Document Number: K10P81M100SF2V2 Freescale Semiconductor, Inc. Rev. 4, 09/2017 Data Sheet K10P81M100SF2V2, K10 Sub-Family Data Sheet with Addendum, Supports: MK10DN512VLK10 Revision 4 of the K10 Sub-Family Data Sheet has two parts: The addendum to Revision 3 of the data sheet, immediately after this cover page. Revision 3 of the data sheet, after the addendum. The changes described in the addendum have not been implemented in in Revision 3 of the data sheet. 9 Revision history Table 51. Revision History Rev. No. Date Substantial Changes 49/2017In Thermal specifications / Thermal attributes section, the thermal resistance parameter (junction to case, R ) is now 9C/W (it was previously 8C/W). JC 2017 NXP Semiconductors, All rights reserved.Freescale Semiconductor, Inc. Document Number: K10P81M100SF2V2AD Data Sheet Addendum Rev. 0, 09/2017 Addendum to Rev. 3 of the K10P81M100SF2V2, K10 Sub-Family Data Sheet Supports: MK10DN512VLK10 This addendum identifies changes to Rev. 3 of the K10P81M100SF2V2, K10 Sub-Family Data Sheet. The change described in this addendum has not been implemented in the Rev. 3 data sheet. , the thermal resistance parameter (junction to case, R ) is now 9C/W In the Thermal attributes section JC (it was previously 8C/W). 5.4.2 Thermal attributes Board type Symbol Description 80 LQFP Unit Notes R 9 C/W 4 JC Thermal resistance, junction to case 2017 Freescale Semiconductor, Inc. All rights reserved.