SCALABLE HIGH-
PERFORMANCE
SYSTEM-ON-MODULE
DIGI CONNECTCORE 6
NXP i.MX6 based surface-mount module solution with scalable, single-/multi-core
performance and integrated wireless
The ConnectCore 6 is an ultra-compact and highly integrated BLOCK DIAGRAM
system-on-module solution based on the NXP i.MX6 Cortex-A9
SYSTEM CONTROL CONNECTIVITY
processor family.
Secure JTAG
Imaging Processing Unit MMC 4.4/SD 3.0 x3
802.11
a/b/g/n
Quad ARM Cortex-A9 Core
PLL, Osc.
MMC 4.4/SDXC
With processor speeds up to 1.2 GHz and fully pin-compatible
Bluetooth
Clock and Reset 32 KB I-Cache 32 KB D-Cache
UART x5, 5 Mbps
single-/dual-/quad-core variants, the ConnectCore 6 offers a 4.0
per Core per Core
Smart DMA
2
NEON per Core PTM per Core I C x3, SPI x5
truly future-proof platform solution with scalable performance
IOMUX
2
and pre-certified wireless 802.11 a/b/g/n and Bluetooth 4.0, ESAI, I S/SSI x3
1 MB L2-Cache + VFPv3
Timer x3
including Bluetooth Low Energy, connectivity. 3.3V GPIO
PWM x4
MULTIMEDIA
Watch Dog x2 Keypad
Kinetis
Its low-profile, surface-mount design maximizes integration Hardware Graphics Accelerators
KL2/K20
POWER 3D 2D Vector Graphics S-ATA and PHY 3 Gbps
flexibility and significantly reduces design risk in a highly
MANAGEMENT
USB2 OTG and PHY
Power Supplies
cost-effective, reliable form factor with optimized heat Video Codes Audio
USB2 Host and PHY
Temperature 1080p30 Enc/Dec ASRC
dissipation capabilities even in the most demanding quad-
Monitor
USB2 HSIC Host x2
core system configurations.
Imaging Processing Unit
INTERNAL
MIPI HSI
Up to 64 GB
MEMORY
Resizing and Blending
eMMC Flash
ROM RAM
The ConnectCore 6 comes with a complete Board Support S/PDIF Tx/Rx
Inversion/Rotation
Up to
Package (BSP) for both Linux and Android platforms
PCIe 2.0 (1-Lane)
SECURITY Image Enhancement 4 GB DDR3
(64-bit)
RNG
supporting secure remote management and web services FlexCAN x2
Display and Camera Interface MLB150 + DTCP
TrustZone
through Digi Remote Manager .
HDMI and PHY
1 Gb Ethernet +
IEEE 1588
Ciphers
MIPI DSI
NAND Cntrl. (BCH40)
Security Cntrl
MIPI CSI2
24-bit RGB, LVDS (x2) LP-DDR2, DDR3/
Dialog
Secure RTC
BENEFITS DA9063
LV-DDR3 x32/64,
20-bit CSI
PMIC
533 MHz
eFuses
Scalable Cortex-A9 multi-core performance
Independent Cortex-M0+/Cortex-M4 Microcontroller
Assist subsystem
Cost-effective, reliable, low-profile surface-mount
module form factor
Pre-certified 802.11a/b/g/n and Bluetooth 4.0
Smart Power Management Architecture with PMIC
KEY APPLICATIONS
Android, Yocto Project Linux and Windows Embedded
Compact software platform support
Reliable design with IEC 60068 and HALT verification
Designed for long-term availability
ConnectCore
ConnectCore ConnectCard ConnectCore 6 Digi XBee
i.MX53/
6 SBC for i.MX28 LCD Kit ZigBee
Wi-i.MX53SPECIFICATIONS Digi ConnectCore 6
FEATURES
NXP i.MX6Solo/DualLite/Dual/Quad with up to four Cortex-A9 cores; Industrial (800/850 MHz),
APPLICATION PROCESSOR
Commercial (1/1.2 GHz) i.MX6 variants; 32 KB I-Cache/32 KB D-Cache, up to 1 MB L2-Cache
MEMORY Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit)
PMIC Dialog DA9063
Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance
families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex
GRAPHICS
acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging
SECURITY RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
MMC 4.4/SD 3.0 x3MMC 4.4/SDXC,
UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5,
ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps),
USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2,
PERIPHERALS/INTERFACES
PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane),
HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2),
RTC, External address/data bus, Watchdog, Timers, JTAG
26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
EXTERNAL BUS
1 Gbit Ethernet + IEEE 1588 (MII10, MII100, RMII, RGMII)
ETHERNET
802.11 a/b/g/n: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11 b: 1, 2, 5.5, 11 Mbps (17 dBm typical 2 dBm)
802.11 a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical 2 dBm)
802.11 n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical 2 dBm)
WI-FI
HT40, MCS 0-7
Security: WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready
BLUETOOTH Profiles: GAP, SPP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP
Kinetis L: MKL14Z32VFT4, MKL14Z64VFT4, MKL15Z128VFT4, MKL15Z32VFT4, MKL15Z64VFT4, MKL24Z32VFT4, MKL24Z64VFT4,
MKL25Z128VFT4, MKL25Z32VFT4, MKL25Z64VFT4, MKL26Z128VFT4, MKL26Z64VFT4, MKL26Z32VFT4
ON-MODULE MICROCONTROLLER
Kinetis K: K10P48M50SF0, K20P48M50SF0
ASSIST
Internal interconnect to i.MX6 via SPI, Kinetis interfaces available on module pads
OPERATING TEMPERATURE Industrial: -40 C to 85 C / Commercial: 0 C to 70 C (depending on use-case and enclosure/system design)
STORAGE TEMPERATURE -50 C to 125 C (-58 F to 257 F)
Relative Humidity 5% to 90% (non-condensing)
RELATIVE HUMIDITY
ALTITUDE Altitude 3,658 meters (12,000 feet)
US, Canada, EU, Japan, Australia/New Zealand
RADIO APPROVALS
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548,
EMISSIONS / IMMUNITY / SAFETY FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17,
EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
DESIGN VERIFICATION
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS LGA-400, 2 mm pitch, fully shielded (heat-spreading)
PRODUCT WARRANTY 3 years
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