74LVC1G07GX,125

74LVC1G07 Buffer with open-drain output Rev. 11 29 June 2012 Product data sheet 1. General description The 74LVC1G07 provides the non-inverting buffer. The output of this device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. Schmitt-trigger action at all inputs makes the circuit tolerant for slower input rise and fall time. This device is fully specified for partial power-down applications using I . The I OFF OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input/output for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8-B/JESD36 (2.7 V to 3.6 V) ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V 24 mA output drive (V =3.0 V) CC CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options Specified from 40 C to +85 C and 40 C to +125 C74LVC1G07 NXP Semiconductors Buffer with open-drain output 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G07GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package 5 leads SOT353-1 body width 1.25 mm 74LVC1G07GV 40 C to +125 C SC-74A plastic surface-mounted package 5 leads SOT753 74LVC1G07GM 40 C to +125 C XSON6 plastic extremely thin small outline package SOT886 no leads 6 terminals body 1 1.45 0.5 mm 74LVC1G07GF 40 C to +125 C XSON6 plastic extremely thin small outline package SOT891 no leads 6 terminals body 1 1 0.5 mm 74LVC1G07GN 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1115 6 terminals body 0.9 1.0 0.35 mm 74LVC1G07GS 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1202 6 terminals body 1.0 1.0 0.35 mm 74LVC1G07GX 40 C to +125 C X2SON5 X2SON5: plastic thermal enhanced extremely thin SOT1226 small outline package no leads 5 terminals body 0.8 0.8 0.35 mm 4. Marking Table 2. Marking 1 Type number Marking code 74LVC1G07GW VS 74LVC1G07GV V07 74LVC1G07GM VS 74LVC1G07GF VS 74LVC1G07GN VS 74LVC1G07GS VS 74LVC1G07GX VS 1 The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram Y 2AY 4 2 4 A Y A mna623 mna624 GND mna591 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram 74LVC1G07 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 11 29 June 2012 2 of 18