Product Information

MAX2614ETA+T

MAX2614ETA+T electronic component of Analog Devices

Datasheet
RF Amplifier 40MHz to 4GHz Linear Broadband Amplifiers

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 4.9754 ea
Line Total: USD 4.9754

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
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0 - Global Stock


Ships to you between Fri. 05 Apr to Thu. 11 Apr

MOQ : 1
Multiples : 1

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MAX2614ETA+T
Analog Devices

1 : USD 4.9924
10 : USD 3.9885
25 : USD 3.7592
100 : USD 3.5217
250 : USD 3.15
500 : USD 2.8192

0 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1

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MAX2614ETA+T
Analog Devices

1 : USD 4.9257
10 : USD 3.528
25 : USD 3.339
100 : USD 2.9862
250 : USD 2.7139
500 : USD 2.5079
1000 : USD 2.3019
2500 : USD 2.2171

     
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RoHS - XON
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Click here for production status of specific part numbers. MAX2612MAX2616 40MHz to 4GHz Linear Broadband Amplifiers General Description Benefits and Features The MAX2612MAX2616 is a family of high-performance Extremely Flat Frequency Response broadband gain blocks designed for use as a PA predriver, < 0.5dB, 1GHz to 4GHz low-noise amplifier, or as a cascadable 50I amplifier with Low Noise Figure: 2.0dB at f = 2.0GHz RFIN up to +19.5dBm output power. These devices are suited 40MHz to 4000MHz Frequency Range for many applications that include cellular infrastructure, Industrys Highest Max P Rating private or commercial microwave radios, and CATV or IN cable modems. The operating frequency range extends Large OIP3 Ranges from 40MHz to 4000MHz. The amplifier operates on a MAX2615/MAX2616: +37dBm +3V to a +5.25V supply with input and output ports internally MAX2612: +35.2dBm matched to 50I. The device family is available in a pin- MAX2613: +31.2dBm to-pin compatible, compact 2mm x 3mm TDFN lead-free MAX2614: +30dBm package. Output P1dB: +19.5dBm (MAX2615/MAX2616) High Gain: 18.6dB Applications Shutdown Mode (MAX2612/MAX2613/ Cellular Infrastructure MAX2614/MAX2616) Microwave Radio Adjustable Bias Current for Improved OIP3 Wireless LAN (MAX2615) Test and Measurement 3.0V to 5.25V Supply Range Automotive Compact 2mm x 3mm TDFN Package Industry-High ESD Rating: 2.5kV HBM AEC-Q100 QualifiedRefer to Ordering Information Ordering Information appears at end of data sheet. for List of /V Parts Typical Application Circuits 3V TO 5.25V 3V TO 5.25V 10F 10nF 470pF 10F 10nF 470pF 21.5kI 220nH 220nH MAX2612 MAX2613 N.C. MAX2614 MAX2615 MAX2616 V V CC CC EN/BIAS EN/BIAS 0.01F 0.01F 0.01F 0.01F RFIN RFOUT RFIN RFOUT GND GND 19-6309 Rev 5 3/19MAX2612MAX2616 40MHz to 4GHz Linear Broadband Amplifiers Absolute Maximum Ratings V ,EN/RBIAS, RFOUT to GND .........................-0.3V to +6.0V Junction Temperature .....................................................+150NC CC Maximum Input Power (RFIN) .......................................+20dBm Storage Temperature Range ............................ -65NC to +160NC Continuous Power Dissipation (T = +70NC) Lead Temperature (soldering, 10s) ................................+300NC A Soldering Temperature (reflow) ......................................+260NC TDFN (derates 16.7mW/NC above +70NC) .............1333.3mW Operating Temperature Range .......................... -40NC to +85NC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TDFN Junction-to-Ambient Thermal Resistance (B ) ..........60NC/W Junction-to-Case Thermal Resistance (B ) ...................11NC/W JA JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Package Information 8 TDFN PACKAGE CODE T823+1 Outline Number 21-0174 Land Pattern Number 90-0091 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 60C/W JA Junction to Case ( ) 11C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 60C/W JA Junction to Case ( ) 11C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
Analog Devices, Inc.
DA4
Dallas
DALLAS / MAXIM
Dallas Semiconductor (VA)
LINEAR
LINEAR TECH
Linear Technology
Linear Technology (part of ADI)
LT
LT4
MAXIM
Maxim Integrated
MAXIM INTEGRATED / ANALOG DEVICES
Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
Trinamic
TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH

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