Product Information

MK10DX128VLF5

MK10DX128VLF5 electronic component of NXP

Datasheet
MCU 32-bit K10 ARM Cortex M4 RISC 128KB Flash 1.8V/2.5V/3.3V 48-Pin LQFP Tray

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 8.809 ea
Line Total: USD 8.809

1212 - Global Stock
Ships to you between
Thu. 11 Apr to Mon. 15 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1212 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1
1 : USD 8.809
10 : USD 6.072
250 : USD 5.8305
500 : USD 5.727
1000 : USD 5.313
2500 : USD 5.29
5000 : USD 5.1175

     
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RoHS - XON
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Core
Data Bus Width
Maximum Clock Frequency
Program Memory Size
Data RAM Size
A/D Bit Size
Operating Supply Voltage
Series
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ADC Resolution
Number of I/Os
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
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A/D Channels Available
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Data Rom Size
Data Rom Type
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Number Of Programmable I/Os
Number Of Timers
On-Chip Adc
On-Chip Dac
Processor Series
Factory Pack Quantity :
Tradename
Analog Supply Voltage
Cnhts
Hts Code
I/O Voltage
Mxhts
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Supply Voltage - Max
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Document Number: K10P100M72SF1 Freescale Semiconductor Rev. 3, 11/2012 Data Sheet: Technical Data K10P100M72SF1 K10 Sub-Family Supports: MK10DX128VLL7, MK10DX256VLL7, MK10DX64VMC7, MK10DX128VMC7, MK10DX256VMC7 Features Analog modules Operating Characteristics Two 16-bit SAR ADCs Voltage range: 1.71 to 3.6 V Programmable gain amplifier (PGA) (up to x64) Flash write voltage range: 1.71 to 3.6 V integrated into each ADC Temperature range (ambient): -40 to 105C 12-bit DAC Three analog comparators (CMP) containing a 6-bit Clocks DAC and programmable reference input 3 to 32 MHz crystal oscillator Voltage reference 32 kHz crystal oscillator Multi-purpose clock generator Timers Programmable delay block System peripherals Eight-channel motor control/general purpose/PWM Multiple low-power modes to provide power timer optimization based on application requirements Two 2-channel quadrature decoder/general purpose 16-channel DMA controller, supporting up to 63 timers request sources Periodic interrupt timers External watchdog monitor 16-bit low-power timer Software watchdog Carrier modulator transmitter Low-leakage wakeup unit Real-time clock Security and integrity modules Communication interfaces Hardware CRC module to support fast cyclic Controller Area Network (CAN) module redundancy checks Two SPI modules 128-bit unique identification (ID) number per chip Two I2C modules Five UART modules Human-machine interface I2S module Low-power hardware touch sensor interface (TSI) General-purpose input/output Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.2 Thermal attributes.................................................21 1.1 Determining valid orderable parts......................................3 6 Peripheral operating requirements and behaviors....................22 2 Part identification......................................................................3 6.1 Core modules....................................................................22 2.1 Description.........................................................................3 6.1.1 Debug trace timing specifications.........................22 2.2 Format...............................................................................3 6.1.2 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 3 Terminology and guidelines......................................................4 6.3.1 MCG specifications...............................................25 3.1 Definition: Operating requirement......................................4 6.3.2 Oscillator electrical specifications.........................27 3.2 Definition: Operating behavior...........................................5 6.3.3 32 kHz Oscillator Electrical Characteristics...........30 3.3 Definition: Attribute............................................................5 6.4 Memories and memory interfaces.....................................30 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................30 3.5 Result of exceeding a rating..............................................6 6.4.2 EzPort Switching Specifications............................35 3.6 Relationship between ratings and operating 6.4.3 Flexbus Switching Specifications..........................36 requirements......................................................................6 6.5 Security and integrity modules..........................................39 3.7 Guidelines for ratings and operating requirements............7 6.6 Analog...............................................................................39 3.8 Definition: Typical value.....................................................7 6.6.1 ADC electrical specifications.................................39 3.9 Typical value conditions....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........47 4 Ratings......................................................................................9 6.6.3 12-bit DAC electrical characteristics.....................49 4.1 Thermal handling ratings...................................................9 6.6.4 Voltage reference electrical specifications............52 4.2 Moisture handling ratings..................................................9 6.7 Timers................................................................................53 4.3 ESD handling ratings.........................................................9 6.8 Communication interfaces.................................................53 4.4 Voltage and current operating ratings...............................9 6.8.1 CAN switching specifications................................53 5 General.....................................................................................10 6.8.2 DSPI switching specifications (limited voltage 5.1 AC electrical characteristics..............................................10 range)....................................................................54 5.2 Nonswitching electrical specifications...............................10 6.8.3 DSPI switching specifications (full voltage range).55 5.2.1 Voltage and current operating requirements.........10 6.8.4 I2C switching specifications..................................57 5.2.2 LVD and POR operating requirements.................11 6.8.5 UART switching specifications..............................57 5.2.3 Voltage and current operating behaviors..............12 6.8.6 I2S/SAI Switching Specifications..........................57 5.2.4 Power mode transition operating behaviors..........13 6.9 Human-machine interfaces (HMI)......................................61 5.2.5 Power consumption operating behaviors..............14 6.9.1 TSI electrical specifications...................................61 5.2.6 Designing with radiated emissions in mind...........18 7 Dimensions...............................................................................62 5.2.7 Capacitance attributes..........................................18 7.1 Obtaining package dimensions.........................................62 5.3 Switching specifications.....................................................19 8 Pinout........................................................................................63 5.3.1 Device clock specifications...................................19 8.1 K10 Signal Multiplexing and Pin Assignments..................63 5.3.2 General switching specifications...........................19 8.2 K10 Pinouts.......................................................................68 5.4 Thermal specifications.......................................................20 9 Revision History........................................................................70 5.4.1 Thermal operating requirements...........................20 K10 Sub-Family Data Sheet, Rev. 3, 11/2012. 2 Freescale Semiconductor, Inc.

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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