Product Information

AON2290

AON2290 electronic component of Alpha & Omega

Datasheet
N-Channel 100 V 4.5A (Ta) 2.8W (Ta) Surface Mount 6-DFN (2x2)

Manufacturer: Alpha & Omega
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5: USD 0.4992 ea
Line Total: USD 2.5

2454 - Global Stock
Ships to you between
Thu. 09 May to Tue. 14 May
MOQ: 5  Multiples: 5
Pack Size: 5
Availability Price Quantity
2454 - Global Stock


Ships to you between
Thu. 09 May to Tue. 14 May

MOQ : 5
Multiples : 5

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AON2290
Alpha & Omega

5 : USD 0.5242
50 : USD 0.4387
150 : USD 0.4021
500 : USD 0.3565
3000 : USD 0.3361
6000 : USD 0.3239

     
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RoHS - XON
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AON2290 100V N-Channel MOSFET General Description Product Summary V The AON2290 combines advanced trench MOSFET DS 100V technology with a low resistance package to provide I (at V =10V) 4.5A D GS extremely low R . This device is ideal for load switch DS(ON) R (at V =10V) < 72m DS(ON) GS and battery protection applications. R (at V =4.5V) < 97m DS(ON) GS D DFN 2x2B Top View Bottom View D D S D Pin 1 S G D D S G Pin 1 Absolute Maximum Ratings T =25C unless otherwise noted A Parameter Symbol Maximum Units DDrraaiinn--SSoouurrccee VVoollttaaggee VV 110000 VV DS Gate-Source Voltage V 20 V GS T =25C 4.5 A Continuous Drain I D T =70C Current 3.5 A A C Pulsed Drain Current I 25 DM T =25C 2.8 A P W D A Power Dissipation T =70C 1.8 A Junction and Storage Temperature Range T , T -55 to 150 C J STG Thermal Characteristics Parameter Symbol Typ Max Units A t 10s Maximum Junction-to-Ambient 37 45 C/W R A D JA Steady-State Maximum Junction-to-Ambient 66 80 C/W Maximum Junction-to-Case Steady-State R 6.5 8.0 C/W JC Rev.2.0: April 2013 www.aosmd.com Page 1 of 6 AON2290 Electrical Characteristics (T =25C unless otherwise noted) J Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS BV Drain-Source Breakdown Voltage I =250A, V =0V 100 V D GS DSS V =100V, V =0V 1 DS GS I Zero Gate Voltage Drain Current A DSS T =55C 5 J V =0V, V =20V I Gate-Body leakage current 100 nA GSS DS GS V Gate Threshold Voltage V =V , I =250A 1.7 2.3 2.8 V GS(th) DS GS D I On state drain current V =10V, V =5V 25 A GS DS D(ON) V =10V, I =4.5A 59 72 GS D m R Static Drain-Source On-Resistance T =125C 110 134 DS(ON) J V =4.5V, I =4A 77 97 m GS D g Forward Transconductance V =5V, I =4.5A 13 S FS DS D V Diode Forward Voltage I =1A,V =0V 0.78 1 V S GS SD I Maximum Body-Diode Continuous Current 3.5 A S DYNAMIC PARAMETERS C Input Capacitance 415 pF iss V =0V, V =50V, f=1MHz C Output Capacitance 32 pF oss GS DS C Reverse Transfer Capacitance 3 pF rss R Gate resistance V =0V, V =0V, f=1MHz 1.4 g GS DS SWITCHING PARAMETERS Q Total Gate Charge 6.5 12 nC g Q Total Gate Charge 3 6 nC g V =10V, V =50V, I =4.5A GS DS D Q Gate Source Charge 1.5 nC gs Q Gate Drain Charge 1.5 nC gd t Turn-On DelayTime 4 ns D(on) tt TTuurrnn--OOnn RRiissee TTiimmee VV ==1100VV,, VV ==5500VV,, RR ==1111,, 22 nnss r GS DS L R =3 t Turn-Off DelayTime 15 ns GEN D(off) t Turn-Off Fall Time 2 ns f t I =4.5A, dI/dt=500A/s rr Body Diode Reverse Recovery Time F 16 ns Q I =4.5A, dI/dt=500A/s nC rr Body Diode Reverse Recovery Charge F 44 2 A. The value of R is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with T =25 C. The JA A Power dissipation P is based on R t 10s value and the maximum allowed junction temperature of 150 C. The value in any given DSM JA application depends on the user s specific board design. B. The power dissipation P is based on T =150 C, using junction-to-case thermal resistance, and is more useful in setting the upper D J(MAX) dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature T =150 C. Ratings are based on low frequency and duty cycles to keep J(MAX) initial T =25 C. J D. The R is the sum of the thermal impedance from junction to case R and case to ambient. JA JC E. The static characteristics in Figures 1 to 6 are obtained using <300s pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150 C. The SOA curve provides a single pulse rating. G. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150 C. 2 H. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with T =25 C. A THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev.2.0: April 2013 www.aosmd.com Page 2 of 6

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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