Product Information

CCI08

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Datasheet
HEAT SINK, 28X28X9MM
Manufacturer: CCI



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From 3.213

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MOQ: 1 Multiples:1
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CCI08
CCI

1 : $ 3.6094
25 : $ 3.3264
100 : $ 3.213

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Manufacturer
CCI
Product Category
Unclassified
Packages Cooled
BGA
Thermal Resistance
9.51 C/W
External Height - Metric
9 mm
External Width - Metric
28 mm
External Length - Metric
28 mm
External Diameter - Metric
-
Heat Sink Material
Aluminium
External Height - Imperial
0.35 in
External Width - Imperial
1.1 in
External Length - Imperial
1.1 in
External Diameter - Imperial
-
Svhc
No Svhc (15-Jun-2015)
Mounting Type
Adhesive
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Mfr. Part No.
Description
Stock
HEAT SINK, 38X38X6MM
30
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Mfr. Part No.
Description
Stock
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CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCI Heat Pipes - Copper heat pipes, pure water filled for operation between +5 degC and 110 degC. - Various wick structures offered, Screen mesh, Grooved, Sintered and composite (G+S) - Low thermal resistance for transportation of heat from hot source to exchanger. Heat pipe can be incorporate into a block and fix a finned structure (or heat sink) to allow effective heat removal. - Thermal resistance of pipe taken at 70degC working temperature (adiabatic), under horizontal orientation, evaporator section 15mm, and condensation section 60mm Structure Length Original Thickness Thermal Operating Diameter resistance of Max pipe Rpipe Power in (W) Part Number (K / W) Sintered 100 5 5 0.02 ? 0.04 40 00C93390101 Sintered 150 6 6 0.02 ? 0.03 65 00C93400101 SM 150 4 2 0.65 ? 0.90 15 00C93410101 SM 200 6 2 0.35 ? 0.60 30 00C93420101 Groove 100 5 2.5 0.03 ? 0.06 30 00C93430101 Groove 150 6 6 0.02 ? 0.03 65 00C93440101 Groove 150 8 2.5 0.003 ? 0.05 15 00C93450101 G+S 200 6 3.0 0.003 ? 0.008 40 00C93460101 G+S 150 8 4.5 0.003 ? 0.015 70 00C93470101 G+S 300 8 8 0.002 ? 0.007 65 00C93480101 CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCI Heat Pipes - Copper heat pipes, pure water filled for operation between +5 degC and 110 degC. - Various wick structures offered, Screen mesh, Grooved, Sintered and composite (G+S) - Low thermal resistance for transportation of heat from hot source to exchanger. Heat pipe can be incorporate into a block and fix a finned structure (or heat sink) to allow effective heat removal. - Thermal resistance of pipe taken at 70degC working temperature (adiabatic), under horizontal orientation, evaporator section 15mm, and condensation section 60mm Structure Length Original Thickness Thermal Operating Diameter resistance of Max pipe Rpipe Power in (W) Part Number (K / W) Sintered 100 5 5 0.02 ? 0.04 40 00C93390101 Sintered 150 6 6 0.02 ? 0.03 65 00C93400101 SM 150 4 2 0.65 ? 0.90 15 00C93410101 SM 200 6 2 0.35 ? 0.60 30 00C93420101 Groove 100 5 2.5 0.03 ? 0.06 30 00C93430101 Groove 150 6 6 0.02 ? 0.03 65 00C93440101 Groove 150 8 2.5 0.003 ? 0.05 15 00C93450101 G+S 200 6 3.0 0.003 ? 0.008 40 00C93460101 G+S 150 8 4.5 0.003 ? 0.015 70 00C93470101 G+S 300 8 8 0.002 ? 0.007 65 00C93480101 Design Guidelines (1) Groove heatpipe condenser heatpipe condenser evaporator - 90 deg 0 deg evaporator Heat source ? The heatpipe performance is without change from -90 deg to 0 deg. Larger than 0 deg (i.e. evaporator is higher than condenser), the performance of grooved pipe will degrade 50%. (2) Mesh heatpipe condenser heatpipe evaporator 30 deg -90 deg condenser evaporator Heat source ? Larger than 30 deg, the performance of mesh pipe will degrade 50%. (3) Sintered Powder heatpipe ? The orientation has no impact on the sintered powder heatpipe performance. CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCI Heat Pipes - Copper heat pipes, pure water filled for operation between +5 degC and 110 degC. - Various wick structures offered, Screen mesh, Grooved, Sintered and composite (G+S) - Low thermal resistance for transportation of heat from hot source to exchanger. Heat pipe can be incorporate into a block and fix a finned structure (or heat sink) to allow effective heat removal. - Thermal resistance of pipe taken at 70degC working temperature (adiabatic), under horizontal orientation, evaporator section 15mm, and condensation section 60mm Structure Length Original Thickness Thermal Operating Diameter resistance of Max pipe Rpipe Power in (W) Part Number (K / W) Sintered 100 5 5 0.02 ? 0.04 40 00C93390101 Sintered 150 6 6 0.02 ? 0.03 65 00C93400101 SM 150 4 2 0.65 ? 0.90 15 00C93410101 SM 200 6 2 0.35 ? 0.60 30 00C93420101 Groove 100 5 2.5 0.03 ? 0.06 30 00C93430101 Groove 150 6 6 0.02 ? 0.03 65 00C93440101 Groove 150 8 2.5 0.003 ? 0.05 15 00C93450101 G+S 200 6 3.0 0.003 ? 0.008 40 00C93460101 G+S 150 8 4.5 0.003 ? 0.015 70 00C93470101 G+S 300 8 8 0.002 ? 0.007 65 00C93480101 CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCIC BGA heat sinks - Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width Height Thermal Thermal & resistance resistance Length (sink to (sink to ambient) K ambient) / W at 0.3 K / W at Part Number m/s 1.0 m/s 45 10 7.93 3.57 CCI02 28 9 9.51 5.29 CCI08 30 9 9.96 5.87 CCI09 38 6 9.12 4.65 CCI10 25 10 9.6 5.3 00C845401A 40 5 9.38 5.14 CCI11 CCI Heat Pipes - Copper heat pipes, pure water filled for operation between +5 degC and 110 degC. - Various wick structures offered, Screen mesh, Grooved, Sintered and composite (G+S) - Low thermal resistance for transportation of heat from hot source to exchanger. Heat pipe can be incorporate into a block and fix a finned structure (or heat sink) to allow effective heat removal. - Thermal resistance of pipe taken at 70degC working temperature (adiabatic), under horizontal orientation, evaporator section 15mm, and condensation section 60mm Structure Length Original Thickness Thermal Operating Diameter resistance of Max pipe Rpipe Power in (W) Part Number (K / W) Sintered 100 5 5 0.02 ? 0.04 40 00C93390101 Sintered 150 6 6 0.02 ? 0.03 65 00C93400101 SM 150 4 2 0.65 ? 0.90 15 00C93410101 SM 200 6 2 0.35 ? 0.60 30 00C93420101 Groove 100 5 2.5 0.03 ? 0.06 30 00C93430101 Groove 150 6 6 0.02 ? 0.03 65 00C93440101 Groove 150 8 2.5 0.003 ? 0.05 15 00C93450101 G+S 200 6 3.0 0.003 ? 0.008 40 00C93460101 G+S 150 8 4.5 0.003 ? 0.015 70 00C93470101 G+S 300 8 8 0.002 ? 0.007 65 00C93480101 Design Guidelines (1) Groove heatpipe condenser heatpipe condenser evaporator - 90 deg 0 deg evaporator Heat source ? The heatpipe performance is without change from -90 deg to 0 deg. Larger than 0 deg (i.e. evaporator is higher than condenser), the performance of grooved pipe will degrade 50%. (2) Mesh heatpipe condenser heatpipe evaporator 30 deg -90 deg condenser evaporator Heat source ? Larger than 30 deg, the performance of mesh pipe will degrade 50%. (3) Sintered Powder heatpipe ? The orientation has no impact on the sintered powder heatpipe performance.

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