Product Information

MAVR-011020-14110P

MAVR-011020-14110P electronic component of MACOM

Datasheet
Varactor Diodes Ct Max .275pF -40C +125C

Manufacturer: MACOM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 5.346 ea
Line Total: USD 5.346

501 - Global Stock
Ships to you between
Thu. 11 Apr to Mon. 15 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
8016 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1
1 : USD 4.1975
10 : USD 3.5765
100 : USD 3.013
250 : USD 2.852
500 : USD 2.714
1000 : USD 2.392
3000 : USD 2.392
6000 : USD 2.3
9000 : USD 2.2425

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Capacitance
Vr - Reverse Voltage
If - Forward Current
Mounting Style
Termination Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Configuration
Packaging
Product
Brand
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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MAVR-011020-1411 Solderable GaAs Constant Gamma Flip-Chip Rev. V2 Varactor Diode Features Flip-Chip Design Constant Gamma for Linear Tuning Low Parasitic Capacitance High Q Silicon Nitride Passivation Polyimide Scratch Protection Surface Mount Configuration Lead Free (RoHS Compliant*) Front View (Circuit Side) Available in Pocket Tape and Reel Can withstand 500 Temperature Cycles (-65C to +150C), mounted with Sn96.5/Pb3.5 solder without Mechanical Degradation Can be Mounted with Solder or Conductive Epoxy Description Back View (Operator Side) The MAVR-011020-1411 is a gallium arsenide flip chip hyperabrupt varactor diode. This device is fabricated on OMCVD epitaxial wafers using a 1,2 process designed for high device uniformity and Ordering Information extremely low parasitics. This diode is fully passivated with silicon nitride and has an additional Part Number Package layer of polyimide for scratch protection. The protective coatings prevent damage to the junction MAVR-011020-14110P Pocket Tape during automated or manual handling. MAVR-011020-14110G Gel Pack The flip chip configuration is suitable for pick and 1. Reference Application Note M513 for reel size information. place insertion. 2. All sample boards include x loose parts. Electrical Specifications: T = +25C A Breakdown Voltage I = 10 A, V = 22 V Minimum R B Reverse Leakage Current V =18 V, I = 100 nA Maximum R R Forward Voltage 1 mA = 1.15 - 1.25 V Parameter Test Conditions Units Min. Typ. Max. 1 MHz, 0 V 0.19 0.275 Total Capacitance 1 MHz, 4 V pF 0.065 0.097 1 MHz, 15 V 0.025 0.048 Q Factor 50 MHz, 4 V 3000 Gamma 2 - 12 V 0.9 1.1 * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. 11 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MAVR-011020-1411 Solderable GaAs Constant Gamma Flip-Chip Rev. V2 Varactor Diode 3,4 Absolute Maximum Ratings Performance Curve +25C Parameter Absolute Maximum 1.00 Power Dissipation 100 mW Mounting Temperature +260C Operating Temperature -40C to +125C 0.10 Storage Temperature -65C to +150C 3. Exceeding any one or combination of these limits may cause permanent damage to this device. 4. MACOM does not recommend sustained operation near these survivability limits. 0.01 1 10 Reverse Bias Voltage (V) Schematic (equivalent circuit) R (V) C (V) L S J S CPARASITIC Mounting Techniques Handling Procedures Die attach for these devices is made simple through The following precautions should be observed to the use of surface mount die attach technology. This avoid damaging these chips: chip was designed to be inserted onto hard or soft substrates with the junction side down. This chip can Cleanliness be mounted with conductive epoxy or with solder. The chips should be handled in a clean environment. Do not attempt to clean die after installation. Solder Die Attach: This device can be mounted with Sn63/Pb37 or Static Sensitivity RoHS compliant solder. Semiconductor devices are ESD sensitive and can be damaged by static electricity. Proper ESD Typical reflow profiles are provided on application techniques should be used when handling these note M538, Surface Mounting Instructions which devices. can be found www.macom.com General Handling Epoxy Die Attach: The protective polymer coating on the active areas This device can also be attached with conductive of these die provides scratch protection, particularly epoxy. The assembly can be preheated to for the metal air bridge which contacts the anode. 125 - 150C. Use a minimum amount of epoxy. Cure Die can be handled with tweezers or vacuum epoxy as per manufacturers instructions. pickups and are suitable for use with automatic pick-and-place equipment. 22 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit:

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free
Aeroflex / Metelics (MACOM)
Aeroflex Metelics
M/A-COM
M/A-COM / TYCO
M/A-COM Technology Solutions
MA/COM
MACOM
Nitronex

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