Product Information

MCIMX6G3CVK05AB

Product Image X-ON

Datasheet
Processors - Application Specialized i.MX 32-bit MPU, ARM Cortex-A7 core, 500MHz, 272BGA
Manufacturer: NXP



Price (Ex GST)

From 22.1211

232 - Global Stock
Ships to you between
Thu. 22 Apr to Mon. 26 Apr

MOQ: 1 Multiples:1
Pack Size :   1
Availability Price Quantity
232 - Global Stock


Ships to you between Thu. 22 Apr to Mon. 26 Apr

MOQ : 1
Multiples : 1
1 : $ 23.4375
10 : $ 22.1211

Buy
   
Manufacturer
NXP
Product Category
Processors - Application Specialized
RoHS - XON
Y Icon ROHS
Core
Arm Cortex A7
Data Bus Width
32 bit
Maximum Clock Frequency
528 Mhz
Data RAM Size
128 Kb
Data ROM Size
96 Kb
Operating Supply Voltage
1.15 v to 1.3 V
Maximum Operating Temperature
+105 C
Mounting Style
Smd/Smt
Package / Case
LFBGA-272
Application
Industrial Applications
Memory Type
Ddr3, Ddr3l, Emmc, Flash, Lpddr2
Series
I.Mx 6Ultralite
Brand
Nxp / Freescale
Interface Type
Can, I2c, Spi, Uart
L1 Cache Data Memory
32 Kb
L1 Cache Instruction Memory
32 Kb
L2 Cache Instruction / Data Memory
128 Kb
Minimum Operating Temperature
- 40 C
Number Of Cores
1 Core
Processor Series
I.Mx 6Ultralite
Product Type
Processors - Application Specialized
Factory Pack Quantity :
260
Subcategory
Processors - Application Specialized
Tradename
I.Mx
Watchdog Timers
Watchdog Timer
Cnhts
8542319000
Hts Code
8542310001
Mxhts
85423102
LoadingGif
Image
Mfr. Part No.
Description
Stock
NXP Freescale Processors - Application Specialized
14
Processors - Application Specialized i.MX 32-bit MPU, ARM Cortex-A7 core, 500MHz, 289BGA
3008
SOC i.MX 6SoloLite ARM Cortex A9 0.04um 432-Pin MAP-BGA Tray
52
Processors - Application Specialized i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 1GHz, MAPBGA 432
10
Image
Mfr. Part No.
Description
Stock
Processors - Application Specialized i.MX 7 series 32-bit MPU, Dual ARM Cortex-A7 core, 1.2GHz, MAPBGA 541
68

Document Number: IMX6ULIEC NXP Semiconductors Rev. 2.2, 05/2017 Data Sheet: Technical Data MCIMX6G1CVM05AA MCIMX6G1CVM05AB MCIMX6G2CVM05AA MCIMX6G2CVM05AB MCIMX6G3CVM05AA MCIMX6G3CVM05AB MCIMX6G2CVK05AA MCIMX6G2CVK05AB MCIMX6G3CVK05AA MCIMX6G3CVK05AB i.MX 6UltraLite Applications Processors for Industrial Products Package Information Plastic Package BGA 14 x 14 mm, 0.8 mm pitch BGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1. i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1 i.MX 6UltraLite introduction 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 The i.MX 6UltraLite is a high performance, ultra 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 efficient processor family featuring NXP?s advanced 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ? implementation of the single ARM Cortex -A7 core, 3.1. Special signal considerations . . . . . . . . . . . . . . . 17 3.2. Recommended connections for unused analog which operates at speeds up to 528 MHz. The i.MX interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6UltraLite includes an integrated power management 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 module that reduces the complexity of the external 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20 4.2. Power supplies requirements and restrictions . . . 28 power supply and simplifies the power sequencing. Each 4.3. Integrated LDO voltage regulator parameters . . . 29 processor in this family provides various memory 4.4. PLL?s electrical characteristics . . . . . . . . . . . . . . . 31 4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32 interfaces, including LPDDR2, DDR3, DDR3L, Raw 4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33 and Managed NAND flash, NOR flash, eMMC, Quad 4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 SPI, and a wide range of other interfaces for connecting 4.8. Output buffer impedance parameters . . . . . . . . . 40 4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43 peripherals, such as WLAN, Bluetooth?, GPS, 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53 displays, and camera sensors. 4.11. General-Purpose Media Interface (GPMI) timing 54 4.12. External peripheral interface parameters . . . . . . 62 The i.MX 6UltraLite is specifically useful for 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95 applications such as: 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95 ? Electronics Point-of-Sale device 5.2. Boot device interface allocation . . . . . . . . . . . . . . 96 6. Package information and contact assignments . . . . . . 103 ? Telematics 6.1. 14x14 mm package information . . . . . . . . . . . . 103 6.2. 9x9 mm package information . . . . . . . . . . . . . . 116 6.3. GPIO reset behaviors during reset . . . . . . . . . . 129 ? 2016-2017 NXP B.V.Document Number: IMX6ULIEC NXP Semiconductors Rev. 2.2, 05/2017 Data Sheet: Technical Data MCIMX6G1CVM05AA MCIMX6G1CVM05AB MCIMX6G2CVM05AA MCIMX6G2CVM05AB MCIMX6G3CVM05AA MCIMX6G3CVM05AB MCIMX6G2CVK05AA MCIMX6G2CVK05AB MCIMX6G3CVK05AA MCIMX6G3CVK05AB i.MX 6UltraLite Applications Processors for Industrial Products Package Information Plastic Package BGA 14 x 14 mm, 0.8 mm pitch BGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1. i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1 i.MX 6UltraLite introduction 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 The i.MX 6UltraLite is a high performance, ultra 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 efficient processor family featuring NXP?s advanced 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ? implementation of the single ARM Cortex -A7 core, 3.1. Special signal considerations . . . . . . . . . . . . . . . 17 3.2. Recommended connections for unused analog which operates at speeds up to 528 MHz. The i.MX interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6UltraLite includes an integrated power management 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 module that reduces the complexity of the external 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20 4.2. Power supplies requirements and restrictions . . . 28 power supply and simplifies the power sequencing. Each 4.3. Integrated LDO voltage regulator parameters . . . 29 processor in this family provides various memory 4.4. PLL?s electrical characteristics . . . . . . . . . . . . . . . 31 4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32 interfaces, including LPDDR2, DDR3, DDR3L, Raw 4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33 and Managed NAND flash, NOR flash, eMMC, Quad 4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 SPI, and a wide range of other interfaces for connecting 4.8. Output buffer impedance parameters . . . . . . . . . 40 4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43 peripherals, such as WLAN, Bluetooth?, GPS, 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53 displays, and camera sensors. 4.11. General-Purpose Media Interface (GPMI) timing 54 4.12. External peripheral interface parameters . . . . . . 62 The i.MX 6UltraLite is specifically useful for 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95 applications such as: 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95 ? Electronics Point-of-Sale device 5.2. Boot device interface allocation . . . . . . . . . . . . . . 96 6. Package information and contact assignments . . . . . . 103 ? Telematics 6.1. 14x14 mm package information . . . . . . . . . . . . 103 6.2. 9x9 mm package information . . . . . . . . . . . . . . 116 6.3. GPIO reset behaviors during reset . . . . . . . . . . 129 ? 2016-2017 NXP B.V.i.MX 6UltraLite introduction ? IoT Gateway ? Access control panels ? Human Machine Interfaces (HMI) ? Smart appliances 1 The features of the i.MX 6UltraLite processor include : ? Single-core ARM Cortex-A7?The single core A7 provides a cost-effective and power-efficient solution. ? Multilevel memory system?The multilevel memory system of each device is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The device supports many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including eMMC up to rev 4.4/4.41/4.5. ? Smart speed technology?Power management implemented throughout the IC that enables multimedia features and peripherals to consume minimum power in both active and various low power modes. ? Dynamic voltage and frequency scaling?The processor improves the power efficiency by scaling the voltage and frequency to optimize performance. ? Multimedia powerhouse?Multimedia performance is enhanced by a multilevel cache system, NEON? MPE (Media Processor Engine) co-processor, a programmable smart DMA (SDMA) controller, an asynchronous audio sample rate converter, and a Pixel processing pipeline (PXP) to support 2D image processing, including color-space conversion, scaling, alpha-blending, and rotation. ? Ethernet interfaces?10/100 Mbps Ethernet controllers. ? Human-machine interface?Support one digital parallel display interface. ? Interface flexibility?Each processor supports connections to a variety of interfaces: High-speed USB on-the-go with PHY, multiple expansion card port (high-speed MMC/SDIO host and other), 12-bit ADC module, CAN port, smart card interface compatible with EMV Standard v4.3, and a 2 2 variety of other popular interfaces (such as UART, I C, and I S serial audio). ? Advanced security?The processor deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6UltraLite Security Reference Manual (IMX6ULSRM). ? Integrated power management?The processor integrates linear regulators and internally generate voltage levels for different domains. This significantly simplifies system power management structure. For a comprehensive list of the i.MX 6UltraLite features, see Section 1.2, ?Features"?. 1. The actual feature set depends on the part numbers as described in the Table 1 and Table 2. i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017 2 NXP SemiconductorsDocument Number: IMX6ULIEC NXP Semiconductors Rev. 2.2, 05/2017 Data Sheet: Technical Data MCIMX6G1CVM05AA MCIMX6G1CVM05AB MCIMX6G2CVM05AA MCIMX6G2CVM05AB MCIMX6G3CVM05AA MCIMX6G3CVM05AB MCIMX6G2CVK05AA MCIMX6G2CVK05AB MCIMX6G3CVK05AA MCIMX6G3CVK05AB i.MX 6UltraLite Applications Processors for Industrial Products Package Information Plastic Package BGA 14 x 14 mm, 0.8 mm pitch BGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1. i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1 i.MX 6UltraLite introduction 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 The i.MX 6UltraLite is a high performance, ultra 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 efficient processor family featuring NXP?s advanced 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ? implementation of the single ARM Cortex -A7 core, 3.1. Special signal considerations . . . . . . . . . . . . . . . 17 3.2. Recommended connections for unused analog which operates at speeds up to 528 MHz. The i.MX interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6UltraLite includes an integrated power management 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 module that reduces the complexity of the external 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20 4.2. Power supplies requirements and restrictions . . . 28 power supply and simplifies the power sequencing. Each 4.3. Integrated LDO voltage regulator parameters . . . 29 processor in this family provides various memory 4.4. PLL?s electrical characteristics . . . . . . . . . . . . . . . 31 4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32 interfaces, including LPDDR2, DDR3, DDR3L, Raw 4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33 and Managed NAND flash, NOR flash, eMMC, Quad 4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 SPI, and a wide range of other interfaces for connecting 4.8. Output buffer impedance parameters . . . . . . . . . 40 4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43 peripherals, such as WLAN, Bluetooth?, GPS, 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53 displays, and camera sensors. 4.11. General-Purpose Media Interface (GPMI) timing 54 4.12. External peripheral interface parameters . . . . . . 62 The i.MX 6UltraLite is specifically useful for 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95 applications such as: 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95 ? Electronics Point-of-Sale device 5.2. Boot device interface allocation . . . . . . . . . . . . . . 96 6. Package information and contact assignments . . . . . . 103 ? Telematics 6.1. 14x14 mm package information . . . . . . . . . . . . 103 6.2. 9x9 mm package information . . . . . . . . . . . . . . 116 6.3. GPIO reset behaviors during reset . . . . . . . . . . 129 ? 2016-2017 NXP B.V.Document Number: IMX6ULIEC NXP Semiconductors Rev. 2.2, 05/2017 Data Sheet: Technical Data MCIMX6G1CVM05AA MCIMX6G1CVM05AB MCIMX6G2CVM05AA MCIMX6G2CVM05AB MCIMX6G3CVM05AA MCIMX6G3CVM05AB MCIMX6G2CVK05AA MCIMX6G2CVK05AB MCIMX6G3CVK05AA MCIMX6G3CVK05AB i.MX 6UltraLite Applications Processors for Industrial Products Package Information Plastic Package BGA 14 x 14 mm, 0.8 mm pitch BGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1. i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1 i.MX 6UltraLite introduction 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 The i.MX 6UltraLite is a high performance, ultra 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 efficient processor family featuring NXP?s advanced 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ? implementation of the single ARM Cortex -A7 core, 3.1. Special signal considerations . . . . . . . . . . . . . . . 17 3.2. Recommended connections for unused analog which operates at speeds up to 528 MHz. The i.MX interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6UltraLite includes an integrated power management 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 module that reduces the complexity of the external 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20 4.2. Power supplies requirements and restrictions . . . 28 power supply and simplifies the power sequencing. Each 4.3. Integrated LDO voltage regulator parameters . . . 29 processor in this family provides various memory 4.4. PLL?s electrical characteristics . . . . . . . . . . . . . . . 31 4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32 interfaces, including LPDDR2, DDR3, DDR3L, Raw 4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33 and Managed NAND flash, NOR flash, eMMC, Quad 4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 SPI, and a wide range of other interfaces for connecting 4.8. Output buffer impedance parameters . . . . . . . . . 40 4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43 peripherals, such as WLAN, Bluetooth?, GPS, 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53 displays, and camera sensors. 4.11. General-Purpose Media Interface (GPMI) timing 54 4.12. External peripheral interface parameters . . . . . . 62 The i.MX 6UltraLite is specifically useful for 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95 applications such as: 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95 ? Electronics Point-of-Sale device 5.2. Boot device interface allocation . . . . . . . . . . . . . . 96 6. Package information and contact assignments . . . . . . 103 ? Telematics 6.1. 14x14 mm package information . . . . . . . . . . . . 103 6.2. 9x9 mm package information . . . . . . . . . . . . . . 116 6.3. GPIO reset behaviors during reset . . . . . . . . . . 129 ? 2016-2017 NXP B.V.i.MX 6UltraLite introduction ? IoT Gateway ? Access control panels ? Human Machine Interfaces (HMI) ? Smart appliances 1 The features of the i.MX 6UltraLite processor include : ? Single-core ARM Cortex-A7?The single core A7 provides a cost-effective and power-efficient solution. ? Multilevel memory system?The multilevel memory system of each device is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The device supports many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including eMMC up to rev 4.4/4.41/4.5. ? Smart speed technology?Power management implemented throughout the IC that enables multimedia features and peripherals to consume minimum power in both active and various low power modes. ? Dynamic voltage and frequency scaling?The processor improves the power efficiency by scaling the voltage and frequency to optimize performance. ? Multimedia powerhouse?Multimedia performance is enhanced by a multilevel cache system, NEON? MPE (Media Processor Engine) co-processor, a programmable smart DMA (SDMA) controller, an asynchronous audio sample rate converter, and a Pixel processing pipeline (PXP) to support 2D image processing, including color-space conversion, scaling, alpha-blending, and rotation. ? Ethernet interfaces?10/100 Mbps Ethernet controllers. ? Human-machine interface?Support one digital parallel display interface. ? Interface flexibility?Each processor supports connections to a variety of interfaces: High-speed USB on-the-go with PHY, multiple expansion card port (high-speed MMC/SDIO host and other), 12-bit ADC module, CAN port, smart card interface compatible with EMV Standard v4.3, and a 2 2 variety of other popular interfaces (such as UART, I C, and I S serial audio). ? Advanced security?The processor deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6UltraLite Security Reference Manual (IMX6ULSRM). ? Integrated power management?The processor integrates linear regulators and internally generate voltage levels for different domains. This significantly simplifies system power management structure. For a comprehensive list of the i.MX 6UltraLite features, see Section 1.2, ?Features"?. 1. The actual feature set depends on the part numbers as described in the Table 1 and Table 2. i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017 2 NXP Semiconductorsi.MX 6UltraLite introduction 1.1 Ordering information Table 1 provides examples of orderable part numbers covered by this data sheet. Table 1. Ordering Information Junction Part Number Feature Package Temperature T j ( ?C) MCIMX6G1CVM05AA Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G1CVM05AB Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G2CVM05AA Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G2CVM05AB Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G3CVM05AA Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G3CVM05AB Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G2CVK05AA Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA -40 to +105 MCIMX6G2CVK05AB Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA -40 to +105 MCIMX6G3CVK05AA Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA -40 to +105 MCIMX6G3CVK05AB Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA -40 to +105 Figure 1 describes the part number nomenclature so that characteristics of a specific part number can be identified (for example, cores, frequency, temperature grade, fuse options, and silicon revision). The primary characteristic which describes which data sheet applies to a specific part is the temperature grade (junction) field. ? The i.MX 6UltraLite Applications Processors for Industrial Products Data Sheet (IMX6ULIEC) covers parts listed with a ?C (Industrial temp)? Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field and matching it to the proper data sheet. If there are any questions, visit the web page nxp.com/imx6series or contact an NXP representative for details. i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017 NXP Semiconductors 3Document Number: IMX6ULIEC NXP Semiconductors Rev. 2.2, 05/2017 Data Sheet: Technical Data MCIMX6G1CVM05AA MCIMX6G1CVM05AB MCIMX6G2CVM05AA MCIMX6G2CVM05AB MCIMX6G3CVM05AA MCIMX6G3CVM05AB MCIMX6G2CVK05AA MCIMX6G2CVK05AB MCIMX6G3CVK05AA MCIMX6G3CVK05AB i.MX 6UltraLite Applications Processors for Industrial Products Package Information Plastic Package BGA 14 x 14 mm, 0.8 mm pitch BGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1. i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1 i.MX 6UltraLite introduction 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 The i.MX 6UltraLite is a high performance, ultra 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 efficient processor family featuring NXP?s advanced 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ? implementation of the single ARM Cortex -A7 core, 3.1. Special signal considerations . . . . . . . . . . . . . . . 17 3.2. Recommended connections for unused analog which operates at speeds up to 528 MHz. The i.MX interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6UltraLite includes an integrated power management 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 module that reduces the complexity of the external 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20 4.2. Power supplies requirements and restrictions . . . 28 power supply and simplifies the power sequencing. Each 4.3. Integrated LDO voltage regulator parameters . . . 29 processor in this family provides various memory 4.4. PLL?s electrical characteristics . . . . . . . . . . . . . . . 31 4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32 interfaces, including LPDDR2, DDR3, DDR3L, Raw 4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33 and Managed NAND flash, NOR flash, eMMC, Quad 4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 SPI, and a wide range of other interfaces for connecting 4.8. Output buffer impedance parameters . . . . . . . . . 40 4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43 peripherals, such as WLAN, Bluetooth?, GPS, 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53 displays, and camera sensors. 4.11. General-Purpose Media Interface (GPMI) timing 54 4.12. External peripheral interface parameters . . . . . . 62 The i.MX 6UltraLite is specifically useful for 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95 applications such as: 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95 ? Electronics Point-of-Sale device 5.2. Boot device interface allocation . . . . . . . . . . . . . . 96 6. Package information and contact assignments . . . . . . 103 ? Telematics 6.1. 14x14 mm package information . . . . . . . . . . . . 103 6.2. 9x9 mm package information . . . . . . . . . . . . . . 116 6.3. GPIO reset behaviors during reset . . . . . . . . . . 129 ? 2016-2017 NXP B.V.Document Number: IMX6ULIEC NXP Semiconductors Rev. 2.2, 05/2017 Data Sheet: Technical Data MCIMX6G1CVM05AA MCIMX6G1CVM05AB MCIMX6G2CVM05AA MCIMX6G2CVM05AB MCIMX6G3CVM05AA MCIMX6G3CVM05AB MCIMX6G2CVK05AA MCIMX6G2CVK05AB MCIMX6G3CVK05AA MCIMX6G3CVK05AB i.MX 6UltraLite Applications Processors for Industrial Products Package Information Plastic Package BGA 14 x 14 mm, 0.8 mm pitch BGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1. i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1 i.MX 6UltraLite introduction 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 The i.MX 6UltraLite is a high performance, ultra 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 efficient processor family featuring NXP?s advanced 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ? implementation of the single ARM Cortex -A7 core, 3.1. Special signal considerations . . . . . . . . . . . . . . . 17 3.2. Recommended connections for unused analog which operates at speeds up to 528 MHz. The i.MX interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6UltraLite includes an integrated power management 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 module that reduces the complexity of the external 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20 4.2. Power supplies requirements and restrictions . . . 28 power supply and simplifies the power sequencing. Each 4.3. Integrated LDO voltage regulator parameters . . . 29 processor in this family provides various memory 4.4. PLL?s electrical characteristics . . . . . . . . . . . . . . . 31 4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32 interfaces, including LPDDR2, DDR3, DDR3L, Raw 4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33 and Managed NAND flash, NOR flash, eMMC, Quad 4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 SPI, and a wide range of other interfaces for connecting 4.8. Output buffer impedance parameters . . . . . . . . . 40 4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43 peripherals, such as WLAN, Bluetooth?, GPS, 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53 displays, and camera sensors. 4.11. General-Purpose Media Interface (GPMI) timing 54 4.12. External peripheral interface parameters . . . . . . 62 The i.MX 6UltraLite is specifically useful for 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95 applications such as: 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95 ? Electronics Point-of-Sale device 5.2. Boot device interface allocation . . . . . . . . . . . . . . 96 6. Package information and contact assignments . . . . . . 103 ? Telematics 6.1. 14x14 mm package information . . . . . . . . . . . . 103 6.2. 9x9 mm package information . . . . . . . . . . . . . . 116 6.3. GPIO reset behaviors during reset . . . . . . . . . . 129 ? 2016-2017 NXP B.V.i.MX 6UltraLite introduction ? IoT Gateway ? Access control panels ? Human Machine Interfaces (HMI) ? Smart appliances 1 The features of the i.MX 6UltraLite processor include : ? Single-core ARM Cortex-A7?The single core A7 provides a cost-effective and power-efficient solution. ? Multilevel memory system?The multilevel memory system of each device is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The device supports many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including eMMC up to rev 4.4/4.41/4.5. ? Smart speed technology?Power management implemented throughout the IC that enables multimedia features and peripherals to consume minimum power in both active and various low power modes. ? Dynamic voltage and frequency scaling?The processor improves the power efficiency by scaling the voltage and frequency to optimize performance. ? Multimedia powerhouse?Multimedia performance is enhanced by a multilevel cache system, NEON? MPE (Media Processor Engine) co-processor, a programmable smart DMA (SDMA) controller, an asynchronous audio sample rate converter, and a Pixel processing pipeline (PXP) to support 2D image processing, including color-space conversion, scaling, alpha-blending, and rotation. ? Ethernet interfaces?10/100 Mbps Ethernet controllers. ? Human-machine interface?Support one digital parallel display interface. ? Interface flexibility?Each processor supports connections to a variety of interfaces: High-speed USB on-the-go with PHY, multiple expansion card port (high-speed MMC/SDIO host and other), 12-bit ADC module, CAN port, smart card interface compatible with EMV Standard v4.3, and a 2 2 variety of other popular interfaces (such as UART, I C, and I S serial audio). ? Advanced security?The processor deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6UltraLite Security Reference Manual (IMX6ULSRM). ? Integrated power management?The processor integrates linear regulators and internally generate voltage levels for different domains. This significantly simplifies system power management structure. For a comprehensive list of the i.MX 6UltraLite features, see Section 1.2, ?Features"?. 1. The actual feature set depends on the part numbers as described in the Table 1 and Table 2. i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017 2 NXP SemiconductorsDocument Number: IMX6ULIEC NXP Semiconductors Rev. 2.2, 05/2017 Data Sheet: Technical Data MCIMX6G1CVM05AA MCIMX6G1CVM05AB MCIMX6G2CVM05AA MCIMX6G2CVM05AB MCIMX6G3CVM05AA MCIMX6G3CVM05AB MCIMX6G2CVK05AA MCIMX6G2CVK05AB MCIMX6G3CVK05AA MCIMX6G3CVK05AB i.MX 6UltraLite Applications Processors for Industrial Products Package Information Plastic Package BGA 14 x 14 mm, 0.8 mm pitch BGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1. i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1 i.MX 6UltraLite introduction 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 The i.MX 6UltraLite is a high performance, ultra 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 efficient processor family featuring NXP?s advanced 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ? implementation of the single ARM Cortex -A7 core, 3.1. Special signal considerations . . . . . . . . . . . . . . . 17 3.2. Recommended connections for unused analog which operates at speeds up to 528 MHz. The i.MX interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6UltraLite includes an integrated power management 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 module that reduces the complexity of the external 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20 4.2. Power supplies requirements and restrictions . . . 28 power supply and simplifies the power sequencing. Each 4.3. Integrated LDO voltage regulator parameters . . . 29 processor in this family provides various memory 4.4. PLL?s electrical characteristics . . . . . . . . . . . . . . . 31 4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32 interfaces, including LPDDR2, DDR3, DDR3L, Raw 4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33 and Managed NAND flash, NOR flash, eMMC, Quad 4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 SPI, and a wide range of other interfaces for connecting 4.8. Output buffer impedance parameters . . . . . . . . . 40 4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43 peripherals, such as WLAN, Bluetooth?, GPS, 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53 displays, and camera sensors. 4.11. General-Purpose Media Interface (GPMI) timing 54 4.12. External peripheral interface parameters . . . . . . 62 The i.MX 6UltraLite is specifically useful for 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95 applications such as: 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95 ? Electronics Point-of-Sale device 5.2. Boot device interface allocation . . . . . . . . . . . . . . 96 6. Package information and contact assignments . . . . . . 103 ? Telematics 6.1. 14x14 mm package information . . . . . . . . . . . . 103 6.2. 9x9 mm package information . . . . . . . . . . . . . . 116 6.3. GPIO reset behaviors during reset . . . . . . . . . . 129 ? 2016-2017 NXP B.V.Document Number: IMX6ULIEC NXP Semiconductors Rev. 2.2, 05/2017 Data Sheet: Technical Data MCIMX6G1CVM05AA MCIMX6G1CVM05AB MCIMX6G2CVM05AA MCIMX6G2CVM05AB MCIMX6G3CVM05AA MCIMX6G3CVM05AB MCIMX6G2CVK05AA MCIMX6G2CVK05AB MCIMX6G3CVK05AA MCIMX6G3CVK05AB i.MX 6UltraLite Applications Processors for Industrial Products Package Information Plastic Package BGA 14 x 14 mm, 0.8 mm pitch BGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1. i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1 1 i.MX 6UltraLite introduction 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 The i.MX 6UltraLite is a high performance, ultra 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 efficient processor family featuring NXP?s advanced 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ? implementation of the single ARM Cortex -A7 core, 3.1. Special signal considerations . . . . . . . . . . . . . . . 17 3.2. Recommended connections for unused analog which operates at speeds up to 528 MHz. The i.MX interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6UltraLite includes an integrated power management 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20 module that reduces the complexity of the external 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20 4.2. Power supplies requirements and restrictions . . . 28 power supply and simplifies the power sequencing. Each 4.3. Integrated LDO voltage regulator parameters . . . 29 processor in this family provides various memory 4.4. PLL?s electrical characteristics . . . . . . . . . . . . . . . 31 4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32 interfaces, including LPDDR2, DDR3, DDR3L, Raw 4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33 and Managed NAND flash, NOR flash, eMMC, Quad 4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 SPI, and a wide range of other interfaces for connecting 4.8. Output buffer impedance parameters . . . . . . . . . 40 4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43 peripherals, such as WLAN, Bluetooth?, GPS, 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53 displays, and camera sensors. 4.11. General-Purpose Media Interface (GPMI) timing 54 4.12. External peripheral interface parameters . . . . . . 62 The i.MX 6UltraLite is specifically useful for 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95 applications such as: 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95 ? Electronics Point-of-Sale device 5.2. Boot device interface allocation . . . . . . . . . . . . . . 96 6. Package information and contact assignments . . . . . . 103 ? Telematics 6.1. 14x14 mm package information . . . . . . . . . . . . 103 6.2. 9x9 mm package information . . . . . . . . . . . . . . 116 6.3. GPIO reset behaviors during reset . . . . . . . . . . 129 ? 2016-2017 NXP B.V.i.MX 6UltraLite introduction ? IoT Gateway ? Access control panels ? Human Machine Interfaces (HMI) ? Smart appliances 1 The features of the i.MX 6UltraLite processor include : ? Single-core ARM Cortex-A7?The single core A7 provides a cost-effective and power-efficient solution. ? Multilevel memory system?The multilevel memory system of each device is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The device supports many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including eMMC up to rev 4.4/4.41/4.5. ? Smart speed technology?Power management implemented throughout the IC that enables multimedia features and peripherals to consume minimum power in both active and various low power modes. ? Dynamic voltage and frequency scaling?The processor improves the power efficiency by scaling the voltage and frequency to optimize performance. ? Multimedia powerhouse?Multimedia performance is enhanced by a multilevel cache system, NEON? MPE (Media Processor Engine) co-processor, a programmable smart DMA (SDMA) controller, an asynchronous audio sample rate converter, and a Pixel processing pipeline (PXP) to support 2D image processing, including color-space conversion, scaling, alpha-blending, and rotation. ? Ethernet interfaces?10/100 Mbps Ethernet controllers. ? Human-machine interface?Support one digital parallel display interface. ? Interface flexibility?Each processor supports connections to a variety of interfaces: High-speed USB on-the-go with PHY, multiple expansion card port (high-speed MMC/SDIO host and other), 12-bit ADC module, CAN port, smart card interface compatible with EMV Standard v4.3, and a 2 2 variety of other popular interfaces (such as UART, I C, and I S serial audio). ? Advanced security?The processor deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6UltraLite Security Reference Manual (IMX6ULSRM). ? Integrated power management?The processor integrates linear regulators and internally generate voltage levels for different domains. This significantly simplifies system power management structure. For a comprehensive list of the i.MX 6UltraLite features, see Section 1.2, ?Features"?. 1. The actual feature set depends on the part numbers as described in the Table 1 and Table 2. i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017 2 NXP Semiconductorsi.MX 6UltraLite introduction 1.1 Ordering information Table 1 provides examples of orderable part numbers covered by this data sheet. Table 1. Ordering Information Junction Part Number Feature Package Temperature T j ( ?C) MCIMX6G1CVM05AA Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G1CVM05AB Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G2CVM05AA Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G2CVM05AB Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G3CVM05AA Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G3CVM05AB Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA -40 to +105 MCIMX6G2CVK05AA Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA -40 to +105 MCIMX6G2CVK05AB Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA -40 to +105 MCIMX6G3CVK05AA Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA -40 to +105 MCIMX6G3CVK05AB Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA -40 to +105 Figure 1 describes the part number nomenclature so that characteristics of a specific part number can be identified (for example, cores, frequency, temperature grade, fuse options, and silicon revision). The primary characteristic which describes which data sheet applies to a specific part is the temperature grade (junction) field. ? The i.MX 6UltraLite Applications Processors for Industrial Products Data Sheet (IMX6ULIEC) covers parts listed with a ?C (Industrial temp)? Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field and matching it to the proper data sheet. If there are any questions, visit the web page nxp.com/imx6series or contact an NXP representative for details. i.MX 6UltraLite Applications Processors for Industrial Products, Rev. 2.2, 05/2017 NXP Semiconductors 3

Tariff Concession Code
Tariff Desc

Free
8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
Freescale Semiconductor - NXP
Nexperia
NEXPERIA USA INC
Nexperia USA Inc.
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI