MAX6625/MAX6626 9-Bit/12-Bit Temperature Sensors with 2 I C-Compatible Serial Interface in a SOT23 General Description Features The MAX6625/MAX6626 combine a temperature sensor, a 9-Bit Temperature-to-Digital Converter (MAX6625) 2 programmable overtemperature alarm, and an I C-compatible 12-Bit Temperature-to-Digital Converter (MAX6626) 2 serial interface into single compact packages. They convert I C-Compatible Serial Interface their die temperatures into digital values using internal analog- Up to Four Devices on a Single Bus to-digital converters (ADCs). The result of the conversion is Versatile Alarm Output with Programmable Trip held in a temperature register, readable at any time through Temperature and Hysteresis the serial interface. A dedicated alarm output, OT, activates Low-Power Shutdown Mode if the conversion result exceeds the value programmed in Space-Saving TDFN or SOT23 Packages the high-temperature register. A programmable fault queue Lead-Free Version Available (TDFN Package) sets the number of faults that must occur before the alarm Ordering Information activates, preventing spurious alarms in noisy environments. OT has programmable output polarity and operating modes. PART TEMP RANGE PIN-PACKAGE The MAX6625/MAX6626 feature a shutdown mode that MAX6625PMUT* -55C to +125C 6 SOT23 saves power by turning off everything but the power-on MAX6625PMUT+* -55C to +125C 6 SOT23 2 reset and the I C-compatible interface. Four separate MAX6625RMUT* -55C to +125C 6 SOT23 addresses can be configured with the ADD pin, allowing up to four MAX6625/MAX6626 devices to be placed on MAX6625RMUT+* -55C to +125C 6 SOT23 the same bus. The MAX6625P/MAX6626P OT outputs MAX6625PMTT* -55C to +125C 6 TDFN-EP** are open drain, and the MAX6625R/MAX6626R OT outputs MAX6625RMTT* -55C to +125C 6 TDFN-EP** include internal pullup resistors. MAX6626PMUT* -55C to +125C 6 SOT23 The MAX6625 has a 9-bit internal ADC and can function MAX6626PMUT+* -55C to +125C 6 SOT23 as a replacement for the LM75 in most applications. The MAX6626 has a 12-bit internal ADC. Both devices come MAX6626RMUT+* -55C to +125C 6 SOT23 in the space-saving 6-pin SOT23 package, or the 6-pin MAX6626RMUT* -55C to +125C 6 SOT23 TDFN package. *For device options, see Selector Guide at end of data sheet. Requires special solder temperature profile described in the Applications Absolute Maximum Ratings section. Fan Control **EP = Exposed pad. Temperature Alarms Indicates an RoHS-compliant part System Temperature Control +Denotes a lead(Pb)-free/RoHS-compliant package. Industrial Equipment Ordering Information is continued at end of data sheet. Pin Configuration Typical Operating Circuit V S TOP VIEW 1k 1k + 6 SDA 1 6 V 0.1F 10k S (OMIT FOR MAX6625R 4 AND MAX6626R) MAX6625 GND 2 5 ADD OT OUTPUT MAX6626 MAX6625 MAX6626 1 SDA 2 TO I C SCL 3 4 OT 3 MASTER SCL SOT236 5 2 TDFN-EP** **EP = EXPOSED PAD 19-1841 Rev 8 5/19MAX6625/MAX6626 9-Bit/12-Bit Temperature Sensors with 2 I C-Compatible Serial Interface in a SOT23 Absolute Maximum Ratings V to GND ...............................................................-0.3V to +6V Continuous Power Dissipation S OT, SCL, SDA to GND ............................................-0.3V to +6V 6-Pin SOT23 (derate 9.1mW/C above +70C) ..........727mW ADD to GND ................................................-0.3V to (V + 0.3V) 6-Pin TDFN (derate 23.8mW/C above +70C) ........1905mW S Current into Any Pin ...........................................................5mA Junction Temperature ......................................................+150C OT Sink Current .................................................................20mA Storage Temperature Range ............................ -60C to +150C ESD Rating (Human Body Model) ....................................2000V Lead Temperature ............................................................ Note 1 Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, IPC/JEDEC J-STD-020A, paragraph 7.6, Table 3 for IR/VPR and Convection Reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (+3V V +5.5V, T = -55C to +125C, unless otherwise noted.) S A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Power-Supply Voltage V 3.0 5.5 V S 2 I C-compatible active 1 mA 2 Quiescent Current I I C-compatible inactive 250 A C Shutdown mode 1 A MAX6625 9 ADC Resolution Bits MAX6626 12 MAX6625 0.5 Temperature Resolution C/LSB MAX6626 0.0625 T = +25C, V = +3V to +3.6V 1 A S Accuracy (Notes 2, 3) 0C = T +50C, V = +3.0V to +3.6V 1.5 C A S 0C = T +70C, V = +3.0V to +3.6V 2.0 A S Power-Supply Sensitivity V = +3V to +5.5V 1 C/V S Conversion Time t 133 ms C OT Pullup Resistor R MAX6625R, MAX6626R only 25 50 k P OT Saturation Voltage (Note 4) V I = 4mA (Note 4) 0.8 V L OUT OT Delay (Programmable through fault queue) 1 x t 6 x t ms C C T Default Temperature T 80 C HIGH HIGH T Default Temperature T 75 C LOW LOW 2 I C-Compatible I/O: SCL, SDA, ADD V < +3.6V 2 S Input High Voltage V V IH V > +3.6V 3 S Input Low Voltage V 0.8 V IL Input Hysteresis 0.2 V Maxim Integrated 2 www.maximintegrated.com