HSMM-C170

HSMM-C110/C120/C150/C170/C190 HSMN-C110/C120/C150/C170/C190/C191 SMT ChipLEDs Data Sheet Description Features High brightness These small chip-type LEDs utilize high efficient InGaN/SiC material to deliver competitively priced high Small size performance blue and green. These 525 nm green and Industrial standard footprint 470 nm blue are unique hues which provide color dif- Diffused optics ferentiation to a product. Top emitting or right angle emitting These ChipLEDs come in either top emitting packages Compatible with IR soldering (HSMx-C170, C190, C191, and C150) or in a side emitting Compatible for use with light piping package (HSMx-C110 and HSMX-C120). The side emit- ting package is especially suitable for LCD backlight- Available in 8 mm tape on 7 diameter reel ing application. The top emitting packages with their Reel sealed in zip locked moisture barrier bags wide viewing angle are suitable for direct backlight- Applications ing application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs LCD backlighting are shipped in tape and reel with 4000 units per reel Pushbutton backlighting for HSMx-C120, C170, C190, and C191 packages, and Front panel indicator 3000 units per reel for HSMx-C110 and C150 packages. Symbol indicator All packages are compatible with IR soldering and binned by both color and intensity. Microdisplays Small message panel signage Device Selection Guide 1 , 2 Package Dimension (mm) Ingan Green Ingan Blue Package Description 3.2 (L) x 1.5 (W) x 1.0 (H) HSMM-C110 HSMN-C110 Untinted, Non-diffused 1.6 (L) x 1.0 (W) x 0.6 (H) HSMM-C120 HSMN-C120 Untinted, Nondiffused 3.2 (L) x 1.6 (W) x 1.1 (H) HSMM-C150 HSMN-C150 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.8 (H) HSMM-C170 HSMN-C170 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.8 (H) HSMM-C190 HSMN-C190 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.6 (H) HSMN-C191 Untinted, Diffused Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted. CAUTION: HSMM-C1xx and HSMN-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.Package Dimensions CATHODE CATHODE MARK LINE LED DIE LED DIE 1.0 (0.039) 0.3 (0.012) 2.6 (0.102 ) 0.6 (0.024) 1.6 (0.063) 3.2 (0.126 ) POLARITY CLEAR POLARITY EPOXY 1.2 (0.047) CLEAR EPOXY 1.5 (0.059) PC BOARD 1.0 (0.039) PC BOARD 0.5 (0.020) 1.6 (0.063 ) 0.5 (0.020) 3.2 (0.126 ) 3 0.3 (0.012) 0.8 (0.031) CATHODE LINE CATHODE LINE 1.0 (0.039) SOLDERING SOLDERING TERMINAL TERMINAL HSMx-C110 HSMx-C120 CATHODE MARK CATHODE MARK 1.25 (0.049) 0.8 (0.031) 1.6 2.0 (0.079 ) (0.063 ) 1.4 POLARITY DIFFUSED 1.0 (0.055) POLARITY EPOXY (0.039) 0.3 (0.012) 0.3 (0.012) PC BOARD DIFFUSED EPOXY 0.8 (0.031) PC BOARD 0.3 (0.012) 0.8 (0.031) CATHODE LINE 0.3 (0.012) 0.4 0.15 0.4 0.15 CATHODE LINE (0.016 0.006) (0.016 0.006) 0.3 0.15 0.3 0.15 (0.012 0.006) (0.012 0.006) 0.7 (0.028) MIN. SOLDERING SOLDERING TERMINAL TERMINAL HSMx-C170 HSMx-C190 2