Product Information

conga-QMX6/HSP1-T

conga-QMX6/HSP1-T electronic component of Congatec

Heat Sinks Standard heatspreader (with 1mm Gap Pad) for Qseven module conga-QMX6 with CPU in LIDDED FCBGA package. Intended for following QMX6 modules: conga-QMX6/iDC-1G eMMC2 (P/N 016112) conga-QMX6/iQC-1G eMMC2 (P/N 016113)
Manufacturer: Congatec
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 15.5539 ea
Line Total: USD 15.55

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 1
Multiples : 1
1 : USD 15.6975
5 : USD 15.6975
10 : USD 15.456
25 : USD 15.0938

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RoHS - XON
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HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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