Product Information

LS1088AXE7MQA

LS1088AXE7MQA electronic component of NXP

Datasheet
Microprocessors - MPU 1200/1600 XT WE

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

60: USD 172.7775 ea
Line Total: USD 10366.65

0 - Global Stock
MOQ: 60  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 05 Apr to Thu. 11 Apr

MOQ : 60
Multiples : 60
60 : USD 208.436

0 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1
1 : USD 208.426
10 : USD 179.561
120 : USD 179.561
300 : USD 179.561
540 : USD 179.561
1020 : USD 179.561
2520 : USD 179.561
5040 : USD 179.561

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Core
Data Bus Width
Maximum Clock Frequency
Interface Type
Operating Supply Voltage
Number of Cores
Mounting Style
Package / Case
L1 Cache Instruction Memory
L1 Cache Data Memory
Minimum Operating Temperature
Maximum Operating Temperature
Memory Type
Brand
L2 Cache Instruction / Data Memory
Product Type
Factory Pack Quantity :
Subcategory
Tradename
Watchdog Timers
Cnhts
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Document Number LS1088A NXP Semiconductors Rev. 1, 02/2019 Data Sheet: Technical Data LS1088A QorIQ LS1088A Data Sheet Features Eight SerDes lanes for high-speed peripheral interfaces: LS1088A contains eight ARM Cortex-A53 (32/64 Three PCI Express 3.0 controllers (one supporting bit) cores with the following capabilities: x4 operation) Speed up to 1.6 GHz One serial ATA (SATA 3.0) controller supporting Arranged as two clusters of four cores 6 Gbps 32 KB L1 instruction cache (ECC protection) and 32 Up to two SGMII supporting 2500 Mbps KB L1 data cache (ECC protection) Up to four SGMII supporting 1000 Mbps Two 1 MB unified I/D L2 cache (ECC protection), Up to two XFI (10 GbE) interfaces one per Cortex-A53 core cluster Up to two QSGMII NEON SIMD coprocessor Supports 1000Base-KX ARMv8 cryptography extensions Supports 10GBase-KR Hierarchical interconnect fabric: Additional peripheral interfaces include: Hardware-managed data coherency One quad serial peripheral interface (QSPI) Up to 700 MHz operation controller, one serial peripheral interface (SPI) One 32/64-bit DDR4 SDRAM memory controller: controller ECC and interleaving support Integrated flash controller (IFC) supporting NAND Up to 2.1 GT/s and NOR flash with 28-bit addressing and 16-bit data Datapath acceleration architecture 2.0 (DPAA2) Two USB 3.0 controllers with integrated PHY incorporates acceleration for the following functions: Enhanced secure digital host controller supporting Packet parsing, classification, and distribution SD 3.0, eMMC 4.4, and eMMC 4.5 modes (WRIOP) uQE supporting TDM/HDLC Queue management for scheduling, packet Four I2C controllers sequencing, and congestion management (QMan) Two 16550-compliant DUARTs Hardware buffer management for buffer allocation General purpose IO (GPIO), four FlexTimers, and and de-allocation (BMan) nine watchdog timers Cryptography acceleration (SEC) Trust architecture IEEE 1588 support Debug support with run control, data acquisition, Advanced I/O processor (AIOP) high-speed trace, and performance/event monitoring Parallel Ethernet interfaces: 780 FC-PBGA package, 23 mm x 23 mm, 0.8 mm Up to two RGMII interfaces pitch NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Overview.............................................................................................. 3 3.17 I2C interface.............................................................................. 145 2 Pin assignments.................................................................................... 3 3.18 Integrated Flash Controller........................................................148 2.1 780 BGA ball layout diagrams..................................................3 3.19 JTAG interface.......................................................................... 167 2.2 Pinout list...................................................................................10 3.20 Quad serial peripheral interface (QuadSPI).............................. 170 3 Electrical characteristics.......................................................................51 3.21 QUICC engine specifications....................................................174 3.1 Overall DC electrical characteristics.........................................51 3.22 Serial peripheral interface (SPI)................................................ 180 3.2 General AC timing specifications............................................. 58 3.23 Universal serial bus (USB) interface.........................................185 3.3 Power sequencing......................................................................59 4 Hardware design considerations...........................................................188 3.4 Power-down requirements.........................................................62 4.1 Clock ranges.............................................................................. 188 3.5 Power characteristics.................................................................62 4.2 Power supply design..................................................................189 3.6 Power-on ramp rate................................................................... 64 5 Thermal................................................................................................ 190 3.7 Input clocks............................................................................... 64 5.1 Recommended thermal model...................................................191 3.8 RESET initialization timing specifications............................... 70 5.2 Temperature diode.....................................................................191 3.9 Battery-backed security monitor interface................................ 71 5.3 Thermal management information............................................ 191 3.10 DDR4 SDRAM controller.........................................................73 6 Package information.............................................................................194 3.11 Dual universal asynchronous receiver/transmitter (DUART) 6.1 Package parameters for the FC-PBGA......................................194 interface..................................................................................... 78 6.2 Mechanical dimensions of the FC-PBGA................................. 194 3.12 Enhanced secure digital host controller (eSDHC).....................80 7 Security fuse processor.........................................................................196 3.13 Ethernet interface (EMI, RGMII, and IEEE Std 1588).............88 8 Ordering information............................................................................196 3.14 General purpose input/output (GPIO) interface........................ 98 8.1 Part numbering nomenclature....................................................196 3.15 Generic interrupt controller (GIC) interface..............................102 8.2 Part marking ............................................................................. 197 3.16 High-speed serial interfaces (HSSI).......................................... 104 9 Revision history....................................................................................198 QorIQ LS1088A Data Sheet, Rev. 1, 02/2019 2 NXP Semiconductors

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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