Product Information

MCF51JF64VLF

MCF51JF64VLF electronic component of NXP

Datasheet
32-bit Microcontrollers - MCU COLDFIREV1 64K FLASH

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 12.5613 ea
Line Total: USD 12.5613

303 - Global Stock
Ships to you between
Thu. 11 Apr to Mon. 15 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
51 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1
1 : USD 9.6945
10 : USD 7.613
100 : USD 6.302
250 : USD 5.957
500 : USD 5.773
1000 : USD 5.497
2500 : USD 5.29
5000 : USD 4.9565

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Core
Data Bus Width
Maximum Clock Frequency
Program Memory Size
Operating Supply Voltage
Maximum Operating Temperature
Package / Case
Mounting Style
Packaging
Series
Brand
Minimum Operating Temperature
Processor Series
Product Type
Factory Pack Quantity :
Subcategory
Tradename
Cnhts
Hts Code
Mxhts
Taric
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
BAS316 electronic component of NXP BAS316

BAS316 SWITCH DIODE
Stock : 9000

BAV10 electronic component of NXP BAV10

BAV10 SS DIODE T/HOLE
Stock : 0

BZX79C56 electronic component of NXP BZX79C56

BZX79C56 ZENER DIODE 400MW 5% D0-35 AXI
Stock : 697

BZX79C68 electronic component of NXP BZX79C68

BZX79C68 ZENER DIODE 400MW 5% D0-35 AXI
Stock : 9040

BZX79C18/RADIAL electronic component of NXP BZX79C18/RADIAL

BZX79C18/RADIAL ZENER DIODE 400MW 5% RADIAL
Stock : 1767

429099XB electronic component of NXP 429099XB

BZX84-C20,215 ZENER DIODE 20V 300M
Stock : 3150

BC856A electronic component of NXP BC856A

BC856A T/R TRANSITOR
Stock : 8900

BZX84-B6V2 electronic component of NXP BZX84-B6V2

DIODE, ZENER, 0.25W, 6.2V, SOT23
Stock : 1843

BC857B/215 electronic component of NXP BC857B/215

BC857B/215 SOT23 PNP SMALL SIG TRANS MARK
Stock : 0

Hot BZX79C5V1-LOOSE electronic component of NXP BZX79C5V1-LOOSE

BZX79C5V1 LOOSE ZENER DIODE 400MW 5% D0-35 AXIAL
Stock : 1320

Image Description
PIC32MM0016GPL020-I/SS electronic component of Microchip PIC32MM0016GPL020-I/SS

PIC microcontroller; Memory:16kB; SRAM:4kB; 25MHz; SMD; SO20
Stock : 1

PIC32MX130F064C-ITL electronic component of Microchip PIC32MX130F064C-ITL

MIPS32® M4K™ PIC® 32MX Microcontroller IC 32-Bit Single-Core 40MHz 64KB (64K x 8) FLASH 36-VTLA (5x5)
Stock : 1

PIC32MX230F256B-I/ML electronic component of Microchip PIC32MX230F256B-I/ML

MIPS32® M4K™ PIC® 32MX Microcontroller IC 32-Bit Single-Core 40MHz 256KB (256K x 8) FLASH 28-QFN (6x6)
Stock : 1

PIC32MX130F256B-V/SS electronic component of Microchip PIC32MX130F256B-V/SS

MIPS32® M4K™ Automotive, AEC-Q100, PIC® 32MX Microcontroller IC 32-Bit Single-Core 40MHz 256KB (256K x 8) FLASH 28-SSOP
Stock : 0

PIC32MX230F064D-IML electronic component of Microchip PIC32MX230F064D-IML

MIPS32® M4K™ PIC® 32MX Microcontroller IC 32-Bit Single-Core 40MHz 64KB (64K x 8) FLASH 44-QFN (8x8)
Stock : 270

PIC32MX250F128B-50I/SO electronic component of Microchip PIC32MX250F128B-50I/SO

MIPS32® M4K™ PIC® 32MX Microcontroller IC 32-Bit Single-Core 50MHz 128KB (128K x 8) FLASH 28-SOIC
Stock : 120

ATUC128L3U-AUT electronic component of Microchip ATUC128L3U-AUT

AVR AVR®32 UC3 L Microcontroller IC 32-Bit Single-Core 50MHz 128KB (128K x 8) FLASH 64-TQFP (10x10)
Stock : 0

PIC32MZ2048EFH100-250I/PT electronic component of Microchip PIC32MZ2048EFH100-250I/PT

32-bit Microcontrollers - MCU 32 Bit MCU, FPU, 2MB Flash, 512KB RAM, 252MHz, 100Pin, USB-HS, ENET, CAN, SQI
Stock : 2239

AT32UC3A3128S-CTUT electronic component of Microchip AT32UC3A3128S-CTUT

32-bit Microcontrollers - MCU 128KB, 144FBGA Ind, w/AES Mod.
Stock : 169

PIC32MM0064GPL020-E/SS electronic component of Microchip PIC32MM0064GPL020-E/SS

32-bit Microcontrollers - MCU 64KB Flash, 8KB RAM, 79 CoreMark at 25MHz, Low Power microMIPS
Stock : 1

Document Number MCF51JF128 Freescale Semiconductor Rev. 7, 03/2015 Data Sheet: Technical Data MCF51JF128 MCF51JF128 Supports the MCF51JF128VLH, MCF51JF128VHS, MCF51JF64VLF, MCF51JF64VHS, MCF51JF32VHS, MCF51JF32VFM Features Analog 12-bit SAR ADC Operating characteristics 12-bit DAC Voltage range: 1.71 V to 3.6 V Analog comparator (CMP) containing a 6-bit DAC Flash write voltage range: 1.71 V to 3.6 V and programmable reference input Temperature range (ambient): -40C to 105C Voltage reference (VREF) Core Timers Up to 50 MHz V1 ColdFire CPU Programmable delay block (PDB) Dhrystone 2.1 performance: 1.10 DMIPS per MHz Motor control/general purpose/PWM timers (FTM) when executing from internal RAM, 0.99 DMIPS 16-bit low-power timers (LPTMRs) per MHz when executing from flash memory 16-bit modulo timer (MTIM) System Carrier modulator transmitter (CMT) DMA controller with four programmable channels Communication interfaces Integrated ColdFire DEBUG Rev B+ interface with UARTs with Smart Card support and FIFO single-wire BDM connection SPI modules, one with FIFO Power management Inter-Integrated Circuit (I2C) modules 10 low power modes to provide power optimization USB full/low speed On-the-Go controller with on- based on application requirements chip transceiver Low-leakage wakeup unit (LLWU) Integrated Interchip Sound (I2S) / Serial Audio Voltage regulator (VREG) Interface (SAI) to support full-duplex serial interfaces with frame sync such as AC97 and Clocks CODEC Crystal oscillators (two, each with range options): 1 kHz to 32 kHz (low), 1 MHz to 8 MHz (medium), 8 Human-machine interface MHz to 32 MHz (high) Up to 48 EGPIO pins Multipurpose clock generator (MCG) Up to 16 rapid general purpose I/O (RGPIO) pins Low-power hardware touch sensor interface (TSI) Memories and memory interfaces Interrupt request pin (IRQ) Flash memory, FlexNVM, FlexRAM, and RAM Serial programming interface (EzPort) Mini-FlexBus external bus interface Security and integrity Hardware CRC module to support fast cyclic redundancy checks Hardware random number generator (RNGB) Hardware cryptographic acceleration unit (CAU) 128-bit unique identification (ID) number per chip 20102015 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts.......................................................................................3 5.4.1 Thermal operating requirements.................................... 20 1.1 Determining valid orderable parts............................................... 3 5.4.2 Thermal attributes.......................................................... 20 2 Part identification................................................................................. 3 6 Peripheral operating requirements and behaviors................................ 21 2.1 Description...................................................................................3 6.1 Core modules............................................................................... 21 2.2 Format..........................................................................................3 6.1.1 Debug specifications...................................................... 21 2.3 Fields............................................................................................3 6.2 System modules........................................................................... 21 2.4 Example....................................................................................... 4 6.3 Clock modules............................................................................. 21 3 Terminology and guidelines.................................................................4 6.3.1 MCG specifications........................................................21 3.1 Definition: Operating requirement...............................................4 6.3.2 Oscillator electrical specifications................................. 23 3.2 Definition: Operating behavior....................................................4 6.4 Memories and memory interfaces................................................26 3.3 Definition: Attribute.................................................................... 5 6.4.1 Flash electrical specifications........................................ 26 3.4 Definition: Rating........................................................................ 5 6.4.2 EzPort Switching Specifications....................................29 3.5 Result of exceeding a rating.........................................................6 6.4.3 Mini-Flexbus Switching Specifications......................... 30 3.6 Relationship between ratings and operating requirements.......... 6 6.5 Security and integrity modules.................................................... 32 3.7 Guidelines for ratings and operating requirements......................6 6.6 Analog..........................................................................................33 3.8 Definition: Typical value............................................................. 7 6.6.1 ADC electrical specifications.........................................33 4 Ratings..................................................................................................8 6.6.2 CMP and 6-bit DAC electrical specifications................36 4.1 Thermal handling ratings............................................................. 8 6.6.3 12-bit DAC electrical characteristics............................. 38 4.2 Moisture handling ratings............................................................ 8 6.6.4 Voltage reference electrical specifications.....................41 4.3 ESD handling ratings................................................................... 8 6.7 Timers.......................................................................................... 42 4.4 Voltage and current operating ratings..........................................8 6.8 Communication interfaces........................................................... 42 5 General................................................................................................. 9 6.8.1 USB electrical specifications......................................... 42 5.1 Typical Value Conditions............................................................ 9 6.8.2 USB DCD electrical specifications................................43 5.2 Nonswitching electrical specifications........................................ 9 6.8.3 USB VREG electrical specifications............................. 43 5.2.1 Voltage and Current Operating Requirements...............9 6.8.4 SPI switching specifications.......................................... 44 5.2.2 LVD and POR operating requirements..........................10 6.8.5 I2S/SAI Switching Specifications..................................47 5.2.3 Voltage and current operating behaviors....................... 11 6.9 Human-machine interfaces (HMI)...............................................49 5.2.4 Power mode transition operating behaviors...................12 6.9.1 TSI electrical specifications........................................... 49 5.2.5 Power consumption operating behaviors....................... 13 7 Dimensions...........................................................................................50 5.2.6 EMC radiated emissions operating behaviors................16 7.1 Obtaining package dimensions.................................................... 50 5.2.7 Designing with radiated emissions in mind................... 17 8 Pinout................................................................................................... 50 5.2.8 Capacitance attributes.................................................... 17 8.1 Signal Multiplexing and Pin Assignments...................................50 5.3 Switching electrical specifications...............................................17 8.2 Pinout diagrams........................................................................... 53 5.3.1 General Switching Specifications.................................. 18 8.3 Module-by-module signals.......................................................... 57 5.4 Thermal specifications.................................................................20 9 Revision History...................................................................................67 MCF51JF128, Rev. 7, 03/2015 2 Freescale Semiconductor, Inc.

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted