MIMX8MM1DVTLZAA

Document Number: IMX8MMCEC NXP Semiconductors Rev. 1, 07/2020 Data Sheet: Technical Data MIMX8MM6DVTLZAA MIMX8MM5DVTLZAA MIMX8MM5DVTLZCA MIMX8MM5DVTLZDA MIMX8MM4DVTLZAA MIMX8MM3DVTLZAA MIMX8MM2DVTLZAA MIMX8MM1DVTLZAA i.MX 8M Mini Applications Processor Datasheet for Consumer Products Package Information Plastic Package FCBGA 14 x 14 mm, 0.5 mm pitch Ordering Information See Table 2 on page 6 1 i.MX 8M Mini introduction The i.MX 8M Mini applications processor represents 1. i.MX 8M Mini introduction 1 1.1. Block diagram 5 NXPs latest video and audio experience combining 1.2. Ordering information . 6 state-of-the-art media-specific features with 2. Modules list . 8 2.1. Recommended connections for unused input/output 12 high-performance processing while optimized for lowest 3. Electrical characteristics 14 power consumption. 3.1. Chip-level conditions 14 3.2. Power supplies requirements and restrictions . 23 The i.MX 8M Mini family of processors features 3.3. PLL electrical characteristics 26 3.4. On-chip oscillators 27 advanced implementation of a quad Arm Cor- 3.6. I/O AC parameters . 29 tex -A53 core, which operates at speeds of up to 3.5. General purpose I/O (GPIO) DC parameters . 28 3.7. Output buffer impedance parameters . 30 1.8GHz. A general purpose Cortex -M4 400 MHz 3.8. System modules timing 32 3.9. External peripheral interface parameters 33 core processor is for low-power processing. The DRAM 4. Boot mode configuration 68 controller supports 32-bit/16-bit LPDDR4, DDR4, and 4.1. Boot mode configuration pins . 68 4.2. Boot device interface allocation 69 DDR3L memory. A wide range of audio interfaces are 5. Package information and contact assignments . 70 available, including I2S, AC97, TDM, and S/PDIF. 5.1. 14 x 14 mm package information 70 5.2. DDR pin function list 87 There are a number of other interfaces for connecting 6. Revision history . 91 peripherals, such as USB, PCIe, and Ethernet. NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.i.MX 8M Mini introduction Table 1. Features Subsystem Features Arm Cortex-A53 MPCore platform Quad symmetric Cortex-A53 processors 32 KB L1 Instruction Cache 32 KB L1 Data Cache Media Processing Engine (MPE) with NEON technology supporting the Advanced Single Instruction Multiple Data architecture: Floating Point Unit (FPU) with support of the VFPv4-D16 architecture Support of 64-bit Armv8-A architecture 512 KB unified L2 cache Arm Cortex-M4 core platform Low power microcontroller available for customer application: low power standby mode IoT features including Weave Manage IR or Wireless Remote Cortex M4 CPU: 16 KB L1 Instruction Cache 16 KB L1 Data Cache 256 KB tightly coupled memory (TCM) Connectivity One PCI Express (PCIe) Single lane supporting PCIe Gen2 Dual mode operation to function as root complex or endpoint Integrated PHY interface Support L1 low power sub-state Two USB 2.0 OTG controllers with integrated PHY interfaces: Spread spectrum clock support Three Ultra Secure Digital Host Controller (uSDHC) interfaces: MMC 5.1 compliance with HS400 DDR signaling to support up to 400 MB/sec SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100 MB/sec Support for SDXC (extended capacity) One Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE), Ethernet AVB, and IEEE 1588 Four Universal Asynchronous Receiver/Transmitter (UART) modules 2 Four I C modules Three ECSPI modules On-chip memory Boot ROM (256 KB) On-chip RAM (256 KB + 32 KB) GPIO and pin multiplexing General-purpose input/output (GPIO) modules with interrupt capability Input/output multiplexing controller (IOMUXC) to provide centralized pad control Power management Temperature sensor with programmable trip points Flexible power domain partitioning with internal power switches to support efficient power management i.MX 8M Mini Applications Processor Datasheet for Consumer Products, Rev. 1, 07/2020 2 NXP Semiconductors