PIC12C509A-04E/SM

PIC12C5XX 8-Pin, 8-Bit CMOS Microcontrollers Devices included in this Data Sheet: Peripheral Features: PIC12C508 PIC12C508A PIC12CE518 8-bit real time clock/counter (TMR0) with 8-bit programmable prescaler PIC12C509 PIC12C509A PIC12CE519 Power-On Reset (POR) PIC12CR509A Device Reset Timer (DRT) Note: Throughout this data sheet PIC12C5XX Watchdog Timer (WDT) with its own on-chip RC refers to the PIC12C508, PIC12C509, oscillator for reliable operation PIC12C508A, PIC12C509A, PIC12CR509A, PIC12CE518 and Programmable code-protection PIC12CE519. PIC12CE5XX refers to 1,000,000 erase/write cycle EEPROM data PIC12CE518 and PIC12CE519. memory High-Performance RISC CPU: EEPROM data retention > 40 years Power saving SLEEP mode Only 33 single word instructions to learn Wake-up from SLEEP on pin change All instructions are single cycle (1 m s) except for program branches which are two-cycle Internal weak pull-ups on I/O pins Operating speed: DC - 4 MHz clock input Internal pull-up on MCLR pin DC - 1 m s instruction cycle Selectable oscillator options: Memory - INTRC: Internal 4 MHz RC oscillator - EXTRC: External low-cost RC oscillator Device EPROM ROM RAM EEPROM Program Program Data Data - XT: Standard crystal/resonator - LP: Power saving, low frequency crystal PIC12C508 512 x 12 25 PIC12C508A 512 x 12 25 CMOS Technology: PIC12C509 1024 x 12 41 Low power, high speed CMOS EPROM/ROM PIC12C509A 1024 x 12 41 technology PIC12CE518 512 x 12 25 16 Fully static design PIC12CE519 1024 x 12 41 16 Wide operating voltage range PIC12CR509A 1024 x 12 41 Wide temperature range: 12-bit wide instructions - Commercial: 0C to +70C 8-bit wide data path - Industrial: -40C to +85C Seven special function hardware registers - Extended: -40C to +125C Two-level deep hardware stack Low power consumption Direct, indirect and relative addressing modes for - < 2 mA 5V, 4 MHz data and instructions - 15 m A typical 3V, 32 KHz - < 1 m A typical standby current Internal 4 MHz RC oscillator with programmable calibration In-circuit serial programming 1999 Microchip Technology Inc. DS40139E-page 1PIC12C508A PIC12C509A PIC12C508 PIC12CR509A PIC12CE518 PIC12C509 PIC12CE519 PIC12C5XX Pin Diagram - PIC12C508/509 PDIP, 208 mil SOIC, Windowed Ceramic Side Brazed VSS VDD 1 8 GP0 GP5/OSC1/CLKIN 2 7 GP4/OSC2 GP1 3 6 GP3/MCLR/VPP 4 5 GP2/T0CKI Pin Diagram - PIC12C508A/509A, PIC12CE518/519 PDIP, 150 & 208 mil SOIC, Windowed CERDIP VDD VSS 1 8 GP0 GP5/OSC1/CLKIN 2 7 GP4/OSC2 3 6 GP1 GP3/MCLR/VPP 4 5 GP2/T0CKI Pin Diagram - PIC12CR509A PDIP, 150 & 208 mil SOIC VSS VDD 1 8 GP0 GP5/OSC1/CLKIN 2 7 GP4/OSC2 GP1 3 6 GP3/MCLR/VPP 4 5 GP2/T0CKI Device Differences Oscillator Process Voltage 2 Device Oscillator Technology Calibration Range (Microns) (Bits) PIC12C508A 3.0-5.5 See Note 1 6 0.7 PIC12LC508A 2.5-5.5 See Note 1 6 0.7 PIC12C508 2.5-5.5 See Note 1 4 0.9 PIC12C509A 3.0-5.5 See Note 1 6 0.7 PIC12LC509A 2.5-5.5 See Note 1 6 0.7 PIC12C509 2.5-5.5 See Note 1 4 0.9 PIC12CR509A 2.5-5.5 See Note 1 6 0.7 PIC12CE518 3.0-5.5 - 6 0.7 PIC12LCE518 2.5-5.5 - 6 0.7 PIC12CE519 3.0-5.5 - 6 0.7 PIC12LCE519 2.5-5.5 - 6 0.7 Note 1: If you change from the PIC12C50X to the PIC12C50XA or to the PIC12CR50XA, please verify oscillator characteristics in your application. Note 2: See Section 7.2.5 for OSCCAL implementation differences. DS40139E-page 2 1999 Microchip Technology Inc.