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ADIS16260/PCBZ

ADIS16260/PCBZ electronic component of Analog Devices

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Position Sensor Development Tools ADIS16260 Eval Brd

Manufacturer: Analog Devices
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ADIS16260/PCBZ
Analog Devices

1 : USD 146.7075
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Obsolete
     
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Programmable Digital Gyroscope Sensor Data Sheet ADIS16260/ADIS16265 FEATURES GENERAL DESCRIPTION Yaw rate gyroscope with range scaling The ADIS16260 and the ADIS16265 are programmable digital 80/sec, 160/sec, and 320/sec settings gyroscopes that combine industry-leading MEMS and signal No external configuration required to start data collection processing technology in a single compact package. They provide Start-up time: 165 ms accuracy performance that would require full motion calibration Sleep mode recovery time: 2.5 ms with any other MEMS gyroscope in their class. When power is Factory-calibrated sensitivity and bias applied, the ADIS16260 and the ADIS16265 automatically start up ADIS16265 calibration temperature range: 40C to +85C and begin sampling sensor data, without requiring configuration ADIS16260 calibration temperature: +25C commands from a system processor. An addressable register SPI-compatible serial interface structure and a common serial peripheral interface (SPI) provide Relative angle displacement output simple access to sensor data and configuration settings. Many Embedded temperature sensor digital processor platforms support the SPI with simple firmware- Programmable operation and control level instructions. Automatic and manual bias correction controls The ADIS16260 and the ADIS16265 provide several programmable Sensor bandwidth selection: 50 Hz/330 Hz features for in-system optimization. The sensor bandwidth switch Sample rate: 256 SPS/2048 SPS settings (50 Hz and 330 Hz), Bartlett window FIR filter length, and sample Bartlett window FIR filter length, number of taps rate settings provide users with controls that enable noise vs. Digital I/O: data ready, alarm indicator, general-purpose bandwidth optimization. The digital input/output lines offer Alarms for condition monitoring options for a data ready signal that helps the master processor Sleep mode for power management efficiently manage data coherency, an alarm indicator signal for DAC output voltage triggering master processor interrupts, and a general-purpose Single-command self-test function for setting and monitoring system-level digital controls/ Single-supply operation: 4.75 V to 5.25 V conditions. 3.3 V compatible digital lines 2000 g shock survivability The ADIS16260 and the ADIS16265 come in a LGA package Operating temperature range: 40C to +105C (11.2 mm 11.2mm 5.5 mm), which supports Pb-free solder reflow assembly, in accordance with JEDEC J-STD-020. They APPLICATIONS have an extended operating temperature range of 40C to +105C. Platform control and stabilization Navigation Medical instrumentation Robotics FUNCTIONAL BLOCK DIAGRAM DIO1 DIO2 VCC RST INPUT/ POWER SELF-TEST ALARMS GND OUTPUT MANAGEMENT MEMS RATE GYROSCOPE SENSOR FILT USER CONTROL CONTROLLER TEMPERATURE REGISTERS SENSOR CS POWER SCLK SUPPLY SPI FILTER CLOCK PORT AUX DIN ADC OUTPUT DATA VREF REGISTERS DOUT AUX CALIBRATION DAC ADIS16260/ADIS16265 Figure 1. Rev. F Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20092018 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. 08246-001ADIS16260/ADIS16265 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 SPI Write Commands ................................................................ 11 Applications ....................................................................................... 1 SPI Read Commands ................................................................. 11 General Description ......................................................................... 1 Memory Map .............................................................................. 12 Functional Block Diagram .............................................................. 1 Processing Sensor Data ............................................................. 13 Revision History ............................................................................... 2 Operational Controls ................................................................. 13 Specif icat ions ..................................................................................... 3 Input/Output Functions ............................................................ 15 Timing Specifications .................................................................. 5 Diagnostics .................................................................................. 16 Absolute Maximum Ratings ............................................................ 6 Product Identification ................................................................ 17 ESD Caution .................................................................................. 6 Applications Information .............................................................. 18 Pin Configuration and Function Descriptions ............................. 7 Ass embly ...................................................................................... 18 Typical Performance Characteristics ............................................. 8 Bias Optimization ....................................................................... 18 Theory of Operation ........................................................................ 9 Interface Printed Circuit Board ................................................ 18 Sensing Element ........................................................................... 9 Outline Dimensions ....................................................................... 20 Data Sampling and Processing ................................................... 9 Ordering Guide .......................................................................... 20 User Interface ................................................................................ 9 Basic Operation .......................................................................... 10 REVISION HISTORY 9/2018Rev. E to Rev. F 12/2010Rev. A to Rev. B Changes to General Description Section ...................................... 1 Changes to Equation in Internal Sample Rate Section .............. 13 Changes to Assembly Section, Interface Printed Circuit Board Changes to Figure 15 ...................................................................... 14 Section, and Figure 19 .................................................................... 18 Changes to Bias Optimization Section ........................................ 18 Changes to Ordering Guide .......................................................... 20 10/2009Rev. 0 to Rev. A 1/2014Rev. D to Rev. E Added ADIS16260 .............................................................. Universal Change to Table 3 ............................................................................. 6 Changes to Features List and General Description Section ........ 1 Change to Bias Optimization Section .......................................... 18 Changes to Table 1 ............................................................................. 4 Change to Absolute Maximum Ratings Table Section ................. 6 10/2011Rev. C to Rev. D Changes to Interface Printed Circuit Board Section ................. 18 Change to Step 9, Bias Optimization Section ............................. 18 Changes to Ordering Guide .......................................................... 20 5/2011Rev. B to Rev. C 9/2009Revision 0: Initial Version Changes to Bias Optimization Section ........................................ 18 Rev. F Page 2 of 20

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