Product Information

MCIMX286CVM4B

MCIMX286CVM4B electronic component of NXP

Datasheet
Processors - Application Specialized CATSKILLS REV 1.2

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 26.5007 ea
Line Total: USD 26.5

1728 - Global Stock
Ships to you between
Thu. 02 May to Mon. 06 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2211 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 1
Multiples : 1
1 : USD 25.6473
10 : USD 18.8974
100 : USD 18.8853
250 : USD 18.028
500 : USD 17.4121
760 : USD 17.3518
2280 : USD 17.2914

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Core
Data Bus Width
Maximum Clock Frequency
Interface Type
Operating Supply Voltage
Number of Cores
Mounting Style
Package / Case
L1 Cache Instruction Memory
L1 Cache Data Memory
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Application
Memory Type
Brand
Data Ram Size
Data Rom Size
I/O Voltage
Number Of Timers/Counters
Processor Series
Factory Pack Quantity :
Tradename
Watchdog Timers
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
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Document Number: IMX28CEC NXP Semiconductors Rev. 4, 10/2018 Data Sheet: Technical Data i.MX28 i.MX28 Applications Package Information Processors for Consumer Plastic package Case MAPBGA-289, 14 x 14 mm, 0.8 mm pitch Products Ordering Information See Table on page 3 for ordering information. 1 Introduction 1 1 Introduction 1.1 Device Features . 2 1.2 Ordering Information and Functional The i.MX28 is a low-power, high-performance Part Differences 3 1.3 Block Diagram . 5 applications processor optimized for the general 2 Features 6 embedded industrial and consumer markets. The core of 2.1 Special Signal Considerations 11 3 Electrical Characteristics . 11 the i.MX28 is NXP s fast, power-efficient 3.1 i.MX28 Device-Level Conditions 11 implementation of the ARM926EJ-S core, with 3.2 Thermal Characteristics 18 speeds of up to 454 MHz. 3.3 I/O DC Parameters 19 3.4 I/O AC Timing and Parameters . 22 The device is suitable for a wide range of applications, 3.5 Module Timing and Electrical Parameters . 27 4 Package Information and Contact Assignments . 59 including the following: 4.1 Case MAPBGA-289, 14 x 14 mm, 0.8 mm Pitch 59 4.2 Ground, Power, Sense, and Reference Contact Human-machine interface (HMI) panels: Assignments . 60 industrial, home 4.3 Signal Contact Assignments . 61 4.4 i.MX280 Ball Map . 63 Industrial drive, PLC, I/O control display, factory 4.5 i.MX283 Ball Map . 65 robotics display, graphical remote controls 4.6 i.MX286 Ball Map . 67 4.7 i.MX287 Ball Map . 69 Handheld scanners and printers 5 Revision History . 72 Patient-monitoring, portable medical devices Smart energy meters, energy gateways Media phones, media gateways The integrated power management unit (PMU) on the i.MX28 is composed of a triple output DC-DC switching converter and multiple linear regulators. These provide NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.Introduction power sequencing for the device and its I/O peripherals such as memories and SD cards, as well as provide battery charging capability for Li-Ion batteries. The i.MX28 processor includes an additional 128-Kbyte on-chip SRAM to make the device ideal for eliminating external RAM in applications with small footprint RTOS. The i.MX28 supports connections to various types of external memories, such as mobile DDR, DDR2 and LV-DDR2, SLC and MLC NAND Flash. The i.MX28 can be connected to a variety of external devices such as high-speed USB2.0 OTG, CAN, 10/100 Ethernet, and SD/SDIO/MMC. 1.1 Device Features The following lists the features of the i.MX28: ARM926EJ-S CPU running at 454 MHz: 16-Kbyte instruction cache and 32-Kbyte data cache Arm embedded trace macrocell (CoreSight ETM9) Parallel JTAG interface 128 KBytes of integrated low-power on-chip SRAM 128 KBytes of integrated mask-programmable on-chip ROM 1280 bits of on-chip one-time-programmable (OCOTP) ROM 16-bit mobile DDR (mDDR) (1.8 V), DDR2 (1.8 V) and LV-DDR2 (1.5 V), up to 205 MHz DDR clock frequency with voltage overdrive Support for up to eight NAND Flash memory devices with up to 20-bit BCH ECC Four synchronous serial ports (SSP) for SDIO/MMC/MS/SPI: SSP0, SSP1, SSP2, and SSP3. SSP0 and SSP1 can support three modes,1-bit, 4-bit, and 8-bit, whereas SSP2 and SSP3 can support only 1-bit and 4-bit modes. 10/100-Mbps Ethernet MAC compatible with IEEE Std 802.3: Single 10/100 Ethernet with GMII/RMII or Dual 10/100 Ethernet with RMII interface Supporting IEEE Std 1588-compatible hardware timestamp Supporting 50-MHz/25-MHz clock output for external Ethernet PHY Two 2.0B protocol-compatible Controller Area Network (CAN) interfaces One USB2.0 OTG device/host controller and PHY One USB2.0 host controller and PHY LCD controller, up to 24-bit RGB (DOTCK) modes and 24-bit system-mode Pixel-processing pipeline (PXP) supports full path from color-space conversion, scaling, alpha-blending to rotation without intermediate memory access. SPDIF transmitter Dual serial audio interface (SAIF) to support full-duplex transmit and receive operations each SAIF supports three stereo pairs i.MX28 Applications Processors for Consumer Products, Rev. 4, 10/2018 2 NXP Semiconductors

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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