Product Information

74HCT08D

74HCT08D electronic component of Nexperia

Datasheet
74HCT CMOS, SMD, 74HCT08, SOIC14

Manufacturer: Nexperia
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5: USD 0.451 ea
Line Total: USD 2.255

0 - Global Stock
MOQ: 5  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 04 Apr to Wed. 10 Apr

MOQ : 5
Multiples : 1

Stock Image

74HCT08D
Nexperia

5 : USD 0.4768
50 : USD 0.3663
100 : USD 0.2735
500 : USD 0.2288
1000 : USD 0.184

     
Manufacturer
Product Category
Brand
Logic Family / Base Number
Logic Type
Output Current
No. Of Inputs
Supply Voltage Min
Supply Voltage Max
Logic Case Style
No. Of Pins
Logic Ic Family
Logic Ic Base Number
Operating Temperature Min
Operating Temperature Max
Rohs Phthalates Compliant
Msl
Svhc
Base Number
Ic Generic Number
Logic Function Number
Logic Ic Function
No. Of Gates
Operating Temperature Range
Supply Voltage
Supply Voltage Range
Termination Type
LoadingGif

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74HC08 74HCT08 Quad 2-input AND gate Rev. 5 30 November 2015 Product data sheet 1. General description The 74HC08 74HCT08 is a quad 2-input AND gate. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of V . CC 2. Features and benefits Complies with JEDEC standard JESD7A Input levels: For 74HC08: CMOS level For 74HCT08: TTL level ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from 40 C to +85 C and from 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC08D 40 C to +125 C SO14 plastic small outline package 14 leads body width SOT108-1 3.9 mm 74HCT08D 74HC08DB 40 C to +125 C SSOP14 plastic shrink small outline package 14 leads body SOT337-1 width 5.3 mm 74HCT08DB 74HC08PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package 14 leads SOT402-1 body width 4.4 mm 74HCT08PW 74HC08BQ 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1 thin quad flat package no leads 14 terminals 74HCT08BQ body 2.5 3 0.85 mm&& 74HC08 74HCT08 NXP Semiconductors Quad 2-input AND gate 4. Functional diagram < < < < < % Q P QD P D PQ Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one gate) 5. Pinning information 5.1 Pinning + & + &7 + 7& WHUP LQDO 9 9 LQGH DUHD % % % < < < % % % < < DDD DDD UDQVSDUHQW WRS H Y Z 7 L (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 4. Pin configuration SO14 and (T)SSOP14 Fig 5. Pin configuration DHVQFN14 74HC HCT08 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 5 30 November 2015 2 of 15 *1 < < *1 % *1 < % && +& D % % % %

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