Product Information

GS71116AU-10I

GS71116AU-10I electronic component of GSI Technology

Datasheet
SRAM 3.3V 64K x 16 1M I Temp

Manufacturer: GSI Technology
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 6.269 ea
Line Total: USD 6.27

159 - Global Stock
Ships to you between
Tue. 07 May to Thu. 09 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
159 - Global Stock


Ships to you between Tue. 07 May to Thu. 09 May

MOQ : 1
Multiples : 1

Stock Image

GS71116AU-10I
GSI Technology

1 : USD 4.646
10 : USD 4.2205
100 : USD 3.68
240 : USD 3.657
480 : USD 3.519
1200 : USD 3.3465
2640 : USD 3.1855
5040 : USD 2.898
10080 : USD 2.8175

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Memory Size
Organization
Access Time
Interface Type
Supply Voltage - Max
Supply Voltage - Min
Maximum Operating Temperature
Minimum Operating Temperature
Mounting Style
Package / Case
Supply Current - Max
Memory Type
Series
Type
Brand
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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GS71116AGP/U 7, 8, 10, 12 ns TSOP, FP-BGA 64K x 16 3.3 V V DD Commercial Temp Center V and V 1Mb Asynchronous SRAM DD SS Industrial Temp Features Fine Pitch BGA 64K x 16-Bump Configuration Fast access time: 7, 8, 10, 12 ns 1 2 3 4 5 6 CMOS low power operation: 145/125/100/85 mA at minimum cycle time Single 3.3 V power supply LB OE A0 A1 A2 NC A All inputs and outputs are TTL-compatible Byte control B DQ16 UB A3 A4 CE DQ1 Fully static operation Industrial Temperature Option: 40 to 85C C DQ14 DQ15 A5 A6 DQ2 DQ3 Package line up V V D DQ13 NC A7 DQ4 GP: RoHS-compliant 400 mil, 44-pin TSOP Type II SS DD package V V E DQ12 NC NC DQ5 DD SS U: 6 mm x 8 mm Fine Pitch Ball Grid Array package GU: RoHS-compliant 6 mm x 8 mm Fine Pitch Ball Grid F DQ11 DQ10 A8 A9 DQ7 DQ6 Array package G DQ9 NC A10 A11 WE DQ8 Description H NC A12 A13 A14 A15 NC The GS71116A is a high speed CMOS static RAM organized as 65,536-words by 16-bits. Static design eliminates the need for external clocks or timing strobes. Operating on a single 6 mm x 8 mm, 0.75 mm Bump Pitch (Package U) 3.3 V power supply and all inputs and outputs are TTL- Top View compatible. The GS71116A is available in the 6 mm x 8 mm Fine Pitch BGA and 400 mil TSOP Type-II packages. TSOP-II 64K x 16-Pin Configuration 44 1 A4 A5 Pin Descriptions 43 A3 2 A6 42 A2 3 A7 Symbol Description 41 A1 4 OE Top view A0A15 Address input 40 5 A0 UB 39 6 CE LB DQ1DQ16 Data input/output 38 7 DQ1 DQ16 CE Chip enable input 37 DQ2 8 DQ15 36 Lower byte enable input DQ3 9 DQ14 LB 35 DQ4 10 (DQ1 to DQ8) DQ13 44-pin 34 11 V DD V Upper byte enable input SS 33 12 UB V V SS DD (DQ9 to DQ16) TSOP II 32 13 DQ5 DQ12 31 WE Write enable input 14 DQ6 DQ11 30 15 DQ7 DQ10 OE Output enable input 29 16 DQ8 DQ9 V +3.3 V power supply 28 DD 17 WE NC 27 18 A15 A8 V Ground SS 26 19 A14 A9 NC No connect 20 25 A13 A10 21 24 A12 A11 NC 22 23 NC Package TP Rev: 1.10 1/2013 1/13 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS71116AGP/U Block Diagram A0 Row Memory Array Decoder Address Input Buffer Column Decoder A15 CE WE I/O Buffer Control OE _____ UB DQ1 DQ16 Truth Table V Current CE OE WE LB UB DQ1 to DQ8 DQ9 to DQ16 DD H X X X X Not Selected Not Selected ISB1, ISB2 L L Read Read L L H L H Read High Z H L High Z Read L L Write Write IDD L X L L H Write Not Write, High Z H L Not Write, High Z Write L H H X X High Z High Z L X X H H High Z High Z Note: X: H or L Rev: 1.10 1/2013 2/13 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

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