74LVC1G57 Low-power configurable multiple function gate Rev. 7 10 September 2014 Product data sheet 1. General description The 74LVC1G57 provides configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer. All inputs can be connected to V or GND. CC Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using I . OFF The I circuitry disables the output, preventing the damaging backflow current through OFF the device when it is powered down. All inputs (A, B and C) are Schmitt trigger inputs. They are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. 2. Features and benefits Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input/output for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8B/JESD36 (2.7 V to 3.6 V). ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V 24 mA output drive (V =3.0 V) CC CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options Specified from 40 Cto+85 C and 40 Cto+125 C.74LVC1G57 NXP Semiconductors Low-power configurable multiple function gate 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G57GW 40 Cto+125 C SC-88 plastic surface-mounted package 6 leads SOT363 74LVC1G57GV 40 Cto+125 C SC-74 plastic surface-mounted package 6 leads SOT457 74LVC1G57GM 40 Cto+125 C XSON6 plastic extremely thin small outline package SOT886 no leads 6 terminals body 1 1.45 0.5 mm 74LVC1G57GF 40 Cto+125 C XSON6 plastic extremely thin small outline package SOT891 no leads 6 terminals body 1 1 0.5 mm 74LVC1G57GN 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1115 6 terminals body 0.9 1.0 0.35 mm 74LVC1G57GS 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1202 6 terminals body 1.0 1.0 0.35 mm 4. Marking Table 2. Marking 1 Type number Marking code 74LVC1G57GW YC 74LVC1G57GV V57 74LVC1G57GM YC 74LVC1G57GF YC 74LVC1G57GN YC 74LVC1G57GS YC 1 The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram < % & Fig 1. Logic symbol 74LVC1G57 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 7 10 September 2014 2 of 20 DDE