AFBR-5905Z

AFBR-5905Z, AFBR-5905AZ ATM Multimode Fiber Transceivers in 2 x 5 Package Style Data Sheet Description Features The AFBR-5905Z family of transceivers from Avago pro- Multisourced 2 x 5 package style with MT-RJ vide the system designer with products to implement a receptacle range of solutions for multimode fi ber SONET OC-3 (SDH Single +3.3 V power supply STM-1) physical layers for ATM and other services. These Wave solder and aqueous wash process compatibility transceivers are all supplied in the new industry standard 2 x 5 DIP style with a MT-RJ fi ber connector interface. Full compliance with ATM Forum UNI SONET OC-3 multimode fi ber physical layer specifi cation ATM 2 km Backbone Links RoHS compliant The AFBR-5905Z is a 1300 nm product with optical perfor- Receiver output squelch function enabled mance compliant with the SONET STS-3c (OC-3) Physical Layer Interface Specifi cation. This physical layer is defi ned Applications in the ATM Forum User-Network Interface (UNI) Specifi ca- Multimode fi ber ATM backbone links tion Version 3.0. This document references the ANSI T1E1.2 Multimode fi ber ATM wiring closet to desktop links specifi cation for the details of the interface for 2 km mul- timode fi ber backbone links. The ATM 100 Mb/s-125 MBd Ordering Information Physical Layer interface is best implemented with the AFBR- 5903Z family of FDDI Transceivers which are speci- The AFBR-5905Z 1300 nm product is available for produc- fi ed for use in this 4B/5B encoded physical layer per the tion orders through the Avago Component Field Sales Of- FDDI PMD standard. fi ces and Authorized Distributors world wide. AFBR-5905Z = 0C to +70C Transmitter Sections AFBR-5905AZ = -40C to +85C. The transmitter section of the AFBR-5905Z utilizes a 1300 nm InGaAsP LED. This LED is packaged in the optical sub- assembly portion of the transmitter section. It is driven by a custom silicon IC which converts diff erential PECL logic signals, ECL referenced (shifted) to a +3.3 V supply, into an analog LED drive current.Receiver Sections The receiver section of the AFBR-5905Z utilizes an InGaAs 2 x 5 DIP. The low profi le of the Avago transceiver design PIN photodiode coupled to a custom silicon transimped- complies with the maximum height allowed for the MT-RJ ance preamplifi er IC. It is packaged in the optical sub- connector over the entire length of the package. assembly portion of the receiver. This PIN/preamplifi er The optical subassemblies utilize a high-volume assembly combination is coupled to a custom quantizer IC which process together with low-cost lens elements which result provides the fi nal pulse shaping for the logic output and in a cost-eff ective building block. the Signal Detect function. The Data output is diff eren- tial. The Signal Detect output is singleended. Both Data The electrical subassembly consists of a high volume mul- and Signal Detect outputs are PECL compatible, ECL ref- tilayer printed circuit board on which the IC and various erenced (shifted) to a 3.3 V power supply. The receiver surface-mounted passive circuit elements are attached. outputs, Data Out and Data Out Bar, are squelched at Sig- The receiver section includes an internal shield for the nal Detect Deassert. That is, when the light input power electrical and optical subassemblies to ensure high im- decreases to a typical -38 dBm or less, the Signal Detect munity to external EMI fi elds. Deasserts, i.e. the Signal Detect output goes to a PECL low state. This forces the receiver outputs, Data Out and Data The outer housing is electrically conductive and is at re- Out Bar to go to steady PECL levels High and Low respec- ciever signal ground potential. The MT-RJ ports is molded tively. of fi lled nonconductive plastic to provide mechanical strength and electrical isolation. The solder posts of the Package Avago design are isolated from the internal circuit of the transceiver. The overall package concept for the Avago transceiver consists of three basic elements the two optical subas- The transceiver is attached to a printed circuit board with semblies, an electrical subassembly, and the housing as the ten signal pins and the two solder posts which exit the illustrated in the block diagram in Figure 1. bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads im- The package outline drawing and pin out are shown in posed on the transceiver by mating with the MT-RJ con- Figures 2 and 3. The details of this package outline and pin nectored fi ber cables. out are compliant with the multisource defi nition of the fiber cables. R SUPPLY X DATA OUT QUANTIZER IC PIN PHOTODIODE DATA OUT PRE-AMPLIFIER SUBASSEMBLY R GROUND SIGNAL X MT-RJ DETECT RECEPTACLE T GROUND X LED DATA IN OPTICAL LED DRIVER IC SUBASSEMBLY DATA IN T SUPPLY X Figure 1. Block Diagram. 2