AFBR-5803TZ

AFBR-5803Z/5803TZ/5803AZ/5803ATZ FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low-Cost 1 9 Package Style Data Sheet Description Features The AFBR-5800Z family of transceivers from Broadcom Full compatibility with the optical performance provide the system designer with products to implement a requirements of the FDDI PMD standard range of Fast Ethernet, FDDI, and Asynchronous Transfer Mode Full compatibility with the FDDI LCF-PMD standard (ATM) designs at the 100 Mb/s-125 MBd rate. Full compatibility with the optical performance requirements of the ATM 100-Mb/s physical layer The transceivers are all supplied in the industry standard 1 9 1 SIP package style with either a duplex SC or a duplex ST* Full compatibility with the optical performance connector interface. requirements of 100BASE-FX version of IEEE802.3u Multisourced 1 9 package style with choice of duplex SC 1 or duplex ST receptacle FDDI PMD, ATM and Fast Ethernet 2-km Wave solder and aqueous wash process compatible Backbone Links Single +3.3V or +5V power supply The AFBR-5803Z/5803TZ are 1300-nm products with optical RoHS compliance performance compliant with the FDDI PMD standard. The FDDI PMD standard is ISO/IEC 9314-3: 1990 and ANSI X3.166 1990. Applications These transceivers for 2-km multimode fiber backbones are supplied in the small 1 9 duplex SC or ST package style. Multimode fiber backbone links Multimode fiber wiring closet to desktop links The AFBR-5803Z/5803TZ is useful for both ATM 100 Mb/s Very low cost multimode fiber links from wiring closet to interfaces and Fast Ethernet 100BASE-FX interfaces. The ATM desktop Forum User-Network Interface (UNI) Standard, Version 3.0, defines the Physical Layer for 100-Mb/s Multimode Fiber Multimode fiber media converters Interface for ATM in Section 2.3 to be the FDDI PMD Standard. Likewise, the Fast Ethernet Alliance defines the Physical Layer for 100BASE-FX for Fast Ethernet to be the FDDI PMD Standard. ATM applications for physical layers other than 100-Mb/s Multimode Fiber Interface are supported by Broadcom. Products are available for both the single mode and the multi-mode fiber SONET OC-3c (STS-3c) ATM interfaces and the 155 Mb/s-194 MBd multi-mode fiber ATM interface as specified in the ATM Forum UNI. Contact your Broadcom sales representative for information on these alternative Fast Ethernet, FDDI, and ATM products. 1. ST is a registered trademark of AT&T Lightguide Cable Connectors Broadcom - 1 -AFBR-5803Z/5803TZ/5803AZ/5803ATZ Data Sheet The package outline drawings and pin out are shown in Transmitter Sections Figure 3, Figure 4, and Figure 5. The details of this package The transmitter section of the AFBR-5803Z and AFBR-5805Z outline and pin out are compliant with the multi-source series usee 1300-nm surface-emitting InGaAsP LEDs. These definition of the 1 9 SIP. The low profile of the Broadcom LEDs are packaged in the optical subassembly portion of the transceiver design complies with the maximum height allowed transmitter section. They are driven by a custom silicon IC, for the duplex SC connector over the entire length of the which converts differential PECL logic signals, ECL referenced package. (shifted) to a +3.3V or +5V supply, into an analog LED drive The optical subassemblies use a high-volume assembly current. process together with low-cost lens elements that result in a cost effective building block. Receiver Sections The electrical subassembly consists of a high-volume The receiver sections of the AFBR-5803Z and AFBR-5805Z multilayer printed circuit board on which the IC chips and series use InGaAs PIN photodiodes coupled to a custom silicon various surface-mounted passive circuit elements are attached. transimpedance preamplifier IC. These are packaged in the The package includes internal shields for the electrical and optical subassembly portion of the receiver. optical subassemblies to ensure low EMI emissions and high These PIN/preamplifier combinations are coupled to a custom immunity to external EMI fields. quantizer IC that provides the final pulse shaping for the logic The outer housing including the duplex SC connector output and the Signal Detect function. The data output is receptacle or the duplex ST ports is molded of filled differential. The signal detect output is single-ended. Both data nonconductive plastic to provide mechanical strength and and signal detect outputs are PECL compatible, ECL referenced electrical isolation. The solder posts of the Broadcom design (shifted) to a +3.3V or +5V power supply. are isolated from the circuit design of the transceiver and do not require connection to a ground plane on the circuit board. Package The transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts that exit the bottom The overall package concept for the Broadcom transceivers of the housing. The two solder posts provide the primary consists of the following basic elements: two optical mechanical strength to withstand the loads imposed on the subassemblies, an electrical subassembly, and the housing as transceiver by mating with duplex or simplex SC or ST illustrated in Figure 1 and Figure 2. connectored fiber cables. Figure 1 SC Connector Block Diagram ELECTRICAL SUBASSEMBLY DUPLEX SC RECEPTACLE DIFFERENTIAL DATA OUT PIN PHOTODIODE SINGLE-ENDED SIGNAL QUANTIZER IC DETECT OUT PREAMP IC OPTICAL SUBASSEMBLIES DIFFERENTIAL LED DATA IN DRIVER IC TOP VIEW Broadcom - 2 -