SCC2230-E02-PCB

Data Sheet SCC2230-E02 Combined gyroscope and 3-axis accelerometer with digital SPI interface Features Applications 125/s Z-axis angular rate measurement range SCC2230-E02 is targeted at applications demanding high stability with tough environmental requirements. 2g 3-axis acceleration measurement (XYZ) range Typical applications include: 40C+125C operating range Inertial Measurement Units (IMUs) for highly 3.0V3.6V supply voltage demanding environments SPI digital interface Platform stabilization and control Extensive self diagnostics features Motion analysis and control Size 15.0 x 8.5 x 4.3 mm (l w h) Roll over detection RoHS compliant robust SOIC plastic package Robotic control systems suitable for lead free soldering process and SMD Machine control systems mounting Navigation systems Proven capacitive 3D-MEMS technology Overview The SCC2230-E02 is a combined high performance angular rate and accelerometer sensor component. It consists of Z-axis angular rate sensor and three axis accelerometer sensor based on Murata s proven capacitive 3D-MEMS technology. Signal processing is done in one mixed signal ASIC that provides angular rate and acceleration output via flexible SPI digital interface. Sensor elements and ASIC are packaged to 24 pin premolded plastic housing that guarantees reliable operation over product s lifetime. The SCC2230-E02 is designed, manufactured and tested for high stability, reliability and quality requirements. The component has extremely stable output over wide range of temperature, humidity and vibration. The component has several advanced self diagnostics features, is suitable for SMD mounting and is compatible with RoHS and ELV directives. Murata Electronics Oy SCC2230-E02 1/38 Rev. B0 www.murata.com Doc.Nr. 82 1888 00 Subject to changes TABLE OF CONTENTS 1 Introduction ....................................................................................................................................... 4 2 Specifications ................................................................................................................................... 4 2.1 General Specifications .................................................................................................................4 2.2 Performance Specifications for Gyroscope ..............................................................................5 2.3 Performance Specifications for Accelerometer........................................................................6 2.4 Performance Specification for Temperature Sensor ...............................................................7 2.5 Absolute Maximum Ratings ........................................................................................................7 2.6 Pin Description .............................................................................................................................8 2.7 Typical performance characteristics........................................................................................10 2.7.1 Gyro typical performance characteristics ........................................................................10 2.7.2 Accelerometer typical performance characteristics .......................................................13 2.8 Digital I/O Specification .............................................................................................................15 2.9 SPI AC Characteristics...............................................................................................................16 2.10 Measurement Axis and Directions ........................................................................................17 2.11 Package Characteristics ........................................................................................................18 2.11.1 Package Outline Drawing ................................................................................................18 2.12 PCB Footprint ..........................................................................................................................19 2.13 Abbreviations ..........................................................................................................................19 3 General Product Description ...................................................................................................... 20 3.1 Factory Calibration .....................................................................................................................21 4 Component Operation, Reset and Power Up ......................................................................... 22 4.1 Component Operation................................................................................................................22 4.2 Reset and Power Up Sequence For Enabling Internal Failsafe Diagnostics ......................23 5 Component Interfacing................................................................................................................. 24 5.1 SPI Interface ................................................................................................................................24 5.1.1 General ..................................................................................................................................24 5.1.2 Protocol.................................................................................................................................24 5.1.3 General Instruction format..................................................................................................25 5.1.4 Operations ............................................................................................................................26 5.1.5 Return Status........................................................................................................................26 5.1.6 Checksum (CRC)..................................................................................................................27 5.1.7 Recommendation for the SPI interface implementation .................................................28 6 Register Definition ......................................................................................................................... 29 6.1 Sensor Data Block ......................................................................................................................29 6.1.1 Example of Angular Rate Data Conversion ......................................................................29 6.1.2 Example of Acceleration Data Conversion .......................................................................29 6.1.3 Example of Temperature Data Conversion.......................................................................29 6.2 Sensor Status Block...................................................................................................................30 6.2.1 RATE Status 1 Register (09h) .............................................................................................31 6.2.2 RATE Status 2 Register (0Ah) ............................................................................................31 Murata Electronics Oy SCC2230-E02 2/38 Rev. B0 www.murata.com Doc.Nr. 82 1888 00 Subject to changes