Product Information

SE4420

SE4420 electronic component of DOWSIL

Datasheet
ADHESIVE, TH/ CONDUCTIVE, RTV, 330ML

Manufacturer: DOWSIL
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 149.5192 ea
Line Total: USD 149.52

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 02 May to Wed. 08 May

MOQ : 1
Multiples : 1

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SE4420
DOWSIL

1 : USD 149.5192

     
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Adhesive Colour
Thermal Conductivity
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Product Information Electronics Dow Corning SE 4420 Thermally Conductive Adhesive FEATURES & BENEFITS One part, white, moisture cure, thermally conductive silicone adhesive One part material Semi-flowable APPLICATIONS Fast tack-free time Dow Corning SE 4420 Thermally Conductive Adhesive is designed to Good adhesion provide efficient thermal transfer for the cooling of electronic modules, Thermally conductive including telecom and power supply devices. COMPOSITION TYPICAL PROPERTIES Thermally conductive filler Specification Writers: These values are not intended for use in preparing Polydimethylsiloxane adhesive specifications. Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on this product. Property Unit Result One part or two part - One Color - White Fluidity mm 48 inches 1.9 Specific gravity (cured) - 2.26 NVC (Non volatile content) % 98 Tack-Free time at 25C minutes 8 Tensile strength psi 600 MPa 4.1 2 kg/cm 42.2 Elongation % 77 * Durometer Shore A (JIS ) - 76 Unprimed adhesion - Lap shear to aluminum psi 390 MPa 2.7 2 N/cm 267 Thermal conductivity Btu/hr-ft-F 0.53 W/mK 0.92 * JIS: Japanese Industrial Standard. in the area of consumer electronics, DESCRIPTION there is also a continual trend towards One-part RTV-cure thermally smaller, more compact designs. In conductive materials cure with combination these factors typically moisture exposure to produce durable, mean that more heat is generated in the relatively low-stress elastomer with a device. Thermal management of noncorrosive by-product. Electronic electronic devices is a primary concern devices are continually designed to of design engineers. A cooler device deliver higher performance. Especially allows for more efficient operation polyethylene or polypropylene. SOLVENT EXPOSURE and better reliability over the life of Special surface treatments such as In general, the product is resistance to the device. As such, thermally chemical etching or plasma treatment minimal or intermittent solvent conductive compounds play an can sometimes provide a reactive exposure, however best practice is to integral role here. Thermally surface and promote adhesion to these avoid solvent exposure altogether. conductive materials act as a thermal types of substrates. Dow Corning bridge to remove heat from a heat brand primers can be used to increase USABLE LIFE AND source (device) to the ambient via a the chemical activity on difficult STORAGE heat transfer media (i.e. heat sink). substrates. For best results, the primer The product should be stored in its These materials have properties such should be applied in a very thin, original packaging with the cover as low thermal resistance, high uniform coating and then wiped off tightly attached to avoid any thermal conductivity, and can achieve after application. After application, contamination. Store in accordance thin Bond Line Thicknesses (BLTs) primers should be thoroughly air dried with any special instructions listed on which can help to improve the transfer prior to application of the silicone the product label. The product should of heat away from the device. elastomer. Alternatively, use a low- be used by the indicated Expiration viscosity primerless adhesive to pot Date found on the label. your components. Poor adhesion can APPLICATION METHODS be experienced on plastic or rubber Manual or automated dispensing HANDLING substrates that are highly plasticized, since the mobile plasticizers act as PRECAUTIONS SUBSTRATE TESTING release agents. Small-scale laboratory PRODUCT SAFETY To ensure maximum bond strength for evaluation of all substrates is INFORMATION REQUIRED FOR adhesives on a particular substrate, recommended before production trials SAFE USE IS NOT INCLUDED IN 100 percent cohesive failure of the are made. In general, increasing the THIS DOCUMENT. BEFORE adhesive in a lap shear or similar cure temperature and/or cure time will HANDLING, READ PRODUCT adhesive strength test is needed. This improve the ultimate adhesion. AND MATERIAL SAFETY DATA ensures compatibility of the adhesive SHEETS AND CONTAINER with the substrate being considered. LABELS FOR SAFE USE, USEFUL TEMPERATURE Also, this test can be used to PHYSICAL AND HEALTH RANGES determine minimum cure time or to HAZARD INFORMATION. THE For most uses, silicone adhesives detect the presence of surface MATERIAL SAFETY DATA should be operational over a contaminants such as mold release SHEET IS AVAILABLE ON THE temperature range of -45 to 200C agents, oils, greases and oxide films. DOW CORNING WEBSITE AT (-49 to 392F) for long periods of DOWCORNING.COM, OR FROM time. However, at both the low and PROCESSING/CURING YOUR DOW CORNING SALES high temperature ends of the The one-part moisture-cure adhesives APPLICATION ENGINEER, OR spectrum, behavior of the materials are generally cured at room DISTRIBUTOR, OR BY CALLING and performance in particular temperature and in a range of 0 to 80 DOW CORNING CUSTOMER applications can become more percent relative humidity. Greater than SERVICE. complex and require additional 90 percent of their full physical considerations. For low-temperature properties should be attained within LIMITATIONS performance, thermal cycling to 4 to 7 hours depending on the product This product is neither tested nor conditions such as -55C (-67F) may chosen. These materials are not represented as suitable for medical or be possible for most products, but typically used for highly confined or pharmaceutical uses. performance should be verified for deep section cures. Materials will your parts or assemblies. Factors that generally cure about 0.25 inch may influence performance are HEALTH AND (6.35 mm) per 7 days. configuration and stress sensitivity of ENVIRONMENTAL components, cooling rates and hold INFORMATION ADHESION times, and prior temperature history. Dow Corning brand silicone To support customers in their product At the high-temperature end, the safety needs, Dow Corning has an adhesives are specially formulated to durability of the cured silicones is provide unprimed adhesion to many extensive Product Stewardship time and temperature dependent. As organization and a team of Product reactive metals, ceramics and glass, as expected, the higher the temperature, well as to selected laminates, resins Safety and Regulatory Compliance the shorter the time the material will (PS&RC) specialists available in each and plastics. However, good adhesion remain useable. cannot be expected on non-reactive area. metal substrates or non-reactive plastic surfaces such as Teflon , Dow Corning is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation. XIAMETER is a registered trademark of Dow Corning Corporation. 2014, October 23 Teflon is a registered trademarks of E. I. du Pont de Nemours and Company or its affiliates. Form No. 11-3061A-01 2013 - 2014 Dow Corning Corporation. All rights reserved. 2

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