Product Information

MAX2209EBS+TG45

MAX2209EBS+TG45 electronic component of Analog Devices

Datasheet
Maxim Integrated RF Detector RF Power Detector

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - Global Stock

MOQ : 553
Multiples : 553

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MAX2209EBS+TG45
Analog Devices

553 : USD 0.7589
N/A

Obsolete
0 - Global Stock

MOQ : 2500
Multiples : 2500

Stock Image

MAX2209EBS+TG45
Analog Devices

2500 : USD 0.5586
5000 : USD 0.5468
N/A

Obsolete
0 - Global Stock

MOQ : 1
Multiples : 1

Stock Image

MAX2209EBS+TG45
Analog Devices

1 : USD 1.2058
25 : USD 0.9286
50 : USD 0.8801
100 : USD 0.8108
250 : USD 0.7692
500 : USD 0.7415
1000 : USD 0.5731
2500 : USD 0.5586
5000 : USD 0.5468
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Frequency Range
Dynamic Range dB
Configuration
Operating Supply Voltage
Maximum Operating Temperature
Minimum Operating Temperature
Package / Case
Packaging
Series
Brand
Development Kit
Pd - Power Dissipation
Factory Pack Quantity :
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MAX2209 19-4946 Rev 0 10/09 RF Power Detector General Description Features The MAX2209 is a wideband (800MHz to 2GHz) RF S -25dBm to 0dBm Power Detection Range power detector. It takes an RF signal from the directional S 0.5dB Detection Error Due to Temperature coupler at the input, and outputs a DC voltage propor- S +2.7V to +5V Single-Supply Operation tional to the RF peak voltage. The change in output 2 voltage versus temperature is very repeatable from part S Space-Saving 4-Bump, 1mm UCSP Package to part and enables a lookup table based on nominal S On-Chip 50I Termination and DC-Blocking behavior, minimizing the effective detection error to less Capacitor than Q0.5dB relative to room temperature. The MAX2209 comes in a space-saving 2 x 2, 0.5mm pitch wafer-level package (WLP) and requires only two external components. Applications Ordering Information Dual-Band WCDMA Handsets PIN- TOP PART TEMP RANGE High-Speed Downlink Packet Access (HSDPA) PACKAGE MARK High-Speed Uplink Packet Access (HSUPA) MAX2209EBS+ -40NC to +85NC 4 UCSP AGJ +Denotes a lead(Pb)-free/RoHS-compliant package. Pin Configuration/Functional Diagram/Typical Operating Circuit MAX2209 V CC A1 A2 ADC OUT V CC B1 B2 RF INPUT GND RFIN UCSP is a trademark of Maxim Integrated Products, Inc. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLERF Power Detector ABSOLUTE MAXIMUM RATINGS V to GND .............................................................-0.3V to +6V Junction-to-Ambient Thermal CC RFIN to GND .........................................-0.3V to + (V + 0.3V) Resistance (B ) (Note 1) ..........................................335NC/W CC JA OUT to GND ..........................................-0.3V to + (V + 0.3V) Operating Temperature Range .......................... -40NC to +85NC CC RFIN Input Power ..........................................................+10dBm Storage Temperature Range ............................ -65NC to +160NC Continuous Power Dissipation (T = +70NC) Junction Temperature ....................................................+150NC A 4-Bump WLP (derate 3mW/NC above +70NC) .............238mW Bump Temperature (soldering, Note 2) Infrared (15s) ...............................................................+260NC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 2: For detailed information on soldering, refer to Application Note 1891: Wafer-Level Packaging (WLP) and Its Applications. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION ESD SENSITIVE DEVICE DC ELECTRICAL CHARACTERISTICS (V = 2.7V to 5.0V, T = -40NC to +85NC, no RF signal applied. Typical values are at V = 2.8V, T = +25NC, unless otherwise CC A CC A noted.) (Note 3) PARAMETER CONDITIONS MIN TYP MAX UNITS Supply Voltage 2.7 5.0 V Supply Current 3.6 6 mA Idle Output Voltage V = 2.8V, no RF signal 35 mV CC Output Current Source Capability P = 0dBm, V forced to 0.5V 750 1800 FA IN OUT Output Current Sink Capability No RF signal, V forced to 2V 300 525 FA OUT AC ELECTRICAL CHARACTERISTICS (T = -40NC to +85NC, 50I system, V = 2.8V. Typical values are at T = +25NC, unless otherwise noted.) (Note 3) A CC A PARAMETER CONDITIONS MIN TYP MAX UNITS RF Input Frequency 800 2000 MHz 800MHz -17 RF Input VSWR dB 2000MHz -12 -5dBm input 0.88 Output Voltage, 836MHz V -25dBm input 0.06 -5dBm input 0.72 Output Voltage, 1950MHz V -25dBm input 0.06 Residual Error after Room -5dBm input Q0.5 Temperature Calibration dB -25dBm input Q1.5 (T = -40NC to +85NC) (Note 4) A Note 3: Guaranteed by production test at T = +25NC. Guaranteed by design and characterization at T = -40NC and A A T = +85NC. A Note 4: Guaranteed by design and characterization. See the Typical Operating Characteristics. 2 MAX2209

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
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DALLAS / MAXIM
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LT
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MAXIM
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MAXIM INTEGRATED / ANALOG DEVICES
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