Micross | X-ON
Micross Components, Inc. designs, manufactures, and distributes specialty electronics solutions for defense, space, medical, oil and energy, automotive, telecommunications, and industrial applications in the United States and internationally. It offers bare die products, such as diodes, analog integrated circuits, and high-end digital components; and die and wafer services, including wafer processing, wafer thinning, wafer bumping, wafer sawing, pick and place, visual inspection, wafer probing, cold temperature probe testing, hot temperature probe testing, wafer level programming, known good die, lot qualification, radiation hardened die, long term die storage, and shipping methods. The company also distributes passive components, including resistors, RF components, and inductors, as well as ceramic, silicon, and tantalum capacitors. In addition, it offers solid state batteries; commercial off-the-shelf products, including power modules and small-signal discretes, as well as upscreened plastic products; and temperature plastic packages, standard plastic packages, standard hermetic packages, custom hermetic packages, and custom plastic packages. Further, the company offers semiconductor assembly and test services, component modifications, and robotic hot solder dipping and solder exchange; MIL-SPEC connectors for commercial, military, and space products; and DMS/EOL/whole life product support, wafer-level chip scale packaging, and microcontrollers. It sells its products through distribution channels. Micross Components, Inc. was incorporated in 1998 and is based in Orlando, Florida. It has manufacturing facilities in Orlando; Florida; Hatfield, Pennsylvania; and Manchester, Norwich, Crewe, and Alton, United Kingdom.