25SMT-3645-46

GORE EMI Shielding terials ma SMT Series Excellent electrical performance with SMT convenience The Surface-Mount Technology (SMT) Series of GORE EMI Shielding Materials combines unsurpassed conductivity with the convenience of SMT-compatible format. These conformable materials are engineered to maintain consistent contact and low DC resistance. Unlike the traditional designs of pogo pins and universal clips that can easily break, the robust design of the SMT Series increases durability with large contact surfaces rather than single-point contacts. The unique construction of the SMT Series ensures that the device maintains signal integrity and reliable electrical performance in harsh environments. Because of their compatibility with SMT equipment for printed circuit board production, the SMT Series reduces total costs. Using these off-the-shelf materials eliminates the need for custom designs that can increase engineering costs. Also, no secondary processing is required, which reduces equipment Benefits of GORE EMI Shielding and labor costs during production. Using precise SMT equip- Materials SMT Series ment to incorporate GORE EMI Shielding Materials improves the consistency and repeatability of PCB assembly, thus Excellent shielding effectiveness and low DC resistance with conformable construction decreasing waste. Reliable electrical performance achieved through The SMT Series of GORE EMI Shielding Materials offers a consistent contact over time full spectrum of working ranges, making them ideal for use Reduced total costs versus custom options due to as grounding pads, EMI gaskets, and antenna contacts. The standard sizes and compatibility with SMT technology highly compressible SMT Supersoft Series delivers consistent Increased design flexibility with easily integrated electrical performance with minimal force required for standard parts initial conductivity. The SMT GS5200 Series offers the most conductive materials under compression in Gores complete Consistent and repeatable assembly with parts that need no secondary processing product line of EMI shielding materials. In addition to these high-performance characteristics, the SMT Series has been Enhanced durability due to conformable material that maintains contact over time without compromising the tested against a variety of environmental standards (Table 1). integrity of the mating surface Faster production times because of standard solder process that requires no cure time Typical Applications Portable electronic devices such as smartphones and tablets GPS and handheld scanners/readers Telematics Gaming devices Personal computers and laptops Telecommunication infrastructure GORE EMI Shielding Materials - SMT Series is covered by patent No. US 6,255,581 B1, US 6,210,789 B1. Corresponding foreign patents issued. GORE EMI Shielding Materials - SMT Supersoft Series is covered by patent No. US 6,255,581 B1, US 7,129,421 B2. Corresponding foreign patents issued. PHASEFLEX GORE EMI Shielding Micro ve/ r F Tes T a s M MATERIALS Table 1: Environmental Properties Figure 1: Recommended Service Heights for SMT Supersoft Series Property Value 2.30 2.2mm 2.2mm 18 psi 2.20 28 psi 2.30 2.10 RoHS Status* (lead, cadmium, hexavalent Pass 2.2mm 18 psi 2.2mm 2.20 2.00 28 psi chromium, mercury, bromine) 1.9mm 1.9mm 48 psi 2.10 1.90 55 psi 2.00 1.80 1.9mm 48 psi 1.9mm 1.90 1.70 Flammability in accordance with UL 55 psi Pass 1.80 1.60 horizontal burn method 1.6mm 1.6mm 102 psi 1.70 1.5mm 12 psi 82 psi 1.50 1.60 *W. L. Gore & Associates declares that we do not intentionally add substances listed in EU Dir ective 1.40 1.6mm 1.6mm 102 psi 2011/65/EU to the Surface-Mount Technology Series of GORE EMI Shielding Materials. Indepen- 1.5mm 12 psi 82 psi 1.50 1.30 dent lab tests have been performed and results are available upon request. 1.40 1.2mm 41 psi 1.20 1.30 1.10 1.2mm 41 psi 1.20 1.00 1.10 0.90 0.9mm 139 psi 1.00 Selection Guidelines 0.90 25SMT-4442-01 25SMT-4442-03 25SMT-4442-04 0.9mm 139 psi The gaskets and grounding pads of the SMT Series are 25SMT-4442-01 25SMT-4442-03 25SMT-4442-04 engineered to maintain conductivity in a wide range of service heights (gap distances). The closure force requirements and Figure 2: Recommended Service Heights for broad range of tolerance take-up in these materials results in SMT GS5200 Series 1.25 multiple product options for some gap distances. Selecting the 1.22mm 26 psi most suitable product for a given application depends on the 1.15 1.25 1.22mm following: 26 psi 1.06mm 11..1055 516 psi Gap distance of interfacing surfaces 0.95mm 1.06mm 10..0955 903 psi 516 psi Required compression force to achieve the specified gap 0.95mm 0.85 0.95 903 psi distance 0.81mm 13 psi 0.80.755 Necessary DC resistance for grounding applications or 0.81mm 13 psi 0.71mm 516 psi 0.66mm 19 psi 0.70.655 shielding effectiveness for shielding applications at a 0.58mm 0.71mm 516 psi 0.66mm 0.59mm 1807 psi specific gap distance 774 psi 00..6555 19 psi 0.58mm 0.46mm 4 psi 0.54mm 2065 psi 0.59mm 1807 psi The recommended service height for the various products in 774 psi 0.55 0.45 0.41mm 387 psi 0.46mm 4 psi 0.54mm 2065 psi the SMT Series differs because of their unique constructions 0.39mm 2323 psi 0.40.355 0.41mm 387 psi (Figures 1 & 2). 0.50mm Thk 0.72mm Thk 0.84mm Thk 1.30mm Thk 0.39mm 2323 psi 0.35 0.50mm Thk 0.72mm Thk 0.84mm Thk 1.30mm Thk Page 2 Thickness (mm) Thickness (mm) Thickness (mm) Thickness (mm) blies se wa