LQH32DN4R7M53L

SpecNo.JELF243A-0118A-01 P1/7 Reference Only CHIP COILCHIP INDUCTORS LQH32DN53L REFERENCE SPECIFICATION 1.Scope This reference specification applies to LQH32DN 53 Series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ H 32 D N 1R0 M 5 3 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (LW) and (For Automotive) L:Taping Characteristics 3.Rating Operating Temperature Range. -40 to +105C Storage Temperature Range. -40 to +105C Self Inductance DC Rated Customer MURATA Resonant Resistance Current Part Number Part Number Frequency (H) Tolerance () (mA) (MHz min) LQH32DN1R0M53L1.0 0.06030% 100 1000 LQH32DN2R2M53L2.2 0.09730%64 790 LQH32DN3R3M53L3.3 0.1230% 50 710 M:20% LQH32DN4R7M53L4.7 0.1530% 43 650 LQH32DN6R8M53L6.8 0.2530% 32 540 LQH32DN100K53L 10 0.3030% 26 450 LQH32DN150K53L 15 0.5830% 26 300 LQH32DN220K53L 22 0.7130% 19 250 LQH32DN330K53L 33 1.130% 17 200 K:10% LQH32DN470K53L 47 1.330% 15 170 LQH32DN680K53L 68 2.230% 12 130 LQH32DN101K53L 100 3.530% 10 100 When applied Rated current to the Products , self temperature rise shall be limited to 20 max and Inductance will be within 10% of initial Inductance value. 4.Testing Conditions <Unless otherwise specified> <In case of doubt> Temperature : Ordinary Temperature (15 to 35C) Temperature : 20 2C Humidity : Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH) Atmospheric Pressure : 86 to 106 kPa 5.Appearance and Dimensions 2.5 0.2 2.5 0.2 A A 2.5 0.2 A: 2.8max. Unit Mass (Typical value) 3.2 0.3 0.045 No marking. (in mm) 0.9 0.31.3 0.2 0.9 0.3 MURATA MFG.CO., LTD 1.55 0.15SpecNo.JELF243A-0118A-01 P2/7 Reference Only 6.Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment : KEYSIGHT 4192A or equivalent Measuring Frequency: 1MHz 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter 6.3 Self Resonant S.R.F shall meet item 3. Measuring Equipment : KEYSIGHT E4991A or equivalent Frequency(S.R.F) 7.Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged. Substrate:Glass-epoxy substrate Applied Direction : Chip coil Substrate Force:10N Hold Duration:51s 7.2 Bending Test Substrate:Glass-epoxy substrate (100401.6mm) Speed of Applying Force:1mm / s Deflection:2mm Hold Duration:5s Pressure jig R230 F Deflection 45 45 Product (in mm) 7.3 Vibration Oscillation Frequency : 10Hz~55Hz~10Hz for 1 minute Total amplitude 1.5 mm Testing Time:A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) 7.4 Solderability The wetting area of the electrode Flux:Ethanol solution of rosin,25(wt)% shall be at least 90% covered with (Immersed for 5s to 10s) new solder coating. Solder : Sn-3.0Ag-0.5Cu Pre-Heating: 15010C / 60 to 90seconds Solder Temperature:2405C Immersion Time: 31 s MURATA MFG.CO., LTD