Product Information

ISP3010-UX-ST

ISP3010-UX-ST electronic component of Insight SiP

Datasheet
RF Modules ISP3010-UX nRF52832 BLE 5 Module
Manufacturer: Insight SiP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 33.3845 ea
Line Total: USD 33.38

48 - Global Stock
Ships to you between
Thu. 02 May to Mon. 06 May
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
48 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 1
Multiples : 1

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ISP3010-UX-ST
Insight SiP

1 : USD 33.3845

Read More Specifications

     
Manufacturer
Product Category
Dimensions
Mounting
Communications Modules Features
Components
Kind Of Architecture
Interface
Additional Functions
Kind Of Network
Type Of Communications Module
Sram Memory Capacity
Operating Temperature
Supply Voltage
Flash Memory Capacity
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Additional Infomation About Product

ISP3010 Built-in Antennas Smart Module Ultra-Wide Band and BluetoothLow Energy This highly miniaturized LGA module, 14 x 14 x 1.5 mm, is based on the DW1000 UWB transceiver and nRF52832 BLE chip. Using a simple user interface via the SPI connection and integrating a Cortex M4 CPU, flash and RAM memory combined with optimized antennas, ISP3010 offers the perfect stand-alone ranging module solution for security bubble applications. For longer range applications, ISP3010 can be used in conjunction with an external UWB antenna. Key Features IEEE802.15.4-2011 UWB compliant Single Mode BLE 5 Ready NFC-A Tag for OOB pairing Spatial resolution better than 10 cm Fully integrated UWB & BLE matching Applications and Antennas Integrated UWB 38.4 MHz and BLE 32 MHz Precision Real Time Location Systems & 32.768 kHz Clocks (RTLS) for Healthcare, Sport and Wellness, Consumer, Industrial DC/DC converters Security bubble UWB section based on DecaWave DW1000 Access control BLE section based on Nordic Semi nRF52 Indoor positioning UWB application controlled by the embedded 32-bit ARM Cortex M4F CPU 512 kB Flash and 64 kB SRAM Pending Certifications Analog and Digital peripherals SPI interface Fully FCC certified module Supply Voltage 1.8 V to 6.0 V Fully CE certified module Very small size 14.0 x 14.0 x 1.5 mm Fully IC certified module Temperature -40 to +85 C Bluetooth SIG certified QDL listing RoHS compliant September 6, 2019 Document Ref: isp uwb DS3010 R1.docx Page 1/25 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. UWB+BLE MODULE ISP3010 Contents 1. Block Diagram .......................................................................................................................................................... 3 2. Specifications ........................................................................................................................................................... 4 2.1. General Notice ..............................................................................................................................................4 2.2. Absolute Maximum Ratings ...........................................................................................................................4 2.3. Operating Conditions ....................................................................................................................................4 2.4. Current Consumption ....................................................................................................................................5 2.5. Clock Sources...............................................................................................................................................5 2.6. Radio Specifications......................................................................................................................................6 2.7. Electrical Schematic ......................................................................................................................................8 3. Pin Description ......................................................................................................................................................... 9 4. Mechanical Outlines............................................................................................................................................... 11 4.1. Mechanical Dimensions .............................................................................................................................. 11 4.2. SMT Assembly Guidelines .......................................................................................................................... 13 4.3. Antenna Keep-Out Zone ............................................................................................................................. 13 5. Product Development Tools ................................................................................................................................. 14 5.1. Hardware .................................................................................................................................................... 14 5.2. Firmware .................................................................................................................................................... 14 5.3. Development Tools ..................................................................................................................................... 15 6. Reference Design ................................................................................................................................................... 16 6.1. Anchor Board Design .................................................................................................................................. 16 6.2. Tag Board Design ....................................................................................................................................... 18 7. Packaging & Ordering information ...................................................................................................................... 19 7.1. Marking ....................................................................................................................................................... 19 7.2. Prototype Packaging ................................................................................................................................... 19 7.3. Jedec Trays ................................................................................................................................................ 19 7.4. Tape and Reel ............................................................................................................................................ 20 7.5. Ordering Information ................................................................................................................................... 20 8. Storage & Soldering information .......................................................................................................................... 21 8.1. Storage and Handling ................................................................................................................................. 21 8.2. Moisture Sensitivity ..................................................................................................................................... 21 8.3. Soldering information .................................................................................................................................. 22 9. Quality & User information .................................................................................................................................... 23 9.1. Pending Certifications ................................................................................................................................. 23 9.2. USA User information .............................................................................................................................. 23 9.3. Canada User information ......................................................................................................................... 23 9.4. RF Exposure Information ............................................................................................................................ 24 9.5. Informations concernant l exposition aux frquences radio (RF) .................................................................. 24 9.6. Discontinuity ............................................................................................................................................... 24 9.7. Disclaimer ................................................................................................................................................... 25 September 6, 2019 Document Ref: isp uwb DS3010 R1.docx Page 2/25 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

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