Product Information

G3R160MT17D

G3R160MT17D electronic component of GeneSiC Semiconductor

Datasheet
MOSFET 1700V 160mO TO-247-3 G3R SiC MOSFET

Manufacturer: GeneSiC Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 12.7305 ea
Line Total: USD 12.73

2136 - Global Stock
Ships to you between
Wed. 08 May to Fri. 10 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2136 - Global Stock


Ships to you between Wed. 08 May to Fri. 10 May

MOQ : 1
Multiples : 1

Stock Image

G3R160MT17D
GeneSiC Semiconductor

1 : USD 12.7305
10 : USD 11.638
30 : USD 11.3735
120 : USD 10.695
270 : USD 10.603
510 : USD 10.603
1020 : USD 10.4075
2520 : USD 9.9935

     
Manufacturer
Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Hts Code
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TM G3R160MT17D 1700 V 160 m SiC MOSFET Silicon Carbide MOSFET VDS = 1700 V N-Channel Enhancement Mode DS(ON)(Typ.) R = 160 m ID (TC = 100C) = 12 A Features Package D G3R Technology with +15 V Gate Drive Softer RDS(ON) v/s Temperature Dependency LoRing - Electromagnetically Optimized Design G RoHS Smaller RG(INT) and Lower QG Low Device Capacitances (C , C ) OSS RSS S Superior Cost-Performance Index D = Drain Robust Body Diode with Low VF and Low QRR G = Gate TO-247-3 Industry-Leading UIL & Short-Circuit Robustness S = Source REACH Advantages Applications Compatible with Commercial Gate Drivers Solar Inverter Low Conduction Losses at all Temperatures EV Fast Charging Reduced Ringing Switched Mode Power Supply (SMPS) Faster and More Efficient Switching Auxiliary Power Supply Lesser Switching Spikes and Lower Losses High Voltage Converter Better Power Density and System Efficiency Pulsed Power Ease of Paralleling without Thermal Runaway Higher System Reliability Absolute Maximum Ratings (At T = 25C Unless Otherwise Stated) C Parameter Symbol Conditions Values Unit Note Drain-Source Voltage V V = 0 V, I = 100 A 1700 V DS(max) GS D Gate-Source Voltage (Dynamic) VGS(max) -10 / +20 V Gate-Source Voltage (Static) V Recommended Operation -5 / +15 V GS(op) T = 25C, V = -5 / +15 V 17 C GS Continuous Forward Current ID TC = 100C, VGS = -5 / +15 V 12 A Fig. 15 TC = 135C, VGS = -5 / +15 V 9 Pulsed Drain Current I t 3s, D 1%, V = 15 V, Note 1 32 A Fig. 14 D(pulse) P GS Power Dissipation P T = 25C 138 W Fig. 16 D c Non-Repetitive Avalanche Energy EAS L = 12.6 mH, IAS = 5.0 A 158 mJ Operating and Storage Temperature T , T -55 to 175 C j stg Thermal/Package Characteristics Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Thermal Resistance, Junction - Case R 0.85 1.09 C/W Fig. 13 thJC Weight WT 6.1 g Mounting Torque T Screws to Heatsink 1.1 Nm M Note 1: Pulse Width t Limited by T P j(max) Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R160MT17D/G3R160MT17D.pdf Page 1 of 14TM G3R160MT17D 1700 V 160 m SiC MOSFET Electrical Characteristics (At T = 25C Unless Otherwise Stated) C Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Drain-Source Breakdown Voltage V V = 0 V, I = 100 A 1700 V DSS GS D Zero Gate Voltage Drain Current I V = 1700 V, V = 0 V 1 A DSS DS GS V = 0 V, V = 20 V 100 DS GS Gate Source Leakage Current IGSS nA V = 0 V, V = -10 V -100 DS GS VDS = VGS, ID = 10.0 mA 1.8 2.70 Gate Threshold Voltage V V Fig. 9 GS(th) VDS = VGS, ID = 10.0 mA, Tj = 175C 1.90 V = 10 V, I = 10 A 4.6 DS D Transconductance g S Fig. 4 fs V = 10 V, I = 10 A, T = 175C 4.8 DS D j V = 15 V, I = 10 A 160 224 GS D Drain-Source On-State Resistance R m Fig. 5-8 DS(ON) V = 15 V, I = 10 A, T = 175C 321 GS D j Input Capacitance Ciss 854 Output Capacitance C 23 pF Fig. 11 oss Reverse Transfer Capacitance C 4.1 rss Coss Stored Energy Eoss 15 J Fig. 12 V = 1000 V, V = 0 V DS GS C Stored Charge Q 46 nC oss oss f = 1 MHz, VAC = 25mV Effective Output Capacitance (Energy Co(er) 30 Related) pF Note 2 Effective Output Capacitance (Time Co(tr) 46 Related) Gate-Source Charge Q 9 gs V = 1000 V, V = -5 / +15 V DS GS Gate-Drain Charge Q I = 10 A 9 nC Fig. 10 gd D Per IEC607478-4 Total Gate Charge Q 29 g Internal Gate Resistance R f = 1 MHz, V = 25 mV 1.6 G(int) AC Turn-On Switching Energy EOn 128 (Body Diode) T = 25C, V = -5/+15V, R = 8 , L = j GS G(ext) J Fig. 22,26 220.0 H, I = 10 A, V = 1200 V Turn-Off Switching Energy D DD EOff 45 (Body Diode) Turn-On Delay Time t 22 d(on) V = 1200 V, V = -5/+15V DD GS Rise Time tr 12 RG(ext) = 8 , L = 220.0 H, ID = 10 A ns Fig. 24 Turn-Off Delay Time t 17 d(off) Timing relative to V , Inductive load DS Fall Time t 10 f *The chip technology was characterized up to 200 V/ns. The measured dV/dt was limited by measurement test setup and package. Note 2: C , a lumped capacitance that gives same stored energy as C while V is rising from 0 to 1000V. o(er) OSS DS C , a lumped capacitance that gives same charging times as C while V is rising from 0 to 1000V. o(tr) OSS DS Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R160MT17D/G3R160MT17D.pdf Page 2 of 14

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
GENESIC SEMI
GENESIC SEMICONDUCTOR INC.

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