Freescale Semiconductor Document Number: MPXH6101A Data Sheet: Technical Data Rev. 7.1, 06/2015 MPXH6101A, 15 to 102 kPa, Absolute, MPXH6101A Integrated Pressure Sensor Freescales MPXH6101A manifold absolute pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each Super small outline package cylinder. The small form factor and high reliability of on-chip integration makes the Freescale MAP sensor a logical and economical choice for automotive system designers. MPXH6101A piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor MPXH6101A6U/6T1 Case 98ARH99066A processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features Top view 1.72% maximum error over 0 C to 85 C Specifically designed for intake manifold absolute pressure sensing in engine control systems DNC 5 4 V OUT Temperature compensated over -40 C to +125 C DNC 6 3 GND Thermoplastic (PPS) surface mount package DNC 7 2 V S Applications DNC 8 1 DNC Manifold sensing for automotive systems Ideally suited for microprocessor or microcontroller-based system Pin 1 identification, chamfered corner Also ideal for non-automotive applications Pinout Ordering Information of Ports Pressure type Device Part number Shipping Package marking None Single Dual Gauge Differential Absolute Super Small Outline Package MPXH6101A6U Rails 98ARH99066A MPXH6101A MPXH6101A6T1 Tape and Reel 98ARH99066A MPXH6101A Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2006, 2008, 2009, 2015 Freescale Semiconductor, Inc. All rights reserved.Contents 1 General Description 3 1.1 Block diagram . 3 1.1 3 1.2 Pinout . 3 2 Mechanical and Electrical Specifications . 4 2.1 Maximum ratings . 4 2.2 Operating characteristics 4 3 On-Chip Temperature Compensation and Calibration 5 4 Package Information 6 4.1 Pressure (P1)/Vacuum (P2) Side Identification . 6 4.2 Minimum recommended footprint for surface mounted applications . 6 4.3 Package dimensions 7 5 Revision History 10 Related Documentation The MPXH6101A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: