4mm pitch WLCSP package. 2. Features and benefits Wide supply voltage range for VIN from 2.8V to 20.0V System Power supply VDD from 3.0V to 4.5V I maximum 5.6A continuous current for OVP mode SW Support 1.5A USB OTG 29V tolerance on VIN pin 16m (typical) ultra-low ON resistance 2 Adjustable VIN overvoltage protection by both external resistor and I C Built-in slew rate control for inrush current limit Integrated current source for VIN pin impedance detection Protection circuitry Overtemperature protection Overvoltage protection Undervoltage lockout NX30P6093A NXP Semiconductors 2 High-voltage I C controlled OVP load switch with OTG Surge protection: IEC61000-4-5 exceeds 100V on VIN ESD protection IEC61000-4-2 contact discharge exceeds 8kV on VIN IEC61000-4-2 air discharge exceeds 15kV on VIN HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 3kV on all pins MM Class B exceeds 100 V on all the pins Specified from -40 C to +85 C 3. Applications Smart and feature phones Tablets, eBooks Notebook 4. Ordering information Table 1. Ordering information Type number Package Temperature Name Description Version range NX30P6093AUK 40 C to +85 C WLCSP20 wafer level chip-scale package 20 bumps SOT1397-6 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included) 4.1 Ordering options Table 2. Ordering options Type number Orderable Package Packing method Minimum Temperature part number order quantity NX30P6093AUK NX30P6093AUKZ WLCSP20 REEL 7 Q1/T1 4000 T = 40 C to +85 C amb *SPECIAL MARK CHIPS DP 5. Marking Table 3. Marking Line Marking Description 1 X30AP2 basic type name NX30P6093A All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. Product data sheet Rev. 1 16 August 2018 2 of 33