Product Information

MKE04Z8VFK4

MKE04Z8VFK4 electronic component of NXP

Datasheet
ARM Microcontrollers - MCU M0 + 8K FLASH 48MHZ

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 3.0405 ea
Line Total: USD 3.0405

2286 - Global Stock
Ships to you between
Thu. 11 Apr to Mon. 15 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4662 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1
1 : USD 2.6795
10 : USD 1.8285
100 : USD 1.817
490 : USD 1.679
980 : USD 1.4145
2940 : USD 1.357

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Core
Data Bus Width
Maximum Clock Frequency
Program Memory Size
Data RAM Size
A/D Bit Size
Operating Supply Voltage
Series
Package / Case
Mounting Style
ADC Resolution
Number of I/Os
Minimum Operating Temperature
Maximum Operating Temperature
Program Memory Type
A/D Channels Available
Brand
Data Ram Type
Interface Type
Number Of Timers
On-Chip Dac
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Number Of Adc Channels
Number Of Timers/Counters
Taric
Tradename
LoadingGif

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Document Number MKE04P24M48SF0 NXP Semiconductors Rev. 5, 04/2020 Data Sheet: Technical Data MKE04P24M48SF0 KE04 Sub-Family Data Sheet Supports the following: MKE04Z8VTG4(R), MKE04Z8VWJ4(R), and MKE04Z8VFK4(R) Key features Security and integrity modules 80-bit unique identification (ID) number per chip Operating characteristics Voltage range: 2.7 to 5.5 V Human-machine interface Flash write voltage range: 2.7 to 5.5 V Up to 22 general-purpose input/output (GPIO) Temperature range (ambient): -40 to 105C Two up to 8-bit keyboard interrupt modules (KBI) External interrupt (IRQ) Performance Up to 48 MHz Arm Cortex-M0+ core Analog modules Single cycle 32-bit x 32-bit multiplier One 12-channel 12-bit SAR ADC, operation in Stop Single cycle I/O access port mode, optional hardware trigger (ADC) Two analog comparators containing a 6-bit DAC Memories and memory interfaces and programmable reference input (ACMP) Up to 8 KB flash Up to 1 KB RAM Timers One 6-channel FlexTimer/PWM (FTM) Clocks One 2-channel FlexTimer/PWM (FTM) Oscillator (OSC) - supports 32.768 kHz crystal or 4 One 2-channel periodic interrupt timer (PIT) MHz to 24 MHz crystal or ceramic resonator choice One pulse width timer (PWT) of low power or high gain oscillators One real-time clock (RTC) Internal clock source (ICS) - internal FLL with internal or external reference, 37.5 kHz pre-trimmed Communication interfaces internal reference for 48 MHz system clock One SPI module (SPI) Internal 1 kHz low-power oscillator (LPO) One UART module (UART) One I2C module (I2C) System peripherals Power management module (PMC) with three power Package options modes: Run, Wait, Stop 24-pin QFN Low-voltage detection (LVD) with reset or interrupt, 20-pin SOIC selectable trip points 16-pin TSSOP Watchdog with independent clock source (WDOG) Programmable cyclic redundancy check module (CRC) Serial wire debug interface (SWD) Aliased SRAM bitband region (BIT-BAND) Bit manipulation engine (BME) NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Ordering parts.......................................................................................3 5.2.2 FTM module timing....................................................... 16 1.1 Determining valid orderable parts............................................... 3 5.3 Thermal specifications.................................................................17 2 Part identification................................................................................. 3 5.3.1 Thermal operating requirements.................................... 17 2.1 Description...................................................................................3 5.3.2 Thermal characteristics.................................................. 17 2.2 Format..........................................................................................3 6 Peripheral operating requirements and behaviors................................ 19 2.3 Fields............................................................................................3 6.1 Core modules............................................................................... 19 2.4 Example....................................................................................... 4 6.1.1 SWD electricals .............................................................19 3 Parameter classification........................................................................4 6.2 External oscillator (OSC) and ICS characteristics.......................20 4 Ratings..................................................................................................4 6.3 NVM specifications..................................................................... 22 4.1 Thermal handling ratings............................................................. 4 6.4 Analog..........................................................................................23 4.2 Moisture handling ratings............................................................ 5 6.4.1 ADC characteristics....................................................... 23 4.3 ESD handling ratings................................................................... 5 6.4.2 Analog comparator (ACMP) electricals.........................25 4.4 Voltage and current operating ratings..........................................5 6.5 Communication interfaces........................................................... 26 5 General................................................................................................. 6 6.5.1 SPI switching specifications.......................................... 26 5.1 Nonswitching electrical specifications........................................ 6 7 Dimensions...........................................................................................29 5.1.1 DC characteristics.......................................................... 6 7.1 Obtaining package dimensions.................................................... 29 5.1.2 Supply current characteristics........................................ 13 8 Pinout................................................................................................... 29 5.1.3 EMC performance..........................................................14 8.1 Signal Multiplexing and Pin Assignments...................................29 5.2 Switching specifications.............................................................. 15 8.2 Device pin assignment................................................................. 31 5.2.1 Control timing................................................................ 15 9 Revision history....................................................................................32 KE04 Sub-Family Data Sheet, Rev. 5, 04/2020 2 NXP Semiconductors

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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