RN52 RN52 Bluetooth Audio Module Features: Fully qualified Bluetooth version 3.0 module, Fully compatible with Bluetooth version 2.1+EDR, 1.2, and 1.1 Embedded Bluetooth profiles: A2DP, AVRCP, HFP/HSP and SPP Audio decoders: SBC, AAC, aptX Enhanced hands free voice capability narrowband and wideband codecs with cVc DSP Software configurable through commands over UART console interface Stereo analog differential audio output and input for highest quality audio External Audio CODECs Supported via S/PDIF and I2S Interface Integrated Amplifier for Driving 16 Speakers Dedicated GPIO pins enable MCUs to access control and status functions efficiently SPP data connection interface over UART Supports wireless iAP profile advertising which is RN52 Block Diagram: discoverable by iOS devices (iAP protocol imple- mentation on an external host microcontroller required) Certifications: FCC, ISED, CE, Bluetooth SIG Postage Stamp sized form factor: 13.5 x 26.0 x 2.7 mm Castellated SMT pads for easy and reliable PCB mounting Environmentally Friendly, RoHS Compliant Bluetooth SIG QDID 58578 Applications: High-quality wireless stereo headsets Automotive hands free audio kits Wireless audio docking station for smartphones High-quality wireless speakers VoIP handsets Remote control for media player Medical data devices 2021 Microchip Technology Inc. DS70005120B-page 1RN52 iAP in the capacity of Bluetooth Peripheral role. 1.0 DEVICE OVERVIEW RN52SRC supports A2DP, AVRCP, HFP in the capac- Microchips RN52 Bluetooth audio module provides a ity of the Bluetooth Central role. highly integrated solution for delivering high-quality ste- RN52 supports wireless iAP profile advertising which is reo audio in a small form factor. It combines a class 2 discoverable by iOS devices. An external host micro- Bluetooth radio with an embedded DSP processor. The controller is required to implement the iAP protocol and module is programmed and controlled with a simple communicate with the authentication coprocessor ASCII command set. while using the RN52 as a data pipe only to transfer the The RN52 module complies with Bluetooth specifica- iAP protocol data over Bluetooth back and forth with tion version 3.0. It integrates an RF radio and a base- the Apple device. A PIC microcontroller can be used band controller making it a complete Bluetooth to implement the iAP protocol using the Microchip MFi subsystem. The RN52 supports a variety of profiles Library. including A2DP, AVRCP, HSP/HFP, SPP and iAP. It Table 1-1 provides the general specifications for the provides a UART interface, several user programmable module. Table 1-2 and Table 1-3 provide the modules I/O pins, stereo speaker outputs, microphone inputs, weight, dimensions and electrical characteristics. digital audio interface and a USB port. Standard RN52 and its variants support A2DP, AVRCP, HFP, SPP and TABLE 1-1: GENERAL SPECIFICATIONS Specification Description 3.0, class 2 Standard Bluetooth Frequency Band 2.4 ~ 2.48 GHz Modulation Method GFSK, PI/4-DQPSK, 8 DPSK Maximum Data Rate 3 Mbps RF Input Impedance 50 ohms Interface UART, GPIO, AIO, USB, I2S, S/PDIF, speaker, microphone Operation Range 10 meters (33 feet) Sensitivity -85 dBm at 0.1 % BER RF TX Power 4 dBm TABLE 1-2: WEIGHT AND DIMENSIONS Specification Description Dimensions 26.0 mm x 13.5 mm x 2.7 mm Weight 1.2 g TABLE 1-3: ELECTRICAL CHARACTERISTICS Specification Description Supply Voltage 3.0-3.6V DC Working current Depends on profiles, 30 mA typical Standby current (disconnected) < 0.5 mA Temperature -40C to +85C ESD JESD22-A224 class 0 product Humidity 10% ~ 90% non-condensing Figure 1-1 shows the modules dimensions and Figure 1-2 shows recommended landing pattern and layout. DS70005120B-page 2 2021 Microchip Technology Inc.