This document was generated on 08/31/2021 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 0873400613 Status: Active Overview: Milli-Grid Connector System Description: 2.00mm Pitch Milli-Grid Receptacle, Surface Mount (Very Low Profile), Top Entry, without Locating Peg, 0.76m Gold (Au) Plating, 6 Circuits, Lead-Free, Tube, Black Documents: 3D Model Packaging Specification PK-87264-0001-001 (PDF) Drawing (PDF) Brochure (PDF) Product Specification PS-87340-001 (PDF) RoHS Certificate of Compliance (PDF) Application Specification 503940001-AS-000 (PDF) Series image - Reference only Agency Certification EU ELV CSA LR19980 Not Relevant UL E29179 EU RoHS China RoHS General Compliant Product Family PCB Receptacles REACH SVHC Series 87340 Contained Per - Application Board-to-Board, Signal D(2021)4569-DC (8 Overview Milli-Grid Connector System July 2021) Product Name Milli-Grid Dipentyl phthalate UPC 822348472970 bis(2-(2- methoxyethoxy)ethyl) Physical ether Circuits (Loaded) 6 Benzo(ghi)perylene Circuits (maximum) 6 Octanoic acid, Color - Resin Black 2,2,3,3,4,4,5,5,6,6,7,7,8,8,8- Durability (mating cycles max) 25 pen Flammability 94V-0 Dodecamethylcyclohexasiloxane Glow-Wire Capable No Decamethylcyclopentasiloxane Lock to Mating Part Yes Octamethylcyclotetrasiloxane Material - Metal Phosphor Bronze 1,2-diethoxyethane Material - Plating Mating Gold Dibutyltin-dichloride Material - Plating Termination Tin 1,3-Propanesultone Material - Resin High Temperature Thermoplastic C.I. Direct Black 38 Net Weight 0.078/g Ammonium- Number of Rows 2 pentadecafluorooctanoate Orientation Vertical 2,4-Di-tert-butyl-6-(5- PCB Locator No chlorobenzotriazol-2- PCB Retention None yl)p Packaging Type Tube Disodium-octaborate Pitch - Mating Interface 2.00mm Dibutylbis(pentane-2,4- Plating min - Mating 0.762m dionato-O,O )tin Plating min - Termination 1.905m 2-(2H-Benzotriazol-2- Polarized to Mating Part No yl)-4,6- Polarized to PCB No ditertpentylphenol Surface Mount Compatible (SMC) N/A Terphenyl, Temperature Range - Operating -55 to +105C hydrogenated Termination Interface: Style Surface Mount 1,2- Benzenedicarboxylic Electrical acid, dihexyl ester, Current - Maximum per Contact 1.0A bra Voltage - Maximum 125V diisohexyl phthalate 1,2- Solder Process Data Benzenedicarboxylic Duration at Max. Process Temperature (seconds) 014 acid, dipentyl ester, br Lead-freeProcess Capability REFLOWMax. Cycles at Max. Process Temperature 001 n-pentyl- Process Temperature max. C 265 isopentylphthalate Boric acid Material Info Aluminosilicate Refractory Ceramic Reference - Drawing Numbers Fibres Application Specification 503940001-AS-000 Zirconia Packaging Specification PK-87264-0001-001 Aluminosilicate Product Specification PS-87340-001 Refractory Ceramic Sales Drawing SD-87340-XX01-001 Fibr Nonadecafluorodecanoic acid (PFDA) and its sodiu Tris(4-nonylphenyl, branched and linear) phosphi Perfluorobutane sulfonic acid (PFBS) and its sal Fluoranthene Pyrene Dioctyltin dilaurate, stannane, dioctyl-, bis(co Perfluorononan-1- oic acid (2,2,3,3,4,4,5,5,6,6,7 Methylhexahydrophthalic anhydride reaction mass of 2-ethylhexyl 10- ethyl-4,4-dioct Perfluorohexane-1- sulphonic acid and its salts Lead chromate Tris(2-chloroethyl) phosphate Boric acid, disodium salt, hydrate Strontium-chromate 1,2- Benzenedicarboxylic acid, di-C7-11- branched bis(2-methoxyethyl) ether 1,2- Benzenedicarboxylic acid, bis(2- methoxyethyl 1,2-Dimethoxyethane 1,2-bis(2- methoxyethoxy)ethane Decabromodiphenylether Cadmium-oxide Cadmium-sulphide Lead Cadmium pyrochlore, antimony lead yellow Lead-dinitrate Lead oxide sulfate (Pb2O(SO4)) Lead-titanium-trioxide