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MCIMX6DP7CVT8AB

Product Image X-ON

Processors - Application Specialized MCIMX6DP7CVT8AB/FBGA624///TRAY MULTIPLE DP BAKEABL
Manufacturer: NXP


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Manufacturer
NXP
Product Category
Processors - Application Specialized
RoHS - XON
Y Icon ROHS
Core
Arm Cortex A9
Data Bus Width
32 bit
Maximum Clock Frequency
800 Mhz
Data RAM Size
512 Kb
Data ROM Size
96 Kb
Operating Supply Voltage
0.9 v to 1.3 V
Maximum Operating Temperature
+105 C
Mounting Style
Smd/Smt
Package / Case
FCPBGA-624
Application
Automotive Applications
Memory Type
Ddr3, Ddr3l, Plddr2
Packaging
Tray
Series
I.Mx 6Dualplus/6Quadplus
Brand
Nxp Semiconductors
Interface Type
Can, I2c, Spi, Uart
Cnhts
8542319000
Hts Code
8542310001
I/O Voltage
1.2 v , 1.35 v , 1.5 v
Instruction Type
Floating Point
L1 Cache Data Memory
32 Kb
L1 Cache Instruction Memory
32 Kb
L2 Cache Instruction / Data Memory
1 Mb
Minimum Operating Temperature
- 40 C
Number Of Cores
2 Core
Processor Series
I.Mx 6Dualplus
Product Type
Processors - Application Specialized
Factory Pack Quantity :
60
Subcategory
Processors - Application Specialized
Tradename
I.Mx
Watchdog Timers
Watchdog Timer
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Document Number: IMX6DQPCEC NXP Semiconductors Rev. 3, 11/2018 Data Sheet: Technical Data MCIMX6QP5Exx1AA MCIMX6QP5Exx1AB MCIMX6DP5Exx1AA MCIMX6DP5Exx1AB MCIMX6QP5Exx2AA MCIMX6QP5Exx2AB MCIMX6DP5Exx2AA MCIMX6DP5Exx2AB i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 Introduction 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 The i.MX 6DualPlus/6QuadPlus processors offer the 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 highest levels of graphics processing performance in the 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 i.MX 6 series family and are ideally suited for graphics 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 intensive applications. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 The i.MX 6DualPlus/6QuadPlus processors feature 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 advanced implementation of the quad 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 ? ? Arm Cortex -A9 core, which operates at speeds up to 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 1.2 GHz. They include updated versions of the 2D and 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 3D graphics processors, 1080p video processing, and 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 integrated power management. Each processor provides 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 a 64-bit DDR3/DDR3L/LPDDR2 memory interface and 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 a number of other interfaces for connecting peripherals, 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 ? 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 such as WLAN, Bluetooth , GPS, hard drive, displays, 4.11 General-Purpose Media Interface (GPMI) Timing. 64 and camera sensors. 4.12 External Peripheral Interface Parameters . . . . . . . 73 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 The i.MX 6DualPlus/6QuadPlus processors are 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 specifically useful for applications such as the 6 Package Information and Contact Assignments . . . . . . 141 following: 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141 ? Graphics rendering for Human Machine 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Interfaces (HMI) ? Video processing and display NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Document Number: IMX6DQPCEC NXP Semiconductors Rev. 3, 11/2018 Data Sheet: Technical Data MCIMX6QP5Exx1AA MCIMX6QP5Exx1AB MCIMX6DP5Exx1AA MCIMX6DP5Exx1AB MCIMX6QP5Exx2AA MCIMX6QP5Exx2AB MCIMX6DP5Exx2AA MCIMX6DP5Exx2AB i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 Introduction 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 The i.MX 6DualPlus/6QuadPlus processors offer the 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 highest levels of graphics processing performance in the 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 i.MX 6 series family and are ideally suited for graphics 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 intensive applications. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 The i.MX 6DualPlus/6QuadPlus processors feature 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 advanced implementation of the quad 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 ? ? Arm Cortex -A9 core, which operates at speeds up to 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 1.2 GHz. They include updated versions of the 2D and 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 3D graphics processors, 1080p video processing, and 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 integrated power management. Each processor provides 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 a 64-bit DDR3/DDR3L/LPDDR2 memory interface and 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 a number of other interfaces for connecting peripherals, 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 ? 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 such as WLAN, Bluetooth , GPS, hard drive, displays, 4.11 General-Purpose Media Interface (GPMI) Timing. 64 and camera sensors. 4.12 External Peripheral Interface Parameters . . . . . . . 73 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 The i.MX 6DualPlus/6QuadPlus processors are 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 specifically useful for applications such as the 6 Package Information and Contact Assignments . . . . . . 141 following: 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141 ? Graphics rendering for Human Machine 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Interfaces (HMI) ? Video processing and display NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Introduction ? Netbooks (web tablets) ? Nettops (Internet desktop devices) ? High-end mobile Internet devices (MID) ? High-end PDAs ? High-end portable media players (PMP) with HD video capability ? Gaming consoles ? Portable navigation devices (PND) The i.MX 6DualPlus/6QuadPlus processors offers numerous advanced features, such as: ? Applications processors?The processors enhance the capabilities of high-tier portable applications by fulfilling the ever increasing MIPS needs of operating systems and games. The Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as audio decode. ? Multilevel memory system?The multilevel memory system of each processor is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The processors support many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND?, and managed NAND, including eMMC up to rev 4.4/4.41. ? Smart speed technology?The processors have power management throughout the device that enables the rich suite of multimedia features and peripherals to consume minimum power in both active and various low power modes. Smart speed technology enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations. ? Dynamic voltage and frequency scaling?The processors improve the power efficiency of devices by scaling the voltage and frequency to optimize performance. ? Multimedia powerhouse?The multimedia performance of each processor is enhanced by a ? multilevel cache system, Neon MPE (Media Processor Engine) co-processor, a multi-standard hardware video codec, 2 autonomous and independent image processing units (IPU), and a programmable smart DMA (SDMA) controller. ? Powerful graphics acceleration?Each processor provides three independent, integrated graphics ? processing units: an OpenGL ES 3.0 3D graphics accelerator with four shaders (up to 198 MTri/s and OpenCL support), 2D graphics accelerator, and dedicated OpenVG? 1.1 accelerator. ? Interface flexibility?Each processor supports connections to a variety of interfaces: LCD controller for up to four displays (including parallel display, HDMI1.4, MIPI display, and LVDS display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host and other), 10/100/1000 Mbps Gigabit Ethernet controller, and a variety of other popular interfaces 2 2 (such as UART, I C, and I S serial audio, SATA-II, and PCIe-II). ? Advanced security?The processors deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6Dual/6Quad security reference manual (IMX6DQ6SDLSRM). i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products, Rev. 3, 11/2018 2 NXP SemiconductorsDocument Number: IMX6DQPCEC NXP Semiconductors Rev. 3, 11/2018 Data Sheet: Technical Data MCIMX6QP5Exx1AA MCIMX6QP5Exx1AB MCIMX6DP5Exx1AA MCIMX6DP5Exx1AB MCIMX6QP5Exx2AA MCIMX6QP5Exx2AB MCIMX6DP5Exx2AA MCIMX6DP5Exx2AB i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 Introduction 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 The i.MX 6DualPlus/6QuadPlus processors offer the 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 highest levels of graphics processing performance in the 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 i.MX 6 series family and are ideally suited for graphics 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 intensive applications. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 The i.MX 6DualPlus/6QuadPlus processors feature 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 advanced implementation of the quad 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 ? ? Arm Cortex -A9 core, which operates at speeds up to 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 1.2 GHz. They include updated versions of the 2D and 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 3D graphics processors, 1080p video processing, and 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 integrated power management. Each processor provides 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 a 64-bit DDR3/DDR3L/LPDDR2 memory interface and 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 a number of other interfaces for connecting peripherals, 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 ? 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 such as WLAN, Bluetooth , GPS, hard drive, displays, 4.11 General-Purpose Media Interface (GPMI) Timing. 64 and camera sensors. 4.12 External Peripheral Interface Parameters . . . . . . . 73 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 The i.MX 6DualPlus/6QuadPlus processors are 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 specifically useful for applications such as the 6 Package Information and Contact Assignments . . . . . . 141 following: 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141 ? Graphics rendering for Human Machine 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Interfaces (HMI) ? Video processing and display NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Document Number: IMX6DQPCEC NXP Semiconductors Rev. 3, 11/2018 Data Sheet: Technical Data MCIMX6QP5Exx1AA MCIMX6QP5Exx1AB MCIMX6DP5Exx1AA MCIMX6DP5Exx1AB MCIMX6QP5Exx2AA MCIMX6QP5Exx2AB MCIMX6DP5Exx2AA MCIMX6DP5Exx2AB i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 Introduction 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 The i.MX 6DualPlus/6QuadPlus processors offer the 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 highest levels of graphics processing performance in the 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 i.MX 6 series family and are ideally suited for graphics 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 intensive applications. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 The i.MX 6DualPlus/6QuadPlus processors feature 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 advanced implementation of the quad 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 ? ? Arm Cortex -A9 core, which operates at speeds up to 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 1.2 GHz. They include updated versions of the 2D and 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 3D graphics processors, 1080p video processing, and 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 integrated power management. Each processor provides 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 a 64-bit DDR3/DDR3L/LPDDR2 memory interface and 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 a number of other interfaces for connecting peripherals, 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 ? 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 such as WLAN, Bluetooth , GPS, hard drive, displays, 4.11 General-Purpose Media Interface (GPMI) Timing. 64 and camera sensors. 4.12 External Peripheral Interface Parameters . . . . . . . 73 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 The i.MX 6DualPlus/6QuadPlus processors are 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 specifically useful for applications such as the 6 Package Information and Contact Assignments . . . . . . 141 following: 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141 ? Graphics rendering for Human Machine 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Interfaces (HMI) ? Video processing and display NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Introduction ? Netbooks (web tablets) ? Nettops (Internet desktop devices) ? High-end mobile Internet devices (MID) ? High-end PDAs ? High-end portable media players (PMP) with HD video capability ? Gaming consoles ? Portable navigation devices (PND) The i.MX 6DualPlus/6QuadPlus processors offers numerous advanced features, such as: ? Applications processors?The processors enhance the capabilities of high-tier portable applications by fulfilling the ever increasing MIPS needs of operating systems and games. The Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as audio decode. ? Multilevel memory system?The multilevel memory system of each processor is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The processors support many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND?, and managed NAND, including eMMC up to rev 4.4/4.41. ? Smart speed technology?The processors have power management throughout the device that enables the rich suite of multimedia features and peripherals to consume minimum power in both active and various low power modes. Smart speed technology enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations. ? Dynamic voltage and frequency scaling?The processors improve the power efficiency of devices by scaling the voltage and frequency to optimize performance. ? Multimedia powerhouse?The multimedia performance of each processor is enhanced by a ? multilevel cache system, Neon MPE (Media Processor Engine) co-processor, a multi-standard hardware video codec, 2 autonomous and independent image processing units (IPU), and a programmable smart DMA (SDMA) controller. ? Powerful graphics acceleration?Each processor provides three independent, integrated graphics ? processing units: an OpenGL ES 3.0 3D graphics accelerator with four shaders (up to 198 MTri/s and OpenCL support), 2D graphics accelerator, and dedicated OpenVG? 1.1 accelerator. ? Interface flexibility?Each processor supports connections to a variety of interfaces: LCD controller for up to four displays (including parallel display, HDMI1.4, MIPI display, and LVDS display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host and other), 10/100/1000 Mbps Gigabit Ethernet controller, and a variety of other popular interfaces 2 2 (such as UART, I C, and I S serial audio, SATA-II, and PCIe-II). ? Advanced security?The processors deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6Dual/6Quad security reference manual (IMX6DQ6SDLSRM). i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products, Rev. 3, 11/2018 2 NXP SemiconductorsIntroduction ? Integrated power management?The processors integrate linear regulators and internally generate voltage levels for different domains. This significantly simplifies system power management structure. 1.1 Ordering Information Table 1 shows examples of orderable part numbers covered by this data sheet. This table does not include all possible orderable part numbers. The latest part numbers are available on nxp.com/imx6series. If your desired part number is not listed in the table, or you have questions about available parts, see nxp.com/imx6series or contact your NXP representative. Table 1. Example Orderable Part Numbers 1 Part Number Quad/Dual CPU Options Speed Temperature Grade Package MCIMX6DP5EYM1AA i.MX 6DualPlus VPU, GPU 1GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (non-lidded) MCIMX6DP5EYM1AB i.MX 6DualPlus VPU, GPU 1 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (non-lidded) MCIMX6QP5EYM1AA i.MX 6QuadPlus VPU, GPU 1GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (non-lidded) MCIMX6QP5EYM1AB i.MX 6QuadPlus VPU, GPU 1 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (non-lidded) MCIMX6DP5EVT2AA i.MX 6DualPlus VPU, GPU 1.2 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (lidded) MCIMX6DP5EVT2AB i.MX 6DualPlus VPU, GPU 1.2 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (lidded) MCIMX6QP5EVT2AA i.MX 6QuadPlus VPU, GPU 1.2 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (lidded) MCIMX6QP5EVT2AB i.MX 6QuadPlus VPU, GPU 1.2 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (lidded) 1 For 1 GHz speed grade: If a 24 MHz clock is used (required for USB), then the maximum SoC speed is limited to 996 MHz. Figure 1 describes the part number nomenclature to identify the characteristics of the specific part number you have (for example, cores, frequency, temperature grade, fuse options, silicon revision). Figure 1 applies to the i.MX 6DualPlus/6QuadPlus. The two characteristics that identify which data sheet a specific part applies to are the part number series field and the temperature grade (junction) field: ? The i.MX 6DualPlus/6QuadPlus Automotive Applications Processors data sheet (IMX6DQPAEC) covers parts listed for the ?Plus? series and with ?A? indicating automotive temperature. ?The i.MX 6DualPlus/6QuadPlus Applications Processors for Consumer Products data sheet (IMX6DQPCEC) covers parts listed with ?D (Commercial temp)? or ?E (Extended Commercial temp)? ? The i.MX 6DualPlus/6QuadPlus Applications Processors for Industrial Products data sheet (IMX6DQPIEC) covers parts listed with ?C (Industrial temp)? i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products, Rev. 3, 11/2018 NXP Semiconductors 3Document Number: IMX6DQPCEC NXP Semiconductors Rev. 3, 11/2018 Data Sheet: Technical Data MCIMX6QP5Exx1AA MCIMX6QP5Exx1AB MCIMX6DP5Exx1AA MCIMX6DP5Exx1AB MCIMX6QP5Exx2AA MCIMX6QP5Exx2AB MCIMX6DP5Exx2AA MCIMX6DP5Exx2AB i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 Introduction 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 The i.MX 6DualPlus/6QuadPlus processors offer the 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 highest levels of graphics processing performance in the 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 i.MX 6 series family and are ideally suited for graphics 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 intensive applications. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 The i.MX 6DualPlus/6QuadPlus processors feature 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 advanced implementation of the quad 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 ? ? Arm Cortex -A9 core, which operates at speeds up to 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 1.2 GHz. They include updated versions of the 2D and 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 3D graphics processors, 1080p video processing, and 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 integrated power management. Each processor provides 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 a 64-bit DDR3/DDR3L/LPDDR2 memory interface and 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 a number of other interfaces for connecting peripherals, 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 ? 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 such as WLAN, Bluetooth , GPS, hard drive, displays, 4.11 General-Purpose Media Interface (GPMI) Timing. 64 and camera sensors. 4.12 External Peripheral Interface Parameters . . . . . . . 73 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 The i.MX 6DualPlus/6QuadPlus processors are 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 specifically useful for applications such as the 6 Package Information and Contact Assignments . . . . . . 141 following: 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141 ? Graphics rendering for Human Machine 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Interfaces (HMI) ? Video processing and display NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Document Number: IMX6DQPCEC NXP Semiconductors Rev. 3, 11/2018 Data Sheet: Technical Data MCIMX6QP5Exx1AA MCIMX6QP5Exx1AB MCIMX6DP5Exx1AA MCIMX6DP5Exx1AB MCIMX6QP5Exx2AA MCIMX6QP5Exx2AB MCIMX6DP5Exx2AA MCIMX6DP5Exx2AB i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 Introduction 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 The i.MX 6DualPlus/6QuadPlus processors offer the 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 highest levels of graphics processing performance in the 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 i.MX 6 series family and are ideally suited for graphics 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 intensive applications. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 The i.MX 6DualPlus/6QuadPlus processors feature 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 advanced implementation of the quad 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 ? ? Arm Cortex -A9 core, which operates at speeds up to 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 1.2 GHz. They include updated versions of the 2D and 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 3D graphics processors, 1080p video processing, and 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 integrated power management. Each processor provides 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 a 64-bit DDR3/DDR3L/LPDDR2 memory interface and 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 a number of other interfaces for connecting peripherals, 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 ? 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 such as WLAN, Bluetooth , GPS, hard drive, displays, 4.11 General-Purpose Media Interface (GPMI) Timing. 64 and camera sensors. 4.12 External Peripheral Interface Parameters . . . . . . . 73 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 The i.MX 6DualPlus/6QuadPlus processors are 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 specifically useful for applications such as the 6 Package Information and Contact Assignments . . . . . . 141 following: 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141 ? Graphics rendering for Human Machine 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Interfaces (HMI) ? Video processing and display NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Introduction ? Netbooks (web tablets) ? Nettops (Internet desktop devices) ? High-end mobile Internet devices (MID) ? High-end PDAs ? High-end portable media players (PMP) with HD video capability ? Gaming consoles ? Portable navigation devices (PND) The i.MX 6DualPlus/6QuadPlus processors offers numerous advanced features, such as: ? Applications processors?The processors enhance the capabilities of high-tier portable applications by fulfilling the ever increasing MIPS needs of operating systems and games. The Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as audio decode. ? Multilevel memory system?The multilevel memory system of each processor is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The processors support many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND?, and managed NAND, including eMMC up to rev 4.4/4.41. ? Smart speed technology?The processors have power management throughout the device that enables the rich suite of multimedia features and peripherals to consume minimum power in both active and various low power modes. Smart speed technology enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations. ? Dynamic voltage and frequency scaling?The processors improve the power efficiency of devices by scaling the voltage and frequency to optimize performance. ? Multimedia powerhouse?The multimedia performance of each processor is enhanced by a ? multilevel cache system, Neon MPE (Media Processor Engine) co-processor, a multi-standard hardware video codec, 2 autonomous and independent image processing units (IPU), and a programmable smart DMA (SDMA) controller. ? Powerful graphics acceleration?Each processor provides three independent, integrated graphics ? processing units: an OpenGL ES 3.0 3D graphics accelerator with four shaders (up to 198 MTri/s and OpenCL support), 2D graphics accelerator, and dedicated OpenVG? 1.1 accelerator. ? Interface flexibility?Each processor supports connections to a variety of interfaces: LCD controller for up to four displays (including parallel display, HDMI1.4, MIPI display, and LVDS display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host and other), 10/100/1000 Mbps Gigabit Ethernet controller, and a variety of other popular interfaces 2 2 (such as UART, I C, and I S serial audio, SATA-II, and PCIe-II). ? Advanced security?The processors deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6Dual/6Quad security reference manual (IMX6DQ6SDLSRM). i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products, Rev. 3, 11/2018 2 NXP SemiconductorsDocument Number: IMX6DQPCEC NXP Semiconductors Rev. 3, 11/2018 Data Sheet: Technical Data MCIMX6QP5Exx1AA MCIMX6QP5Exx1AB MCIMX6DP5Exx1AA MCIMX6DP5Exx1AB MCIMX6QP5Exx2AA MCIMX6QP5Exx2AB MCIMX6DP5Exx2AA MCIMX6DP5Exx2AB i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 Introduction 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 The i.MX 6DualPlus/6QuadPlus processors offer the 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 highest levels of graphics processing performance in the 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 i.MX 6 series family and are ideally suited for graphics 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 intensive applications. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 The i.MX 6DualPlus/6QuadPlus processors feature 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 advanced implementation of the quad 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 ? ? Arm Cortex -A9 core, which operates at speeds up to 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 1.2 GHz. They include updated versions of the 2D and 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 3D graphics processors, 1080p video processing, and 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 integrated power management. Each processor provides 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 a 64-bit DDR3/DDR3L/LPDDR2 memory interface and 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 a number of other interfaces for connecting peripherals, 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 ? 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 such as WLAN, Bluetooth , GPS, hard drive, displays, 4.11 General-Purpose Media Interface (GPMI) Timing. 64 and camera sensors. 4.12 External Peripheral Interface Parameters . . . . . . . 73 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 The i.MX 6DualPlus/6QuadPlus processors are 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 specifically useful for applications such as the 6 Package Information and Contact Assignments . . . . . . 141 following: 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141 ? Graphics rendering for Human Machine 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Interfaces (HMI) ? Video processing and display NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Document Number: IMX6DQPCEC NXP Semiconductors Rev. 3, 11/2018 Data Sheet: Technical Data MCIMX6QP5Exx1AA MCIMX6QP5Exx1AB MCIMX6DP5Exx1AA MCIMX6DP5Exx1AB MCIMX6QP5Exx2AA MCIMX6QP5Exx2AB MCIMX6DP5Exx2AA MCIMX6DP5Exx2AB i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 Introduction 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 The i.MX 6DualPlus/6QuadPlus processors offer the 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 highest levels of graphics processing performance in the 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 i.MX 6 series family and are ideally suited for graphics 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 intensive applications. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 The i.MX 6DualPlus/6QuadPlus processors feature 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 advanced implementation of the quad 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 ? ? Arm Cortex -A9 core, which operates at speeds up to 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 1.2 GHz. They include updated versions of the 2D and 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 3D graphics processors, 1080p video processing, and 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 integrated power management. Each processor provides 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 a 64-bit DDR3/DDR3L/LPDDR2 memory interface and 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 a number of other interfaces for connecting peripherals, 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 ? 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 such as WLAN, Bluetooth , GPS, hard drive, displays, 4.11 General-Purpose Media Interface (GPMI) Timing. 64 and camera sensors. 4.12 External Peripheral Interface Parameters . . . . . . . 73 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 The i.MX 6DualPlus/6QuadPlus processors are 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 specifically useful for applications such as the 6 Package Information and Contact Assignments . . . . . . 141 following: 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141 ? Graphics rendering for Human Machine 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 Interfaces (HMI) ? Video processing and display NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Introduction ? Netbooks (web tablets) ? Nettops (Internet desktop devices) ? High-end mobile Internet devices (MID) ? High-end PDAs ? High-end portable media players (PMP) with HD video capability ? Gaming consoles ? Portable navigation devices (PND) The i.MX 6DualPlus/6QuadPlus processors offers numerous advanced features, such as: ? Applications processors?The processors enhance the capabilities of high-tier portable applications by fulfilling the ever increasing MIPS needs of operating systems and games. The Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as audio decode. ? Multilevel memory system?The multilevel memory system of each processor is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The processors support many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND?, and managed NAND, including eMMC up to rev 4.4/4.41. ? Smart speed technology?The processors have power management throughout the device that enables the rich suite of multimedia features and peripherals to consume minimum power in both active and various low power modes. Smart speed technology enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations. ? Dynamic voltage and frequency scaling?The processors improve the power efficiency of devices by scaling the voltage and frequency to optimize performance. ? Multimedia powerhouse?The multimedia performance of each processor is enhanced by a ? multilevel cache system, Neon MPE (Media Processor Engine) co-processor, a multi-standard hardware video codec, 2 autonomous and independent image processing units (IPU), and a programmable smart DMA (SDMA) controller. ? Powerful graphics acceleration?Each processor provides three independent, integrated graphics ? processing units: an OpenGL ES 3.0 3D graphics accelerator with four shaders (up to 198 MTri/s and OpenCL support), 2D graphics accelerator, and dedicated OpenVG? 1.1 accelerator. ? Interface flexibility?Each processor supports connections to a variety of interfaces: LCD controller for up to four displays (including parallel display, HDMI1.4, MIPI display, and LVDS display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host and other), 10/100/1000 Mbps Gigabit Ethernet controller, and a variety of other popular interfaces 2 2 (such as UART, I C, and I S serial audio, SATA-II, and PCIe-II). ? Advanced security?The processors deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6Dual/6Quad security reference manual (IMX6DQ6SDLSRM). i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products, Rev. 3, 11/2018 2 NXP SemiconductorsIntroduction ? Integrated power management?The processors integrate linear regulators and internally generate voltage levels for different domains. This significantly simplifies system power management structure. 1.1 Ordering Information Table 1 shows examples of orderable part numbers covered by this data sheet. This table does not include all possible orderable part numbers. The latest part numbers are available on nxp.com/imx6series. If your desired part number is not listed in the table, or you have questions about available parts, see nxp.com/imx6series or contact your NXP representative. Table 1. Example Orderable Part Numbers 1 Part Number Quad/Dual CPU Options Speed Temperature Grade Package MCIMX6DP5EYM1AA i.MX 6DualPlus VPU, GPU 1GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (non-lidded) MCIMX6DP5EYM1AB i.MX 6DualPlus VPU, GPU 1 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (non-lidded) MCIMX6QP5EYM1AA i.MX 6QuadPlus VPU, GPU 1GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (non-lidded) MCIMX6QP5EYM1AB i.MX 6QuadPlus VPU, GPU 1 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (non-lidded) MCIMX6DP5EVT2AA i.MX 6DualPlus VPU, GPU 1.2 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (lidded) MCIMX6DP5EVT2AB i.MX 6DualPlus VPU, GPU 1.2 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (lidded) MCIMX6QP5EVT2AA i.MX 6QuadPlus VPU, GPU 1.2 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (lidded) MCIMX6QP5EVT2AB i.MX 6QuadPlus VPU, GPU 1.2 GHz Extended commercial 21 mm x 21 mm, 0.8 mm pitch, FCPBGA (lidded) 1 For 1 GHz speed grade: If a 24 MHz clock is used (required for USB), then the maximum SoC speed is limited to 996 MHz. Figure 1 describes the part number nomenclature to identify the characteristics of the specific part number you have (for example, cores, frequency, temperature grade, fuse options, silicon revision). Figure 1 applies to the i.MX 6DualPlus/6QuadPlus. The two characteristics that identify which data sheet a specific part applies to are the part number series field and the temperature grade (junction) field: ? The i.MX 6DualPlus/6QuadPlus Automotive Applications Processors data sheet (IMX6DQPAEC) covers parts listed for the ?Plus? series and with ?A? indicating automotive temperature. ?The i.MX 6DualPlus/6QuadPlus Applications Processors for Consumer Products data sheet (IMX6DQPCEC) covers parts listed with ?D (Commercial temp)? or ?E (Extended Commercial temp)? ? The i.MX 6DualPlus/6QuadPlus Applications Processors for Industrial Products data sheet (IMX6DQPIEC) covers parts listed with ?C (Industrial temp)? i.MX 6DualPlus/6QuadPlus Applications Processors Consumer Products, Rev. 3, 11/2018 NXP Semiconductors 3

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