ZICM3588SP2-2-R

MeshConnect EM35x Mini Modules ZICM35xSP0 and ZICM35xSP2 TM Ember EM35x Transceiver-Based Modules Integrated Transceiver Modules for ZigBee / Thread / IEEE 802.15.4 Development Kit Available: ZICM-EM35X-DEV-KIT-3 DESCRIPTION EM35x Mini Modules The MeshConnect EM35x Mini Modules from Powered by Ember ZigBee & Thread Solutions California Eastern Laboratories (CEL) combine high EM357 performance RF solutions with the market s premier KEY FEATURES: 12kB SRAM ZigBee and Thread stacks. Available in low and 32-bit ARM Cortex -M3 192kB Flash high output power options (+8dBm and +20dBm), Up to 23 GPIO Pins or these modules can accommodate variable range SPI (Master/Slave), EM358x and performance requirements. The tiny module TWI and UART Up to 64kB SRAM Up to 512kB Flash footprint makes them suitable for a wide range of Timers and Serial (Supports OTA) Wire/JTAG Interface ZigBee and Thread applications. The MeshConnect Optional USB 5-Channel 14-bit ADC Controller EM35x Mini Modules are certified and qualified, enabling customers to accelerate time to market by ZICM35xSP0 ZICM35xSP2 greatly reducing the design and certification phases Tx:+8dBm +20dBm of development. Rx: -100dBm -103dBm Link Budget: +108dB +123dB CELs MeshConnect EM35x Mini Modules ADDITIONAL FEATURES (ZICM35xSP0 and ZICM35xSP2) are based on the Data Rate: 250kbps Antenna Options: Ember EM35x (EM357 and EM358x) System on Chip 1) Integrated PCB Trace Antenna Advanced Power Management (SoC) radio ICs. Each IC is a complete single-chip 2) RF Port for External Antenna 16 RF Channels solution, compliant with ZigBee, Thread, and IEEE Supports Mesh Networks Industry s Premier Wireless 802.15.4. specifications. Networking Stacks: EmbeZNet AES Encryption PRO (ZigBee) and Silicon FCC, CE and IC Certifications Labs Thread CELs EM358x-based Mini Modules (ZICM358xSP0 RoHS Compliant Mini Footprint: - 0.940 x 0.655 and ZICM358xSP2) are ideal for customers requiring (23.9mm x 16.6mm) Over-the-Air (OTA) programming without an external Flash memory (such as Smart Energy or Home APPLICATIONS Automation), a larger memory footprint for complex Smart Energy/Grid Markets Commercial and Residential application control, or the additional resources to run - Thermostats Lighting - In-Home Displays - Fixtures and Control an IPv6-based networking stack like Thread. They - Smart Plugs Solar Inverters and Control also feature an optional on-board Universal Serial Home Automation and Control General ZigBee and Thread - Energy Management Bus (USB) 2.0 full-speed peripheral. Wireless Sensor Networking - Security Devices - HVAC Control Building Automation and Control This document is subject to change without notice Document No: 0011-00-07-01-000 (Issue H) Contributor Member Date Published: October 11, 2016 Page 1EM35x Mini Modules TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features................................................................................................................................................................................................... 1 Applications............................................................................................................................................................................................ 1 Ordering Information.............................................................................................................................................................................. 3 ZICM35xSPx Product Comparison Table.............................................................................................................................................. 4 Module Block Diagram........................................................................................................................................................................... 4 Development Tools.................................................................................................................................................................................. 5 System Level Function Transceiver IC.......................................................................................................................................................................................... 6 Antenna.................................................................................................................................................................................................... 6 Power Amplifier ....................................................................................................................................................................................... 6 USB........................................................................................................................................................................................................... 7 Software/Firmware................................................................................................................................................................................. 7 Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... 8 Recommended Operating Condition..................................................................................................................................................... 8 DC Characteristics.................................................................................................................................................................................. 8 RF Characteristics.................................................................................................................................................................................. 9 Pin Signal and Interfaces Pin Signals I/O Configuration ............................................................................................................................................................... 10 I/O Pin Assignment................................................................................................................................................................................ 10 Module Dimensions................................................................................................................................................................................ 11 Module Land Footprint........................................................................................................................................................................... 12 13 Processing.......................................................................................................................................................................................... 15 Agency Certifications .................................................................................................................................................................... 16 Software Compliance.................................................................................................................................................................... 18 Shipment, Storage and Handling............................................................................................................................................. 18 Quality................................................................................................................................................................................................... 19 References.......................................................................................................................................................................................... 19 Revision History............................................................................................................................................................................... This document is subject to change without notice Page 2 Document No: 0011-00-07-01-000 (Issue H) Contributor Member