GT24C512B Advanced GT24C512B 2-WIRE 512K Bits Serial EEPROM Copyright 2014 Giantec Semiconductor Inc. (Giantec). All rights reserved. Giantec reserves the right to make changes to this specification and its products at any time without notice. Giantec products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for critical medical or surgical equipment, aerospace or military, or other applications planned to support or sustain life. It is the customer s obligation to optimize the design in their own products for the best performance and optimization on the functionality and etc. Giantec assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and prior placing orders for products. Giantec Semiconductor, Inc. www.giantec-semi.com A2 1/21 GT24C512B Table of Contents 1. Features ...................................................................................................................................................................... 3 2. General Description .............................................................................................................................................. 3 3. Functional Block Diagram ................................................................................................................................. 4 4. Pin Configuration.................................................................................................................................................... 5 4.1 8-Pin SOIC, TSSOP and MSOP ............................................................................................................. 5 4.2 8-Lead UDFN .......................................................................................................................................... 5 4.3 Pin Definition ........................................................................................................................................... 5 4.4 Pin Descriptions ...................................................................................................................................... 5 5. Device Operation .................................................................................................................................................... 6 5.1 2-WIRE Bus ............................................................................................................................................ 6 5.2 The Bus Protocol .................................................................................................................................... 6 5.3 Start Condition ........................................................................................................................................ 6 5.4 Stop Condition ......................................................................................................................................... 6 5.5 Acknowledge ........................................................................................................................................... 6 5.6 Reset ....................................................................................................................................................... 6 5.7 Standby Mode ......................................................................................................................................... 6 5.8 Device Addressing .................................................................................................................................. 6 5.9 Write Operation ....................................................................................................................................... 7 5.10 Read Operation ..................................................................................................................................... 8 5.11 ECC (Error Correction Code) and Write cycling ................................................................................... 8 5.12 Diagrams ............................................................................................................................................... 9 5.12 Timing Diagrams ................................................................................................................................. 12 6. Electrical Characteristics ............................................................................................................................... 13 6.1 Absolute Maximum Ratings .................................................................................................................. 13 6.2 Operating Range ................................................................................................................................... 13 6.3 Capacitance .......................................................................................................................................... 13 6.4 Reliability ............................................................................................................................................... 13 6.5 DC Electrical Characteristic .................................................................................................................. 14 6.5 AC Electrical Characteristic .................................................................................................................. 15 7. Ordering Information .......................................................................................................................................... 16 8. Top Markings .......................................................................................................................................................... 17 8.1 SOIC Package ...................................................................................................................................... 17 8.2 TSSOP Package ................................................................................................................................... 17 8.3 UDFN Package ..................................................................................................................................... 17 9. Package Information .......................................................................................................................................... 18 9.1 SOIC ..................................................................................................................................................... 18 9.2 TSSOP .................................................................................................................................................. 19 9.3 UDFN .................................................................................................................................................... 20 10. Revision History ................................................................................................................................................. 21 Giantec Semiconductor, Inc. www.giantec-semi.com A2 2/21