MAX2031 19-0248 Rev 1 6/09 High-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch General Description Features 650MHz to 1000MHz RF Frequency Range The MAX2031 high-linearity passive upconverter or downconverter mixer is designed to provide +36dBm 650MHz to 1250MHz LO Frequency Range IIP3, 7dB NF, and 7dB conversion loss for a 650MHz to 570MHz to 900MHz LO Frequency Range 1000MHz RF frequency range to support GSM/cellular (Refer to the MAX2029 Data Sheet) base-station transmitter or receiver applications. With a DC to 250MHz IF Frequency Range 650MHz to 1250MHz LO frequency range, this particu- 7dB Conversion Loss lar mixer is ideal for high-side LO injection architec- +36dBm Input IP3 tures. For a pin-to-pin-compatible mixer meant for low-side LO injection, refer to the MAX2029. +27dBm Input 1dB Compression Point In addition to offering excellent linearity and noise per- 7dB Noise Figure formance, the MAX2031 also yields a high level of com- Integrated LO Buffer ponent integration. This device includes a double- Integrated RF and LO Baluns balanced passive mixer core, a dual-input LO selec- Low -3dBm to +3dBm LO Drive table switch, and an LO buffer. On-chip baluns are also Built-In SPDT LO Switch with 49dB LO1 to LO2 integrated to allow for a single-ended RF input for Isolation and 50ns Switching Time downconversion (or RF output for upconversion), and single-ended LO inputs. The MAX2031 requires a nomi- Pin Compatible with the MAX2039/MAX2041 1700MHz to 2200MHz Mixers nal LO drive of 0dBm, and supply current is guaranteed to be below 100mA. External Current-Setting Resistor Provides Option for Operating Mixer in Reduced-Power/Reduced- The MAX2031 is pin compatible with the MAX2039/ Performance Mode MAX2041 1700MHz to 2200MHz mixers, making this family of passive upconverters and downconverters ideal for applications where a common PC board layout Ordering Information is used for both frequency bands. PART TEMP RANGE PIN-PACKAGE The MAX2031 is available in a compact 20-pin thin QFN package (5mm x 5mm) with an exposed pad. M AX 2031E TP + - 40C to + 85 C 20 Thin Q FN-E P * Electrical performance is guaranteed over the extended M AX 2031E TP + T- 40C to + 85 C 20 Thin Q FN-E P * -40C to +85C temperature range. +Denotes a lead(Pb)-free/RoHS-compliant package. T= Tape and reel. Applications *EP = Exposed pad. WCDMA/LTE and Predistortion Receivers cdma2000 Base Pin Configuration/ Microwave and Fixed Stations Broadband Wireless Functional Diagram GSM 850/GSM 900 2G Access and 2.5G EDGE Base Wireless Local Loop TOP VIEW Stations 20 19 18 17 16 Digital and Spread- + Integrated Digital Spectrum Enhanced Network V 1 15 LO2 Communication Systems CC (iDEN ) Base Stations V RF 2 MAX2031 14 CC WiMAX Base Stations TAP 3 13 GND and Customer Premise Equipment GND 4 12 GND E.P. 5 11 LO1 GND 67 8 910 cdma2000 is a registered trademark of Telecommunications Industry Association. iDENis a registered trademark of Motorola, Inc. WiMAX is a trademark of WiMAX Forum. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE V CC GND LOBIAS IF+ V IF- CC GND LOSEL GND GNDHigh-Linearity, 650MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS V to GND...........................................................-0.3V to +5.5V Continuous Power Dissipation (Note 2)....................................5W CC RF (RF is DC shorted to GND through a balun)..................50mA j (Notes 3, 4)...............................................................+38C/W A LO1, LO2 to GND..................................................-0.3V to +0.3V j (Notes 2, 3) ..............................................................+13C/W C IF+, IF- to GND...........................................-0.3V to (V + 0.3V) Operating Temperature Range (Note 5) .....T = -40C to +85C CC C TAP to GND...........................................................-0.3V to +1.4V Junction Temperature......................................................+150C LOSEL to GND ...........................................-0.3V to (V + 0.3V) Storage Temperature Range .............................-65C to +150C CC LOBIAS to GND..........................................-0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C CC RF, LO1, LO2 Input Power (Note 1) ...............................+20dBm Note 1: Maximum, reliable, continuous input power applied to the RF and IF port of this device is +12dBm from a 50 source. Note 2: Based on junction temperature T = T + ( x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: Junction temperature T = T + ( x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150C. Note 5: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = 4.75V to 5.25V, no RF signals applied, T = -40C to +85C. IF+ and IF- are DC grounded through an CC C IF balun. Typical values are at V = 5V, T = +25C, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5.00 5.25 V CC Supply Current I 85 100 mA CC LOSEL Input-Logic Low V 0.8 V IL LOSEL Input-Logic High V 2V IH RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS C omp onents tuned fo r t he 700MH z ban d 650 850 ( Tabl e 1), C 1 = 7pF, C 5 = 3.3pF ( N otes 6, 7) RF Frequency f MHz RF C om p onents tuned for the 800MH z/900MH z cel l ular b and ( Tabl e 1), C 1 = 82pF, 800 1000 C 5 = 2.0p F ( N ote 6) LO Frequency f (Notes 6, 7) 650 1250 MHz LO IF frequency range depends on external IF IF Frequency f 0 250 MHz IF transformer selection LO Drive Level P (Note 6) -3 +3 dBm LO 2 MAX2031