Product Information

MAX4999ETJ+T

MAX4999ETJ+T electronic component of Analog Devices

Datasheet
USB Switch ICs USB 2.0 Hi-Speed Differential 8:1 Multiplexer

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

2500: USD 3.1481 ea
Line Total: USD 7870.25

0 - Global Stock
MOQ: 2500  Multiples: 2500
Pack Size: 2500
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 26 Apr to Thu. 02 May

MOQ : 2500
Multiples : 2500

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MAX4999ETJ+T
Analog Devices

2500 : USD 3.1481

0 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 1
Multiples : 1

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MAX4999ETJ+T
Analog Devices

1 : USD 10.1778
10 : USD 7.261
25 : USD 6.9187
100 : USD 5.7828
250 : USD 5.5243
500 : USD 5.0306
1000 : USD 4.8661
2500 : USD 4.772

     
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RoHS - XON
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USB 2.0 Hi-Speed Differential MAX4999 8:1 Multiplexer General Description Benefits and Features The MAX4999 differential Hi-Speed USB analog multi- Increased Flexibility and Performance plexer features low on-capacitance (C ) switching, ON Multiplexer Supports USB 2.0 Standard making it an ideal solution for the USB server/mass -3dB Bandwidth: 1200MHz (typ) storage market. The MAX4999 is designed for USB 2.0 Low On-Resistance and Power Management low-/full-/Hi-Speed applications with capability of sup- Features Minimize System Losses porting data rates up to 480Mbps. 6.5 (typ) On-Resistance (R ) ON The MAX4999 is a differential 8:1 multiplexer. The Single +3.0V to +3.6V Power-Supply Voltage MAX4999 features three digital inputs to control the sig- nal path. Typical applications include switching a USB Enable Input Puts All Channels in High-Impedance connector between eight USB hosts and a USB device. State (Standby Mode) Low Operating Current (1A) and Ultra-Low An enable input (EN) is provided to disable all channels Quiescent Current (30nA) in Standby Mode and place the device into a high-impedance state (standby mode), shutting off the charge pump for mini- Reduce Component Count and Design Complexity mum power consumption. Low Threshold Eliminates the Need for Translators The MAX4999 operates from a +3.0V to +3.6V power- in 1.8V Low-Voltage Systems supply voltage and is specified over the -40C to +85C Saves Board Space extended temperature range. The MAX4999 is available 32-Pin, 5mm x 5mm, TQFN Package in a 5mm x 5mm, 32-pin TQFN package. Ordering Information Applications Keyboard, Video, Mouse (KVM) PART TEMP RANGE PIN-PACKAGE Servers/RAID MAX4999ETJ+ -40C to +85C 32 TQFN-EP* Mass Storage +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. Workstations Pin Configuration TOP VIEW 24 23 22 21 20 19 18 17 D5 1 25 16 D2 1 15 D2 0 D5 0 26 14 GND GND 27 13 D1 1 D6 1 28 MAX4999 29 12 D6 0 D1 0 GND 30 11 GND *EP 31 10 D0 1 D7 1 32 9 D0 0 D7 0 12 3 45 6 7 8 TQFN 5mm x 5mm *CONNECT EXPOSED PAD TO GND. 19-4127 Rev 2 3/15 GND GND V D4 0 CC EN D4 1 COM0 GND COM1 V CC C0 D3 1 D3 0 C1 GND C2USB 2.0 Hi-Speed Differential MAX4999 8:1 Multiplexer Absolute Maximum Ratings (All voltages referenced to GND.) Continuous Power Dissipation (T = +70C) A V ...........................................................................-0.3V to +4V 32-Lead TQFN (derate 34.5mW/C above +70C) ....2759mW CC All Other Pins (Note 1)..............................................-0.3V to +4V Operating Temperature Range ...........................-40C to +85C Continuous Current (COM to any switch) .......................60mA Storage Temperature Range .............................-65C to +150C Peak Current (COM to any switch) (pulsed at 1ms, Lead Temperature (soldering, 10s) .................................+300C 10% duty cycle)..........................................................120mA Soldering Temperature (reflow) .......................................+260C Note 1: Signals exceeding GND are clamped by internal diodes. Limit forward-diode current to maximum current rating. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 2) TQFN Junction-to-Ambient Thermal Resistance ( ) ............29C/W JA Junction-to-Case Thermal Resistance ( ) ...............2.0C/W JC Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = +3.0V to +3.6V, T = -40C to +85C, unless otherwise noted. Typical values are at V = +3.3V and T = +25C.) (Note 3) CC A CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Supply Voltage V 3.0 3.6 V CC Charge pump on 5 Quiescent Supply Current I A O Charge pump off 1 ANALOG SWITCH On-Resistance R I = 10mA 6.5 12 ON COM On-Resistance Match R V = 1V, T = +25C 0.8 ONSC COM A On-Resistance Match Between R V = 1V, T = +25C 1 ONBC COM A Channels Leakage Current COM , D 0, I V = +3.6V -1 +1 A L CC D 1 SWITCH AC PERFORMANCE (Note 4) Any switch to non-paired switch at 500MHz Crosstalk V -30 dB DCT1 (Figure 3) Any switch to non-paired switch at 240MHz Off-Isolation V -27 dB OFF (Figure 3) Bandwidth -3dB BW R = 45 unbalanced (Figure 3) 1200 MHz L f = 1MHz 6 On-Capacitance C pF ON Taken from S11 parameters at f = 240MHz 3.0 f = 1MHz, COM 5 Off-Capacitance C pF OFF Taken from S11 parameters at f = 240MHz 3.0 Propagation Delay t R = R = 50 (Figure 2) 300 ps PD L S V or V = +1.5V, R = 300, D 0 D 1 L Turn-On Time t 10 s ON C = 35pF, V = V , V = 0V (Figure 1) L IH CC IL www.maximintegrated.com Maxim Integrated 2

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
Analog Devices, Inc.
DA4
Dallas
DALLAS / MAXIM
Dallas Semiconductor (VA)
LINEAR
LINEAR TECH
Linear Technology
Linear Technology (part of ADI)
LT
LT4
MAXIM
Maxim Integrated
MAXIM INTEGRATED / ANALOG DEVICES
Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
Trinamic
TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH

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