EVALUATION KIT AVAILABLE MAXM17516 6A, 2.4V to 5.5V Input, High-Efficiency Power Module General Description Benefits and Features The Himalaya series of voltage regulator ICs and Reduces Design Complexity, Manufacturing Risks, power modules enable cooler, smaller, and simpler and Time-to-Market power supply solutions. The MAXM17516 is a fixed- Complete Integrated Step-Down Power Supply in a frequency, step-down power module in a thermally- Single Package efficient system-in-package (SiP) package that operates Saves Board Space in Space-Constrained Applications from a 2.4V to 5.5V input supply voltage and supports Small Form Factor 6.5mm x 10mm x 2.8mm SiP output currents up to 6A. The device includes a switch- Package mode power-supply controller, dual n-channel MOSFET Simplified PCB Design with as Few as Four power switches, a fully-shielded inductor, as well as External Components compensation components. The device supports 0.75V Offers Flexibility for Power-Design Optimization to 1.8V programmable output voltage. The high level 2.4V to 5.5V Input Voltage Range of integration significantly reduces design complexity, 0.75V to 1.8V Programmable Output Voltage manufacturing risks, and offers a true plug-and-play 6A Output Current power-supply solution, reducing the time to market. Fixed 1MHz Switching Frequency The MAXM17516 is available in a thermally-enhanced, Enable Input compact 28-pin, 10mm x 6.5mm x 2.8mm SiP and can Power-Good Output operate over the -40C to +125C industrial temperature Reduces Power Dissipation range. Up to 94% Efficiency Autoswitch, Light-Load, Pulse-Skipping Mode Applications High Impedance Shutdown FPGA and DSP Point-of-Load Regulator < 1A Shutdown Current Base Station Point-of-Load Regulator Industrial Control Equipmen t Operates Reliably and Reduces System Downtime Servers Voltage-Controlled Internal Soft-Start ATE Equipment Fault Protection Output Undervoltage/Overvoltage Protection Medical Equipment Thermal-Fault Protection Typical Application Circuit Peak Current Limit -40C to +125C Operation Ordering Information appears at end of data sheet. OUT IN OUT IN VIN 5V OUT IN 22F VOUT OUT IN MAXM17516 1.1V, 6A VCC OUT 2.2F 270F (OPTIONAL) OUT VCC OUT 22.1k OUT EN FB POK GND GND GND 47.5k 19-7427 Rev 1 4/15 PGND PGND PGND PGND PGND PGND PGNDMAXM17516 6A, 2.4V to 5.5V Input, High-Efficiency Power Module Absolute Maximum Ratings IN to PGND .............................................................-0.3V to +6V EP2 to PGND ......................................... -0.3V to + (V + 0.3V) IN V to GND ............................................................-0.3V to +6V EP2 to GND............................................ -0.6V to + (V + 0.3V) CC IN V to IN .................................................................-0.3V to +6V Continuous Power Dissipation (T = +70C) CC A EN to GND ..............................................................-0.3V to +6V 28-Pin SIP (derate 37mW/C above +70C) ............2000mW FB, POK to GND ...................................... -0.3V to (V + 0.3V) Operating Temperature Range ......................... -40C to +125C CC OUT, EP3 to GND ......................................-0.6V to (V + 0.3V) Junction Temperature ......................................................+125C IN PGND to GND ......................................................-0.3V to +0.3V Storage Tempera ture Range ............................ -55C to +150C EP1 to GND..........................................................-0.3V to +0.3V Lead Temperatur e (soldering, 10s) .................................+245C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics SiP Junction-to-Ambient Thermal Resistance ( q )...........25C/W JA Junction-to-Case Thermal Resistance ( q ) .................6C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = V = V = 5V, T = T = -40C to +125C, unless otherwise noted. Typical values are at T = +25C, unless otherwise noted. IN CC EN A J A See Typical Application Circuit.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY (V ) IN 2.4 5.5 IN Input Voltage Range V V IN V = V 4.5 5.5 IN CC IN Undervoltage Threshold Rising edge (100mV hysteresis) 2.05 2.19 2.4 V IN Standby Supply Current I V = V = 4.5V, no load 1 5.5 A Q IN CC V SUPPLY CC V Input Voltage Range V 4.5 5.5 V CC CC V Undervoltage Threshold Rising edge (160mV hysteresis) 3.9 4.2 4.5 V CC EN = GND, POK unconnected, measured V Shutdown Supply Current I 0.1 1.0 A CC VCC SHD at V , T = +25C CC A Regulator enabled, no load, no switching V Supply Current I 62 135 A CC VCC (V = 1V) FB OUTPUT Output Voltage Programmable V = V = 5.2V, I = 2A IN CC LOAD V 0.754 1.8 V OUT Range (see derating curve) Unity Gain Output-Voltage FB = OUT, no load 0.757 0.765 0.783 V Tolerance/FB accuracy FB Load Regulation Accuracy 2A < I < 5A, FB = OUT -7.5 -4.4 -1 mV/A OUT (RDROOP) FB Line Regulation Accuracy FB = OUT, no load, 2.4V < V < 5.5V 1.253 4.5 mV/V IN FB Input Bias Current T = -40C to +125C (Note 3) -0.1 -0.015 +0.1 A A Maxim Integrated 2 www.maximintegrated.com