Product Information

XC2VP2-6FGG256C

XC2VP2-6FGG256C electronic component of Xilinx

Datasheet
FPGA Virtex-II Pro Family 3168 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 256-Pin FBGA

Manufacturer: Xilinx
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

90: USD 400.392 ea
Line Total: USD 36035.28

0 - Global Stock
MOQ: 90  Multiples: 90
Pack Size: 90
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 04 Apr to Wed. 10 Apr

MOQ : 90
Multiples : 90
90 : USD 400.392
100 : USD 397.0554
190 : USD 393.7188
450 : USD 390.3822
900 : USD 387.0456

     
Manufacturer
Product Category
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
XC2VP2-7FGG256C electronic component of Xilinx XC2VP2-7FGG256C

FPGA Virtex-II Pro Family 3168 Cells 1350MHz 0.13um/90nm (CMOS) Technology 1.5V 256-Pin FBGA
Stock : 0

XC2VP2-6FGG256I electronic component of Xilinx XC2VP2-6FGG256I

FPGA Virtex-II Pro Family 3168 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 256-Pin FBGA
Stock : 0

XC2Vp30-5FG676C electronic component of Xilinx XC2Vp30-5FG676C

FPGA Virtex-II Pro Family 30816 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 676-Pin FBGA
Stock : 0

XC2VP30-5FF1152C electronic component of Xilinx XC2VP30-5FF1152C

FPGA Virtex-II Pro Family 30816 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 1152-Pin FC-BGA
Stock : 0

XC2Vp30-5FG676I electronic component of Xilinx XC2Vp30-5FG676I

FPGA Virtex-II Pro Family 30816 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 676-Pin FBGA
Stock : 0

XC2VP30-5FFG1152C electronic component of Xilinx XC2VP30-5FFG1152C

FPGA - Field Programmable Gate Array XC2VP30-5FFG1152C
Stock : 0

XC2VP30-5FFG896C electronic component of Xilinx XC2VP30-5FFG896C

FPGA - Field Programmable Gate Array XC2VP30-5FFG896C
Stock : 0

XC2VP30-5FF896I electronic component of Xilinx XC2VP30-5FF896I

FPGA - Field Programmable Gate Array 30816 Logic Cells 12 Rocket IOs 2 Power PC 405
Stock : 0

XC2VP30-5FFG1152I electronic component of Xilinx XC2VP30-5FFG1152I

FPGA Virtex-II Pro Family 30816 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 1152-Pin FC-BGA
Stock : 0

XC2VP30-5FF1152I electronic component of Xilinx XC2VP30-5FF1152I

FPGA - Field Programmable Gate Array 30816 Logic Cells 12 Rocket IOs 2 Power PC 405
Stock : 0

Image Description
TSW-111-07-S-D electronic component of Samtec TSW-111-07-S-D

Conn Unshrouded Header HDR 22 POS 2.54mm Solder ST Thru-Hole
Stock : 1

XC2VP2-6FG256I electronic component of Xilinx XC2VP2-6FG256I

FPGA Virtex-II Pro Family 3168 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 256-Pin FBGA
Stock : 0

TSW-112-07-L-D electronic component of Samtec TSW-112-07-L-D

Conn Unshrouded Header HDR 24 POS 2.54mm Solder ST Thru-Hole
Stock : 2299

XC2VP20-5FG676C electronic component of Xilinx XC2VP20-5FG676C

FPGA Virtex-II Pro Family 20880 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 676-Pin FBGA
Stock : 0

TSW-112-10-G-S-RA electronic component of Samtec TSW-112-10-G-S-RA

Conn Unshrouded Header HDR 12 POS 2.54mm Solder RA Thru-Hole
Stock : 174

XC2S50-6TQ144C electronic component of Xilinx XC2S50-6TQ144C

FPGA Spartan®-II Family 50K Gates 1728 Cells 263MHz 0.18um Technology 2.5V 144-Pin TQFP
Stock : 0

TSW-112-14-T-S electronic component of Samtec TSW-112-14-T-S

Headers & Wire Housings Classic PCB Header Strips, 0.100 pitch
Stock : 0

XC2S50-6FG256C electronic component of Xilinx XC2S50-6FG256C

FPGA Spartan-II Family 50K Gates 1728 Cells 263MHz 0.18um Technology 2.5V 256-Pin FBGA
Stock : 0

TSW-112-17-L-D electronic component of Samtec TSW-112-17-L-D

Conn Unshrouded Header HDR 24 POS 2.54mm Solder ST Thru-Hole
Stock : 7

XC2S50-5TQ144C electronic component of Xilinx XC2S50-5TQ144C

FPGA Spartan®-II Family 50K Gates 1728 Cells 263MHz 0.18um Technology 2.5V 144-Pin TQFP
Stock : 0

Product Not Recommended For New Designs 1 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet 0 DS083 (v5.0) June 21, 2011 Product Specification Module 1: Module 3: Introduction and Overview DC and Switching Characteristics 10 pages 59 pages Summary of Features Electrical Characteristics General Description Performance Characteristics Architecture Switching Characteristics IP Core and Reference Support Pin-to-Pin Output Parameter Guidelines Device/Package Combinations and Maximum I/O Pin-to-Pin Input Parameter Guidelines Ordering Information DCM Timing Parameters Source-Synchronous Switching Characteristics Module 2: Module 4: Functional Description Pinout Information 60 pages 302 pages Functional Description: RocketIO X Multi-Gigabit Transceiver Pin Definitions Functional Description: RocketIO Multi-Gigabit Pinout Tables Transceiver - FG256/FGG256 Wire-Bond Fine-Pitch BGA Package Functional Description: Processor Block - FG456/FGG456 Wire-Bond Fine-Pitch BGA Package - FG676/FGG676 Wire-Bond Fine-Pitch BGA Package Functional Description: PowerPC 405 Core - FF672 Flip-Chip Fine-Pitch BGA Package Functional Description: FPGA - FF896 Flip-Chip Fine-Pitch BGA Package - Input/Output Blocks (IOBs) - FF1148 Flip-Chip Fine-Pitch BGA Package - Digitally Controlled Impedance (DCI) - FF1152 Flip-Chip Fine-Pitch BGA Package - On-Chip Differential Termination - FF1517 Flip-Chip Fine-Pitch BGA Package - Configurable Logic Blocks (CLBs) - FF1696 Flip-Chip Fine-Pitch BGA Package - 3-State Buffers - FF1704 Flip-Chip Fine-Pitch BGA Package - CLB/Slice Configurations - 18-Kb Block SelectRAM Resources - 18-Bit x 18-Bit Multipliers - Global Clock Multiplexer Buffers - Digital Clock Manager (DCM) Routing Configuration IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end. Use the PDFBookmark pane for easy navigation in this volume. 20002011 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners. DS083 (v5.0) June 21, 2011 www.xilinx.com 1 Product SpecificationProduct Not Recommended For New Designs 1 0 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Introduction and Overview DS083 (v5.0) June 21, 2011 Product Specification Summary of Virtex-II Pro / Virtex-II Pro X Features High-Performance Platform FPGA Solution, Including - SelectRAM+ memory hierarchy - Dedicated 18-bit x 18-bit multiplier blocks - Up to twenty RocketIO or RocketIO X embedded Multi-Gigabit Transceivers (MGTs) - High-performance clock management circuitry - SelectI/O-Ultra technology - Up to two IBM PowerPC RISC processor blocks - XCITE Digitally Controlled Impedance (DCI) I/O Based on Virtex-II Platform FPGA Technology - Flexible logic resources Virtex-II Pro / Virtex-II Pro X family members and resources - SRAM-based in-system configuration are shown in Table 1. - Active Interconnect technology Table 1: Virtex-II Pro / Virtex-II Pro X FPGA Family Members CLB (1 = 4 slices = max 128 bits) Block SelectRAM+ RocketIO PowerPC 18 X 18 Bit Maximum Transceiver Processor Logic Max Distr Multiplier 18 Kb Max Block User (1) (2) Device Blocks Blocks Cells Slices RAM (Kb) Blocks Blocks RAM (Kb) DCMs I/O Pads XC2VP2 4 0 3,168 1,408 44 12 12 216 4 204 XC2VP4 4 1 6,768 3,008 94 28 28 504 4 348 XC2VP7 8 1 11,088 4,928 154 44 44 792 4 396 XC2VP20 8 2 20,880 9,280 290 88 88 1,584 8 564 (4) XC2VPX20 8 1 22,032 9,792 306 88 88 1,584 8 552 XC2VP30 8 2 30,816 13,696 428 136 136 2,448 8 644 (3) XC2VP40 0 , 8, or 12 2 43,632 19,392 606 192 192 3,456 8 804 (3) XC2VP50 0 or 16 2 53,136 23,616 738 232 232 4,176 8 852 XC2VP70 16 or 20 2 74,448 33,088 1,034 328 328 5,904 8 996 (4) XC2VPX70 20 2 74,448 33,088 1,034 308 308 5,544 8 992 (3) XC2VP100 0 or 20 2 99,216 44,096 1,378 444 444 7,992 12 1,164 Notes: 1. -7 speed grade devices are not available in Industrial grade. 2. Logic Cell (1) 4-input LUT + (1)FF + Carry Logic 3. These devices can be ordered in a configuration without RocketIO transceivers. See Table 3 for package configurations. 4. Virtex-II Pro X devices equipped with RocketIO X transceiver cores. RocketIO X Transceiver Features (XC2VPX20 and XC2VPX70 Only) Variable-Speed Full-Duplex Transceiver (XC2VPX20) Automatic Lock-to-Reference Function Allowing 2.488 Gb/s to 6.25 Gb/s Baud Transfer Rates. Programmable Serial Output Differential Swing - Includes specific baud rates used by various - 200 mV to 1600 mV, peak-peak standards, as listed in Table 4, Module 2. - Allows compatibility with other serial system Fixed-Speed Full-Duplex Tranceiver (XC2VPX70) voltage levels Operating at 4.25 Gb/s Baud Transfer Rate. Programmable Pre-emphasis Levels 0 to 500% Eight or Twenty Transceiver Modules on an FPGA, Telecom/Datacom Support Modes Depending upon Device -x8 andx10 clocking/data paths Monolithic Clock Synthesis and Clock Recovery - 64B/66B clocking support - Eliminates the need for external components 20002011 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners. DS083 (v5.0) June 21, 2011 www.xilinx.com Module 1 of 4 Product Specification 1

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
XI4
XILINX
Xilinx Inc
Xilinx Inc.

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted