PCAN1206E40R2BST3

PCAN www.vishay.com Vishay Dale Thin Film High Power Aluminum Nitride, Wraparound Surface Mount, Precision Thin Film Chip Resistor (up to 6 W) FEATURES High thermal conductivity aluminum nitride substrate Power rating up to 6.0 W Resistance range 30 to 175 Resistor tolerance to 0.1 % TCR to 25 ppm/C Flame resistant UL 94 V-0 APPLICATIONS Power supplies PCAN series chip resistors are designed on aluminum Power switching nitride ceramic substrates with enlarged backside Braking system terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end users TYPICAL PERFORMANCE circuit assembly. Actual power handling capability is limited by the end user ABSOLUTE mounting process. As with any high power chip resistor the ability to remove the heat is critical to the overall TCR 25 performance of the device. TOL. 0.1 STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material Nichrome - Resistance Range 30 to 175 - TCR: Absolute 25 ppm/C (standard) and 100 ppm/C - Tolerance: Absolute 0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 % -55 C to +150 C (1) Power Rating: Resistor 2.0 W to 6.0 W Maximum at +70 C Stability: Absolute R 1.0 % 1000 h at +70 C Voltage Coefficient < 0.1 ppm/V - Working Voltage 75 V to 200 V - Operating Temperature Range -55 C to +155 C - Storage Temperature Range -55 C to +155 C - Noise < -30 dB - Shelf Life Stability: Absolute 0.01 % 1 year at +25 C Note (1) Dependant on component mounting by user. COMPONENT RATINGS CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE () (2) 1206 2000 200 30 to 175 (2) 2512 6000 200 30 to 175 Notes 0603 and 0805 case size under engineering qualification. (2) Dependant on component mounting by user. Revision: 07-Aug-14 Document Number: 60125 1 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 PCAN www.vishay.com Vishay Dale Thin Film ENVIRONMENTAL TESTS LIMITS MIL-PRF-55342 TYPICAL VISHAY ENVIRONMENTAL TEST CHARACTERISTIC H PERFORMANCE Resistance temperature characteristic 50 ppm/C 25 ppm/C Maximum ambient temperature at rated wattage +70 C +70 C Maximum ambient temperature at power derating +150 C +150 C Thermal shock 0.25 % 0.10 % Low temperature operation 0.25 % 0.10 % Short time overload 0.1 % 0.10 % High temperature exposure 0.2 % 0.10 % Resistance to soldering heat 0.25 % 0.10 % Moisture resistance 0.4 % 0.50 % Life at +70 C for 1000 h 0.5 % 1.00 % DIMENSIONS in inches DT D W T E L L THICKNESS LENGTH WIDTH TOP PAD BOTTOM PAD CASE SIZE T L W D E MIN./MAX. 1206 0.126 0.008 0.063 0.005 0.015 0.003 0.020 + 0.005/- 0.010 0.040 0.005 2512 0.259 + 0.009/- 0.015 0.124 0.005 0.015 0.003 0.020 0.005 0.050 0.005 LAND PATTERN DIMENSIONS in inches 1206 Land Pattern 2512 Land Pattern 0.1730 0.2910 0.0710 0.1260 0.0220 0.0755 0.1090 0.0910 STANDARD MATERIAL SPECIFICATIONS Resistive element Nichrome Substrate material Aluminum nitride Terminations (Tin/lead) Tin/lead solder over nickel barrier Terminations (Lead (Pb)-free) Tin/silver/copper (Sn96.5/Ag3.0/Cu0.5) solder over nickel barrier Revision: 07-Aug-14 Document Number: 60125 2 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000