MK10DN512ZVMC10

Document Number: K10P121M100SF2 Freescale Semiconductor Rev. 7, 02/2013 Data Sheet: Technical Data K10P121M100SF2 K10 Sub-Family Data Sheet Supports the following: MK10DN512ZVMC10 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Human-machine interface Performance Low-power hardware touch sensor interface (TSI) Up to 100 MHz ARM Cortex-M4 core with DSP General-purpose input/output instructions delivering 1.25 Dhrystone MIPS per Analog modules MHz Two 16-bit SAR ADCs Memories and memory interfaces Programmable gain amplifier (PGA) (up to x64) Up to 512 KB program flash memory on non- integrated into each ADC FlexMemory devices Two 12-bit DACs Up to 256 KB program flash memory on Three analog comparators (CMP) containing a 6-bit FlexMemory devices DAC and programmable reference input Up to 256 KB FlexNVM on FlexMemory devices Voltage reference 4 KB FlexRAM on FlexMemory devices Timers Up to 128 KB RAM Programmable delay block Serial programming interface (EzPort) Eight-channel motor control/general purpose/PWM FlexBus external bus interface timer Clocks Two 2-channel quadrature decoder/general purpose 3 to 32 MHz crystal oscillator timers 32 kHz crystal oscillator Periodic interrupt timers Multi-purpose clock generator 16-bit low-power timer Carrier modulator transmitter System peripherals Real-time clock Multiple low-power modes to provide power optimization based on application requirements Communication interfaces Memory protection unit with multi-master Two Controller Area Network (CAN) modules protection Three SPI modules 16-channel DMA controller, supporting up to 63 Two I2C modules request sources Six UART modules External watchdog monitor Secure Digital host controller (SDHC) Software watchdog I2S module Low-leakage wakeup unit Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.2 Thermal attributes.................................................21 1.1 Determining valid orderable parts......................................3 6 Peripheral operating requirements and behaviors....................22 2 Part identification......................................................................3 6.1 Core modules....................................................................22 2.1 Description.........................................................................3 6.1.1 Debug trace timing specifications.........................22 2.2 Format...............................................................................3 6.1.2 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 3 Terminology and guidelines......................................................4 6.3.1 MCG specifications...............................................25 3.1 Definition: Operating requirement......................................4 6.3.2 Oscillator electrical specifications.........................27 3.2 Definition: Operating behavior...........................................5 6.3.3 32 kHz Oscillator Electrical Characteristics...........30 3.3 Definition: Attribute............................................................5 6.4 Memories and memory interfaces.....................................30 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................30 3.5 Result of exceeding a rating..............................................6 6.4.2 EzPort Switching Specifications............................35 3.6 Relationship between ratings and operating 6.4.3 Flexbus Switching Specifications..........................36 requirements......................................................................6 6.5 Security and integrity modules..........................................39 3.7 Guidelines for ratings and operating requirements............7 6.6 Analog...............................................................................39 3.8 Definition: Typical value.....................................................7 6.6.1 ADC electrical specifications.................................39 3.9 Typical value conditions....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........47 4 Ratings......................................................................................9 6.6.3 12-bit DAC electrical characteristics.....................49 4.1 Thermal handling ratings...................................................9 6.6.4 Voltage reference electrical specifications............52 4.2 Moisture handling ratings..................................................9 6.7 Timers................................................................................53 4.3 ESD handling ratings.........................................................9 6.8 Communication interfaces.................................................53 4.4 Voltage and current operating ratings...............................9 6.8.1 CAN switching specifications................................53 5 General.....................................................................................10 6.8.2 DSPI switching specifications (limited voltage 5.1 AC electrical characteristics..............................................10 range)....................................................................54 5.2 Nonswitching electrical specifications...............................10 6.8.3 DSPI switching specifications (full voltage range).55 5.2.1 Voltage and current operating requirements.........10 6.8.4 Inter-Integrated Circuit Interface (I2C) timing........57 5.2.2 LVD and POR operating requirements.................11 6.8.5 UART switching specifications..............................58 5.2.3 Voltage and current operating behaviors..............12 6.8.6 SDHC specifications.............................................58 5.2.4 Power mode transition operating behaviors..........14 6.8.7 I2S switching specifications..................................59 5.2.5 Power consumption operating behaviors..............15 6.9 Human-machine interfaces (HMI)......................................62 5.2.6 EMC radiated emissions operating behaviors.......18 6.9.1 TSI electrical specifications...................................62 5.2.7 Designing with radiated emissions in mind...........19 7 Dimensions...............................................................................63 5.2.8 Capacitance attributes..........................................19 7.1 Obtaining package dimensions.........................................63 5.3 Switching specifications.....................................................19 8 Pinout........................................................................................63 5.3.1 Device clock specifications...................................19 8.1 K10 Signal Multiplexing and Pin Assignments..................63 5.3.2 General switching specifications...........................19 8.2 K10 Pinouts.......................................................................67 5.4 Thermal specifications.......................................................20 9 Revision History........................................................................68 5.4.1 Thermal operating requirements...........................20 K10 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013. 2 Freescale Semiconductor, Inc.