Product Information

BSC9132NXE7KNKB

BSC9132NXE7KNKB electronic component of NXP

Datasheet
MPU RISC 32bit 1GHz 780-Pin FCBGA EACH

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

60: USD 141.1918 ea
Line Total: USD 8471.508

0 - Global Stock
MOQ: 60  Multiples: 60
Pack Size: 60
     
Manufacturer
Product Category
Core
Maximum Clock Frequency
Mounting Style
Maximum Operating Temperature
Packaging
Brand
Rohs Mouser
Operating Temperature Classification
Operating Temp Range
Rad Hardened
Instruction Set Architecture
Package Type
Pin Count
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
C292NSE7KLA electronic component of NXP C292NSE7KLA

Microprocessors - MPU CRYPTO COPROCESSOR SOC, 2XSEC, POWER ARCH 32 BIT 1000MHZ, 2XGB ENET, DDR3/3L
Stock : 0

C291NSE7FHA electronic component of NXP C291NSE7FHA

Processors - Application Specialised 32 Bit 667MHz 2XGb Enet DDR3/3L
Stock : 0

CWA-BASIC-R electronic component of NXP CWA-BASIC-R

Integrated Development Environment (IDE) 1 Year Renewal Code Warrior™ Software Programming
Stock : 0

Image Description
BX80547PG3800F S L8ZB electronic component of Intel BX80547PG3800F S L8ZB

PENTIUM 4 PROCESSOR 6XX SEQUENCE
Stock : 0

NCP300HSN09T1G electronic component of ON Semiconductor NCP300HSN09T1G

Supervisory Circuits 0.9V Detector w/Reset High
Stock : 5870

NCP302LSN30T1G electronic component of ON Semiconductor NCP302LSN30T1G

Supervisory Circuits 3.0V Detector w/Reset Low
Stock : 0

NCP305LSQ34T1G electronic component of ON Semiconductor NCP305LSQ34T1G

Supervisory Circuits 3.4V Detector w/Reset Low
Stock : 980

NCP803SN293D2T1G electronic component of ON Semiconductor NCP803SN293D2T1G

Supervisor Open Drain or Open Collector 1 Channel SOT-23-3 (TO-236)
Stock : 974

NCV303LSN45T1G electronic component of ON Semiconductor NCV303LSN45T1G

Supervisory Circuits ANA UNDERVOLT DETECT
Stock : 6

NCV809STRG electronic component of ON Semiconductor NCV809STRG

ON Semiconductor Supervisory Circuits ANA 2.93V MCROPROC RESET
Stock : 29360

HT46R47 electronic component of Holtek HT46R47

HOLTEK DIP-18 RoHS
Stock : 0

NUC123LD4AN0 electronic component of Nuvoton NUC123LD4AN0

ARM® Cortex®-M0 NuMicro™ NUC123 Microcontroller IC 32-Bit Single-Core 72MHz 68KB (68K x 8) FLASH
Stock : 0

20-101-0454 electronic component of Digi International 20-101-0454

RabbitCore® Embedded Module Rabbit 2000 22.1MHz 128KB 256KB
Stock : 0

Freescale Semiconductor Document Number: BSC9132 Data Sheet: Technical Data Rev. 0, 03/2014 BSC9132 BSC9132 QorIQ Qonverge Multicore Baseband FC-PBGA780 23 mm x 23 mm Processor The following list provides an overview of the feature set: TCP/IP acceleration, quality of service, and classification capabilities Two high-performance 32-bit e500 cores built on Power IEEE Std 1588 support Architecture technology: Supports SGMII interfaces 36-bit physical addressing High-speed interfaces supporting the following Double-precision floating-point support multiplexing options: 32-Kbyte L1 instruction cache and 32-Kbyte L1 data One PCI Express interface with 5G support cache Four lanes of high-speed serial interfaces (SerDes) to be Enhanced hardware and software debug support shared between PCI Express, SGMII, and CPRI 800 Mhz/1 GHz/1.2 GHz clock frequency High-speed USB controller (USB 2.0) 512-Kbyte L2 cache with ECC; also configurable as Host and device support SRAM and stashing memory Enhanced host controller interface (EHCI) Two SC3850 core subsystems; each core connects to the ULPI interface following: Enhanced secure digital (SD/MMC) host controller 32 Kbyte 8-way level 1 data/instruction cache (eSDHC) (L1 Dcache/ICache) Integrated Flash controller (IFC), supporting NAND, 512 Kbyte 8-way level 2 unified instruction/data cache NOR, and general ASIC (L2 cache/M2 memory) Two TDM interfaces Memory management unit (MMU) Antenna interface controller (AIC), supporting four Enhanced programmable interrupt controller (EPIC) industry standard JESD/four custom parallel RF interfaces Debug and profiling unit (DPU) (three dual and one single port) and a 2-lane CPRI interface Two 32-bit quad timers Universal Subscriber Identity Module (USIM) interface 32 Kbytes of shared M3 memory Facilitates communication to SIM cards or Eurochip Multi Accelerator Platform Engine for Pico Base Station pre-paid phone cards Baseband Processing (MAPLE-B2P) Two enhanced serial peripheral interfaces (eSPI) Supports variable sizes in Fourier Transforms, Programmable interrupt controller (PIC) compliant with Convolution, Filtering, Turbo, Viterbi, Chiprate, MIMO OpenPIC standard Consists of accelerators for UMTS chip rate processing, Two DMA controllers LTE UP/DL channel processing, Matrix Inversion 4-channel DMA on Power Architecture side operations, and CRC algorithms 32 unidirectional channels, providing up to 16 Two DDR3/DDR3L SDRAM memory controllers support memory-to-memory channels on DSP side 32-bit with ECC 2 Two I C interfaces Integrated security engine (ULE CAAM) Two dual UART (DUART) interfaces Protocol support includes DES, AES, RNG, CRC, MDE, 96 general-purpose I/O signals PKE, SHA, and MD5 Eight 32-bit timers Secure boot capability Operating temperature (Ta - T ) range: 0105 C Two enhanced three-speed Ethernet controllers (eTSECs) j 2014 Freescale Semiconductor, Inc. All rights reserved.Table of Contents 1 Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 2.22 Universal Subscriber Identity Module (USIM) . . . . . . 106 1.1 Ball Layout Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2.23 Timers and Timers_32b AC Timing Specifications . . 110 1.2 Pinout Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3 Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . 111 2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 3.1 Power Architecture System Clocking. . . . . . . . . . . . . 111 2.1 Overall DC Electrical Characteristics . . . . . . . . . . . . . .36 3.2 DSP System Clocking . . . . . . . . . . . . . . . . . . . . . . . . 114 2.2 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 3.3 Supply Power Default Setting . . . . . . . . . . . . . . . . . . 115 2.3 Power-Down Requirements . . . . . . . . . . . . . . . . . . . . .42 3.4 PLL Power Supply Design . . . . . . . . . . . . . . . . . . . . . 116 2.4 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . .42 3.5 Decoupling Recommendations . . . . . . . . . . . . . . . . . 117 2.5 Power-on Ramp Rate . . . . . . . . . . . . . . . . . . . . . . . . . .43 3.6 SerDes Block Power Supply Decoupling 2.6 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .43 Recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . 118 2.7 Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 3.7 Guidelines for High-Speed Interface Termination . . . 119 2.8 DDR3 and DDR3L SDRAM Controller . . . . . . . . . . . . .48 3.8 Pull-Up and Pull-Down Resistor Requirements. . . . . 119 2.9 eSPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 3.9 Output Buffer DC Impedance . . . . . . . . . . . . . . . . . . 120 2.10 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 3.10 Configuration Pin Muxing . . . . . . . . . . . . . . . . . . . . . 120 2.11 Ethernet: Enhanced Three-Speed Ethernet (eTSEC) .59 3.11 JTAG Configuration Signals. . . . . . . . . . . . . . . . . . . . 121 2.12 USB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 3.12 Guidelines for High-Speed Interface Termination . . . 123 2.13 Integrated Flash Controller (IFC) . . . . . . . . . . . . . . . . .66 3.13 Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 2.14 Enhanced Secure Digital Host Controller (eSDHC) . . .70 3.14 Security Fuse Processor . . . . . . . . . . . . . . . . . . . . . . 124 2.15 Programmable Interrupt Controller (PIC) Specifications72 4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 2.16 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75 4.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . 124 2 2.17 I C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 4.2 Mechanical Dimensions of the FC-PBGA . . . . . . . . . 125 2.18 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79 5 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 2.19 TDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81 5.1 Part Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 2.20 High-Speed Serial Interface (HSSI) DC Electrical 6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 2.21 Radio Frequency (RF) Interface . . . . . . . . . . . . . . . . .103 BSC9132 QorIQ Qonverge Baseband Processor Data Sheet, Rev. 0 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted