Product Information

LPC2929FBD144

LPC2929FBD144 electronic component of NXP

Datasheet
NXP Semiconductors LPC2929FBD144/LQFP144///STANDARD MARKING * TRAY DR

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 4.5684 ea
Line Total: USD 4.5684

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 05 Apr to Thu. 11 Apr

MOQ : 1
Multiples : 1
1 : USD 4.5684

     
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Number Of 32Bit Timers
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Type Of Integrated Circuit
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LPC2926/2927/2929 ARM9 microcontroller with CAN, LIN, and USB Rev. 5 28 September 2010 Product data sheet 1. General description The LPC2926/2927/2929 combine an ARM968E-S CPU core with two integrated TCM blocks operating at frequencies of up to 125 MHz, Full-speed USB 2.0 OTG and device controller, CAN and LIN, 56 kB SRAM, up to 768 kB flash memory, external memory interface, three 10-bit ADCs, and multiple serial and parallel interfaces in a single chip targeted at consumer, industrial and communication markets. To optimize system power consumption, the LPC2926/2927/2929 has a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling. 2. Features and benefits ARM968E-S processor running at frequencies of up to 125 MHz maximum. Multi-layer AHB system bus at 125 MHz with four separate layers. On-chip memory: Two Tightly Coupled Memories (TCM), 32 kB Instruction TCM (ITCM), 32 kB Data TCM (DTCM). Two separate internal Static RAM (SRAM) instances 32 kB SRAM and 16 kB SRAM. 8 kB ETB SRAM also available for code execution and data. Up to 768 kB high-speed flash-program memory. 16 kB true EEPROM, byte-erasable and programmable. Dual-master, eight-channel GPDMA controller on the AHB multi-layer matrix which can be used with the Serial Peripheral Interface (SPI) interfaces and the UARTs, as well as for memory-to-memory transfers including the TCM memories. External Static Memory Controller (SMC) with eight memory banks up to 32-bit data bus up to 24-bit address bus. Serial interfaces: USB 2.0 full-speed device/OTG controller with dedicated DMA controller and on-chip device PHY. Two-channel CAN controller supporting FullCAN and extensive message filtering. Two LIN master controllers with full hardware support for LIN communication. The LIN interface can be configured as UART to provide two additional UART interfaces. Two 550 UARTs with 16-byte Tx and Rx FIFO depths, DMA support, and RS485/EIA-485 (9-bit) support. Three full-duplex Q-SPIs with four slave-select lines 16 bits wide 8 locations deep Tx FIFO and Rx FIFO. 2 Two I C-bus interfaces.LPC2926/2927/2929 NXP Semiconductors ARM9 microcontroller with CAN, LIN, and USB Other peripherals: One 10-bit ADC with 5.0 V measurement range and eight input channels with conversion times as low as 2.44 s per channel. Two 10-bit ADCs, 8-channels each, with 3.3 V measurement range provide an additional 16 analog inputs with conversion times as low as 2.44 s per channel. Each channel provides a compare function to minimize interrupts. Multiple trigger-start option for all ADCs: timer, PWM, other ADC, and external signal input. Four 32-bit timers each containing four capture-and-compare registers linked to I/Os. Four six-channel PWMs (Pulse Width Modulators) with capture and trap functionality. Two dedicated 32-bit timers to schedule and synchronize PWM and ADC. Quadrature encoder interface that can monitor one external quadrature encoder. 32-bit watchdog with timer change protection, running on safe clock. Up to 104 general-purpose I/O pins with programmable pull-up, pull-down, or bus keeper. Vectored Interrupt Controller (VIC) with 16 priority levels. Up to 21 level-sensitive external interrupt pins, including USB, CAN and LIN wake-up features. Configurable clock-out pin for driving external system clocks. Processor wake-up from power-down via external interrupt pins CAN or LIN activity. Flexible Reset Generator Unit (RGU) able to control resets of individual modules. Flexible Clock-Generation Unit (CGU0) able to control clock frequency of individual modules: On-chip very low-power ring oscillator fixed frequency of 0.4 MHz always on to provide a Safe Clock source for system monitoring. On-chip crystal oscillator with a recommended operating range from 10 MHz to 25 MHz. PLL input range 10 MHz to 25 MHz. On-chip PLL allows CPU operation up to a maximum CPU rate of 125 MHz. Generation of up to 11 base clocks. Seven fractional dividers. Second CGU (CGU1) with its own PLL generates USB clocks and a configurable clock output. Highly configurable system Power Management Unit (PMU): clock control of individual modules. allows minimization of system operating power consumption in any configuration. Standard ARM test and debug interface with real-time in-circuit emulator. Boundary-scan test supported. ETM/ETB debug functions with 8 kB of dedicated SRAM also accessible for application code and data storage. Dual power supply: CPU operating voltage: 1.8 V 5%. I/O operating voltage: 2.7 V to 3.6 V inputs tolerant up to 5.5 V. 144-pin LQFP package. 40 C to +85 C ambient operating temperature range. LPC2926 27 29 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 5 28 September 2010 2 of 95

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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