Product Information

MC17XS6500BEK

Product Image X-ON

Power Switch ICs - Power Distribution MC17XS6500BEK/HSOP32///STANDARD MARKING * TUBE DRY
Manufacturer: NXP


Price (Ex GST)

From 6.6171

27 - Global Stock
Ships to you between
Thu. 03 Dec to Mon. 07 Dec
MOQ: 1 Multiples:
Pack Size :   1
Availability Price Quantity
27 - Global Stock


Ships to you between Thu. 03 Dec to Mon. 07 Dec
Calender

MOQ : 1
Multiples : 1
1 : $ 13.3179
10 : $ 9.0343
25 : $ 8.3657
100 : $ 8.0057
250 : $ 7.8686
500 : $ 7.2514
1000 : $ 6.8743
2000 : $ 6.8743
5000 : $ 6.6171

Buy
         
Manufacturer
NXP
Product Category
Power Switch ICs - Power Distribution
Brand
NXP
Product Type
Power Switch Ics - Power Distribution
Factory Pack Quantity :
42
Subcategory
Switch Ics
Series
Mc17xs6500
Cnhts
8542390000
Hts Code
8542390001
Mxhts
85423901
Show Stocked Products With Similar Attributes. LoadingGif
Image Description
Stock Image MC22XS4200BEK
Power Switch ICs - Power Distribution 24V Dual 22mOhms SOICW-EP 32 Rail
Stock : 510
Stock Image MC20XS4200BAFK
Gate Drivers 24V, Dual 20mOhms
Stock : 168
Stock Image MC32PF1510A1EP
Power Management Specialized - PMIC PF1510
Stock : 490
Stock Image MC32PF1510A2EP
Power Management Specialized - PMIC MC32PF1510A2EPHVQFN40TRAY MULTIPLE DP BAKEABLE
Stock : 490
Stock Image MC17XS6500CEKR2
Power Switch ICs - Power Distribution MC17XS6500CEKHSOP32REEL 13 Q1 DP
Stock : 898
Stock Image MC22XS4200CEK
Switching Controllers SOIC-32 RoHS
Stock : 56
Image Description
Stock Image MAX14713EWL+T
Power Switch ICs - Power Distribution Dual battery power path IC; OTP Auto selection, low soft start, low threshold, 100 ms latch off, no
Stock : 3978
Stock Image MAX1823BEUB+T
Power Switch ICs - Power Distribution Dual USB Switch w/Fault Blank
Stock : 5000
Stock Image MAX4999ETJ+T
Power Switch ICs - Power Distribution USB 2.0 Hi-Speed Differential 8:1 Multiplexer
Stock : 844
Stock Image MIC2544-2YM
IC: power switch; high-side switch; 1.5A; Channels:1; MOSFET; SMD
Stock : 136
Stock Image BTS3080EJ
IC: power switch; low-side switch; 3A; Channels:1; N-Channel; SMD
Stock : 2916
Stock Image BTS3080TF
IC: power switch; low-side switch; 3A; Channels:1; N-Channel; SMD
Stock : 1962

NXP Semiconductors Document Number: MC12XS6D1 Rev. 4.0, 5/2018 Data sheet: Advance Information 17 mOhm and 7.0 mOhm high-side MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; switches MC17XS6400CEK The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. High-side switches It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness. Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track EK SUFFIX (PB-FREE) EK SUFFIX (PB-FREE) the load current, a dynamic overcurrent threshold profile is featured. Current of 98ASA00368D AND 98ASA00367D 98ASA00894D each channel can be sensed with a programmable sensing ratio. Whenever 54-PIN SOIC-EP 32-PIN SOIC-EP communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected. Applications ? Low-voltage automotive exterior lighting This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant. ? Halogen lamps ? Incandescent bulbs Features ? Light-emitting diodes (LEDs) ? Quad or penta high-side switches with high transient capability ? HID Xenon ballasts ? 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting ? Output current monitoring with programmable synchronization signal and battery voltage feedback ? Limp home mode ? External smart power switch control ? Operating voltage is 7.0 V to 18 V with sleep current < 5.0 ?A, extended mode from 6.0 V to 28 V ?-16 V reverse polarity and ground disconnect protections ? Compatible PCB foot print and SPI software driver among the family V BAT V BAT VBAT VCC 07XS6517 5.0 V VBAT VCC Regulator VCC SI SO CP GND CSB CSB OUT1 SCLK SCLK SI SO OUT2 RSTB RSTB CLK CLK OUT3 Main A/D1 CSNS MCU TRG1 SYNCB OUT4 LIMP PORT IN1 PORT OUT5 IN2 PORT PORT IN3 VBAT OUT IN PORT IN4 GND OUT6 Smart Power A/D2 CSNS GND GND Figure 1. Triple 7.0 m? and dual 17 m? high-side simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. ? 2018 NXP B.V.NXP Semiconductors Document Number: MC12XS6D1 Rev. 4.0, 5/2018 Data sheet: Advance Information 17 mOhm and 7.0 mOhm high-side MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; switches MC17XS6400CEK The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. High-side switches It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness. Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track EK SUFFIX (PB-FREE) EK SUFFIX (PB-FREE) the load current, a dynamic overcurrent threshold profile is featured. Current of 98ASA00368D AND 98ASA00367D 98ASA00894D each channel can be sensed with a programmable sensing ratio. Whenever 54-PIN SOIC-EP 32-PIN SOIC-EP communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected. Applications ? Low-voltage automotive exterior lighting This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant. ? Halogen lamps ? Incandescent bulbs Features ? Light-emitting diodes (LEDs) ? Quad or penta high-side switches with high transient capability ? HID Xenon ballasts ? 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting ? Output current monitoring with programmable synchronization signal and battery voltage feedback ? Limp home mode ? External smart power switch control ? Operating voltage is 7.0 V to 18 V with sleep current < 5.0 ?A, extended mode from 6.0 V to 28 V ?-16 V reverse polarity and ground disconnect protections ? Compatible PCB foot print and SPI software driver among the family V BAT V BAT VBAT VCC 07XS6517 5.0 V VBAT VCC Regulator VCC SI SO CP GND CSB CSB OUT1 SCLK SCLK SI SO OUT2 RSTB RSTB CLK CLK OUT3 Main A/D1 CSNS MCU TRG1 SYNCB OUT4 LIMP PORT IN1 PORT OUT5 IN2 PORT PORT IN3 VBAT OUT IN PORT IN4 GND OUT6 Smart Power A/D2 CSNS GND GND Figure 1. Triple 7.0 mO and dual 17 mO high-side simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. ? 2018 NXP B.V.1 Orderable parts This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.nxp.com and perform a part number search for the following device numbers. Table 1. Orderable part variations Temperature OUT1 OUT2 OUT3 OUT4 OUT5 Part number Notes Package OUT6 (T ) R R R R R A DS(on) DS(on) DS(on) DS(on) DS(on) SOIC54 pins MC07XS6517BEK 17 m? 17 m? 7.0 m? 7.0 m? 7.0 m? Yes exposed pad MC17XS6500BEK 17 m? 17 m? 17 m? 17 m? 17 m? Yes (1) -40 ?C to 125 ?C MC17XS6500CEK SOIC32 pins exposed pad MC17XS6400BEK 17 m? 17 m? 17 m? 17 m? No Yes MC17XS6400CEK Notes 1. To order parts in tape and reel, add the R2 suffix to the part number. 12XS6D1 2 NXP SemiconductorsNXP Semiconductors Document Number: MC12XS6D1 Rev. 4.0, 5/2018 Data sheet: Advance Information 17 mOhm and 7.0 mOhm high-side MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; switches MC17XS6400CEK The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. High-side switches It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness. Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track EK SUFFIX (PB-FREE) EK SUFFIX (PB-FREE) the load current, a dynamic overcurrent threshold profile is featured. Current of 98ASA00368D AND 98ASA00367D 98ASA00894D each channel can be sensed with a programmable sensing ratio. Whenever 54-PIN SOIC-EP 32-PIN SOIC-EP communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected. Applications ? Low-voltage automotive exterior lighting This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant. ? Halogen lamps ? Incandescent bulbs Features ? Light-emitting diodes (LEDs) ? Quad or penta high-side switches with high transient capability ? HID Xenon ballasts ? 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting ? Output current monitoring with programmable synchronization signal and battery voltage feedback ? Limp home mode ? External smart power switch control ? Operating voltage is 7.0 V to 18 V with sleep current < 5.0 ?A, extended mode from 6.0 V to 28 V ?-16 V reverse polarity and ground disconnect protections ? Compatible PCB foot print and SPI software driver among the family V BAT V BAT VBAT VCC 07XS6517 5.0 V VBAT VCC Regulator VCC SI SO CP GND CSB CSB OUT1 SCLK SCLK SI SO OUT2 RSTB RSTB CLK CLK OUT3 Main A/D1 CSNS MCU TRG1 SYNCB OUT4 LIMP PORT IN1 PORT OUT5 IN2 PORT PORT IN3 VBAT OUT IN PORT IN4 GND OUT6 Smart Power A/D2 CSNS GND GND Figure 1. Triple 7.0 mO and dual 17 mO high-side simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. ? 2018 NXP B.V.NXP Semiconductors Document Number: MC12XS6D1 Rev. 4.0, 5/2018 Data sheet: Advance Information 17 mOhm and 7.0 mOhm high-side MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; switches MC17XS6400CEK The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. High-side switches It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness. Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track EK SUFFIX (PB-FREE) EK SUFFIX (PB-FREE) the load current, a dynamic overcurrent threshold profile is featured. Current of 98ASA00368D AND 98ASA00367D 98ASA00894D each channel can be sensed with a programmable sensing ratio. Whenever 54-PIN SOIC-EP 32-PIN SOIC-EP communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected. Applications ? Low-voltage automotive exterior lighting This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant. ? Halogen lamps ? Incandescent bulbs Features ? Light-emitting diodes (LEDs) ? Quad or penta high-side switches with high transient capability ? HID Xenon ballasts ? 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting ? Output current monitoring with programmable synchronization signal and battery voltage feedback ? Limp home mode ? External smart power switch control ? Operating voltage is 7.0 V to 18 V with sleep current < 5.0 ?A, extended mode from 6.0 V to 28 V ?-16 V reverse polarity and ground disconnect protections ? Compatible PCB foot print and SPI software driver among the family V BAT V BAT VBAT VCC 07XS6517 5.0 V VBAT VCC Regulator VCC SI SO CP GND CSB CSB OUT1 SCLK SCLK SI SO OUT2 RSTB RSTB CLK CLK OUT3 Main A/D1 CSNS MCU TRG1 SYNCB OUT4 LIMP PORT IN1 PORT OUT5 IN2 PORT PORT IN3 VBAT OUT IN PORT IN4 GND OUT6 Smart Power A/D2 CSNS GND GND Figure 1. Triple 7.0 mO and dual 17 mO high-side simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. ? 2018 NXP B.V.1 Orderable parts This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.nxp.com and perform a part number search for the following device numbers. Table 1. Orderable part variations Temperature OUT1 OUT2 OUT3 OUT4 OUT5 Part number Notes Package OUT6 (T ) R R R R R A DS(on) DS(on) DS(on) DS(on) DS(on) SOIC54 pins MC07XS6517BEK 17 mO 17 mO 7.0 mO 7.0 mO 7.0 mO Yes exposed pad MC17XS6500BEK 17 mO 17 mO 17 mO 17 mO 17 mO Yes (1) -40 ?C to 125 ?C MC17XS6500CEK SOIC32 pins exposed pad MC17XS6400BEK 17 mO 17 mO 17 mO 17 mO No Yes MC17XS6400CEK Notes 1. To order parts in tape and reel, add the R2 suffix to the part number. 12XS6D1 2 NXP SemiconductorsTable of Contents 1 Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Relationship between ratings and operating requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.4 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.5 Supply currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 General IC functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.4 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.5 Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.6 SPI interface and configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 Functional block requirements and behaviors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.1 Self-protected high-side switches description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.2 Power supply functional block description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.3 Communication interface and device control functional block description and application information . . . . . . . . . . . . . . . 54 7 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.2 EMC and EMI considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.3 Robustness considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.4 PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 7.5 Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 8 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 8.1 Marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 8.2 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 12XS6D1 NXP Semiconductors 3NXP Semiconductors Document Number: MC12XS6D1 Rev. 4.0, 5/2018 Data sheet: Advance Information 17 mOhm and 7.0 mOhm high-side MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; switches MC17XS6400CEK The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. High-side switches It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness. Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track EK SUFFIX (PB-FREE) EK SUFFIX (PB-FREE) the load current, a dynamic overcurrent threshold profile is featured. Current of 98ASA00368D AND 98ASA00367D 98ASA00894D each channel can be sensed with a programmable sensing ratio. Whenever 54-PIN SOIC-EP 32-PIN SOIC-EP communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected. Applications ? Low-voltage automotive exterior lighting This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant. ? Halogen lamps ? Incandescent bulbs Features ? Light-emitting diodes (LEDs) ? Quad or penta high-side switches with high transient capability ? HID Xenon ballasts ? 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting ? Output current monitoring with programmable synchronization signal and battery voltage feedback ? Limp home mode ? External smart power switch control ? Operating voltage is 7.0 V to 18 V with sleep current < 5.0 ?A, extended mode from 6.0 V to 28 V ?-16 V reverse polarity and ground disconnect protections ? Compatible PCB foot print and SPI software driver among the family V BAT V BAT VBAT VCC 07XS6517 5.0 V VBAT VCC Regulator VCC SI SO CP GND CSB CSB OUT1 SCLK SCLK SI SO OUT2 RSTB RSTB CLK CLK OUT3 Main A/D1 CSNS MCU TRG1 SYNCB OUT4 LIMP PORT IN1 PORT OUT5 IN2 PORT PORT IN3 VBAT OUT IN PORT IN4 GND OUT6 Smart Power A/D2 CSNS GND GND Figure 1. Triple 7.0 mO and dual 17 mO high-side simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. ? 2018 NXP B.V.NXP Semiconductors Document Number: MC12XS6D1 Rev. 4.0, 5/2018 Data sheet: Advance Information 17 mOhm and 7.0 mOhm high-side MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; switches MC17XS6400CEK The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. High-side switches It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness. Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track EK SUFFIX (PB-FREE) EK SUFFIX (PB-FREE) the load current, a dynamic overcurrent threshold profile is featured. Current of 98ASA00368D AND 98ASA00367D 98ASA00894D each channel can be sensed with a programmable sensing ratio. Whenever 54-PIN SOIC-EP 32-PIN SOIC-EP communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected. Applications ? Low-voltage automotive exterior lighting This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant. ? Halogen lamps ? Incandescent bulbs Features ? Light-emitting diodes (LEDs) ? Quad or penta high-side switches with high transient capability ? HID Xenon ballasts ? 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting ? Output current monitoring with programmable synchronization signal and battery voltage feedback ? Limp home mode ? External smart power switch control ? Operating voltage is 7.0 V to 18 V with sleep current < 5.0 ?A, extended mode from 6.0 V to 28 V ?-16 V reverse polarity and ground disconnect protections ? Compatible PCB foot print and SPI software driver among the family V BAT V BAT VBAT VCC 07XS6517 5.0 V VBAT VCC Regulator VCC SI SO CP GND CSB CSB OUT1 SCLK SCLK SI SO OUT2 RSTB RSTB CLK CLK OUT3 Main A/D1 CSNS MCU TRG1 SYNCB OUT4 LIMP PORT IN1 PORT OUT5 IN2 PORT PORT IN3 VBAT OUT IN PORT IN4 GND OUT6 Smart Power A/D2 CSNS GND GND Figure 1. Triple 7.0 mO and dual 17 mO high-side simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. ? 2018 NXP B.V.1 Orderable parts This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.nxp.com and perform a part number search for the following device numbers. Table 1. Orderable part variations Temperature OUT1 OUT2 OUT3 OUT4 OUT5 Part number Notes Package OUT6 (T ) R R R R R A DS(on) DS(on) DS(on) DS(on) DS(on) SOIC54 pins MC07XS6517BEK 17 mO 17 mO 7.0 mO 7.0 mO 7.0 mO Yes exposed pad MC17XS6500BEK 17 mO 17 mO 17 mO 17 mO 17 mO Yes (1) -40 ?C to 125 ?C MC17XS6500CEK SOIC32 pins exposed pad MC17XS6400BEK 17 mO 17 mO 17 mO 17 mO No Yes MC17XS6400CEK Notes 1. To order parts in tape and reel, add the R2 suffix to the part number. 12XS6D1 2 NXP SemiconductorsNXP Semiconductors Document Number: MC12XS6D1 Rev. 4.0, 5/2018 Data sheet: Advance Information 17 mOhm and 7.0 mOhm high-side MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; switches MC17XS6400CEK The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. High-side switches It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness. Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track EK SUFFIX (PB-FREE) EK SUFFIX (PB-FREE) the load current, a dynamic overcurrent threshold profile is featured. Current of 98ASA00368D AND 98ASA00367D 98ASA00894D each channel can be sensed with a programmable sensing ratio. Whenever 54-PIN SOIC-EP 32-PIN SOIC-EP communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected. Applications ? Low-voltage automotive exterior lighting This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant. ? Halogen lamps ? Incandescent bulbs Features ? Light-emitting diodes (LEDs) ? Quad or penta high-side switches with high transient capability ? HID Xenon ballasts ? 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting ? Output current monitoring with programmable synchronization signal and battery voltage feedback ? Limp home mode ? External smart power switch control ? Operating voltage is 7.0 V to 18 V with sleep current < 5.0 ?A, extended mode from 6.0 V to 28 V ?-16 V reverse polarity and ground disconnect protections ? Compatible PCB foot print and SPI software driver among the family V BAT V BAT VBAT VCC 07XS6517 5.0 V VBAT VCC Regulator VCC SI SO CP GND CSB CSB OUT1 SCLK SCLK SI SO OUT2 RSTB RSTB CLK CLK OUT3 Main A/D1 CSNS MCU TRG1 SYNCB OUT4 LIMP PORT IN1 PORT OUT5 IN2 PORT PORT IN3 VBAT OUT IN PORT IN4 GND OUT6 Smart Power A/D2 CSNS GND GND Figure 1. Triple 7.0 mO and dual 17 mO high-side simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. ? 2018 NXP B.V.NXP Semiconductors Document Number: MC12XS6D1 Rev. 4.0, 5/2018 Data sheet: Advance Information 17 mOhm and 7.0 mOhm high-side MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; switches MC17XS6400CEK The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. High-side switches It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness. Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track EK SUFFIX (PB-FREE) EK SUFFIX (PB-FREE) the load current, a dynamic overcurrent threshold profile is featured. Current of 98ASA00368D AND 98ASA00367D 98ASA00894D each channel can be sensed with a programmable sensing ratio. Whenever 54-PIN SOIC-EP 32-PIN SOIC-EP communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected. Applications ? Low-voltage automotive exterior lighting This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant. ? Halogen lamps ? Incandescent bulbs Features ? Light-emitting diodes (LEDs) ? Quad or penta high-side switches with high transient capability ? HID Xenon ballasts ? 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting ? Output current monitoring with programmable synchronization signal and battery voltage feedback ? Limp home mode ? External smart power switch control ? Operating voltage is 7.0 V to 18 V with sleep current < 5.0 ?A, extended mode from 6.0 V to 28 V ?-16 V reverse polarity and ground disconnect protections ? Compatible PCB foot print and SPI software driver among the family V BAT V BAT VBAT VCC 07XS6517 5.0 V VBAT VCC Regulator VCC SI SO CP GND CSB CSB OUT1 SCLK SCLK SI SO OUT2 RSTB RSTB CLK CLK OUT3 Main A/D1 CSNS MCU TRG1 SYNCB OUT4 LIMP PORT IN1 PORT OUT5 IN2 PORT PORT IN3 VBAT OUT IN PORT IN4 GND OUT6 Smart Power A/D2 CSNS GND GND Figure 1. Triple 7.0 mO and dual 17 mO high-side simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. ? 2018 NXP B.V.1 Orderable parts This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.nxp.com and perform a part number search for the following device numbers. Table 1. Orderable part variations Temperature OUT1 OUT2 OUT3 OUT4 OUT5 Part number Notes Package OUT6 (T ) R R R R R A DS(on) DS(on) DS(on) DS(on) DS(on) SOIC54 pins MC07XS6517BEK 17 mO 17 mO 7.0 mO 7.0 mO 7.0 mO Yes exposed pad MC17XS6500BEK 17 mO 17 mO 17 mO 17 mO 17 mO Yes (1) -40 ?C to 125 ?C MC17XS6500CEK SOIC32 pins exposed pad MC17XS6400BEK 17 mO 17 mO 17 mO 17 mO No Yes MC17XS6400CEK Notes 1. To order parts in tape and reel, add the R2 suffix to the part number. 12XS6D1 2 NXP SemiconductorsTable of Contents 1 Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Relationship between ratings and operating requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.4 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.5 Supply currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 General IC functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.4 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.5 Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.6 SPI interface and configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 Functional block requirements and behaviors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.1 Self-protected high-side switches description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.2 Power supply functional block description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.3 Communication interface and device control functional block description and application information . . . . . . . . . . . . . . . 54 7 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.2 EMC and EMI considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.3 Robustness considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.4 PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 7.5 Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 8 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 8.1 Marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 8.2 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 12XS6D1 NXP Semiconductors 3

Customer Comments  

Log in or register to post comments.

Customer Reviews

No reviews yet.