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ATSAMR21B18MZ210PAT

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Development Boards & Kits - AVR AVRZLINK ATSAMR21B18MZ210PA
Manufacturer: Microchip


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Manufacturer
Microchip
Product Category
Development Boards & Kits - AVR
RoHS - XON
Y Icon ROHS
Brand
Microchip
Product Type
Development Boards & Kits - Avr
Factory Pack Quantity :
200
Subcategory
Development Tools
Cnhts
8543709991
Hts Code
8542310001
Mxhts
85423102
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ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125?C is a distinguishing feature. Features ? ATSAMR21 Single-chip ARM? Cortex?-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/O?s ? Max. operating freq. 48 MHz ? 128-bit AES crypto engine ? 32-bit MAC symbol counter ? Temperature sensor ? Automatic transmission modes ? MX25L2006EZUK-12G 2-Mbit DataFlash ? Lowest cost RF front end design with PCB antenna ? FCC / ETSI compliant harmonic filter ? Single 2.7V - 3.6V supply ? Extended industrial temperature range -40?C to 125?C ? Easy access 2mm pin header with several alternative functions ? 5 GPIO ? 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) ? 4 PWM outputs ? TWI (I2C up to 3.4MHz) ? SPI ? UART ? High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125?C is a distinguishing feature. Features ? ATSAMR21 Single-chip ARM? Cortex?-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/O?s ? Max. operating freq. 48 MHz ? 128-bit AES crypto engine ? 32-bit MAC symbol counter ? Temperature sensor ? Automatic transmission modes ? MX25L2006EZUK-12G 2-Mbit DataFlash ? Lowest cost RF front end design with PCB antenna ? FCC / ETSI compliant harmonic filter ? Single 2.7V - 3.6V supply ? Extended industrial temperature range -40?C to 125?C ? Easy access 2mm pin header with several alternative functions ? 5 GPIO ? 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) ? 4 PWM outputs ? TWI (I2C up to 3.4MHz) ? SPI ? UART ? High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 Table of Contents Description 1 Features 1 Table of Contents ............................................................................................................... 2 1 Integrated Devices and Block Diagram ...................................................................... 3 1.1 Module Block Diagram .......................................................................................................................... 3 1.2 Integrated system peripherals ............................................................................................................... 3 1.2.1 Serial Flash interconnect .......................................................................................................... 3 1.2.2 Available UART interfaces ........................................................................................................ 3 1.3 RF front end .......................................................................................................................................... 4 2 Mechanical Description ............................................................................................... 5 2.1 Mechanical Dimensions ........................................................................................................................ 5 2.2 Footprint Recommendation ................................................................................................................... 5 2.2.1 Pin header mounting ................................................................................................................ 5 Surface solder mounting ....................................................................................................................... 7 3 Module pin assignment ............................................................................................... 8 3.1 Application pins ..................................................................................................................................... 8 3.2 Test points ............................................................................................................................................. 9 3.2.1 Top layer test points ................................................................................................................. 9 3.2.2 Bottom layer test points ............................................................................................................ 9 4 Electrical Characteristics .......................................................................................... 11 4.1 Absolute Maximum Ratings ................................................................................................................. 11 4.2 Recommended Operating Conditions ................................................................................................. 11 4.3 Power Consumption ............................................................................................................................ 11 4.4 Module performance data ................................................................................................................... 12 5 NV Memory Information ............................................................................................ 13 6 Boot loader ................................................................................................................ 13 7 Radio Certification ..................................................................................................... 14 7.1 United States (FCC) ............................................................................................................................ 14 7.2 Europe (ETSI) ..................................................................................................................................... 14 7.3 Industry Canada (IC) Compliance statements ..................................................................................... 15 8 Ordering Information ................................................................................................. 16 9 References ................................................................................................................. 17 10 Revision History ........................................................................................................ 17 ATSAMR21B18-MZ210PA [PRELIMINARY DATASHEET] 2 Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125?C is a distinguishing feature. Features ? ATSAMR21 Single-chip ARM? Cortex?-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/O?s ? Max. operating freq. 48 MHz ? 128-bit AES crypto engine ? 32-bit MAC symbol counter ? Temperature sensor ? Automatic transmission modes ? MX25L2006EZUK-12G 2-Mbit DataFlash ? Lowest cost RF front end design with PCB antenna ? FCC / ETSI compliant harmonic filter ? Single 2.7V - 3.6V supply ? Extended industrial temperature range -40?C to 125?C ? Easy access 2mm pin header with several alternative functions ? 5 GPIO ? 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) ? 4 PWM outputs ? TWI (I2C up to 3.4MHz) ? SPI ? UART ? High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125?C is a distinguishing feature. Features ? ATSAMR21 Single-chip ARM? Cortex?-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/O?s ? Max. operating freq. 48 MHz ? 128-bit AES crypto engine ? 32-bit MAC symbol counter ? Temperature sensor ? Automatic transmission modes ? MX25L2006EZUK-12G 2-Mbit DataFlash ? Lowest cost RF front end design with PCB antenna ? FCC / ETSI compliant harmonic filter ? Single 2.7V - 3.6V supply ? Extended industrial temperature range -40?C to 125?C ? Easy access 2mm pin header with several alternative functions ? 5 GPIO ? 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) ? 4 PWM outputs ? TWI (I2C up to 3.4MHz) ? SPI ? UART ? High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 Table of Contents Description 1 Features 1 Table of Contents ............................................................................................................... 2 1 Integrated Devices and Block Diagram ...................................................................... 3 1.1 Module Block Diagram .......................................................................................................................... 3 1.2 Integrated system peripherals ............................................................................................................... 3 1.2.1 Serial Flash interconnect .......................................................................................................... 3 1.2.2 Available UART interfaces ........................................................................................................ 3 1.3 RF front end .......................................................................................................................................... 4 2 Mechanical Description ............................................................................................... 5 2.1 Mechanical Dimensions ........................................................................................................................ 5 2.2 Footprint Recommendation ................................................................................................................... 5 2.2.1 Pin header mounting ................................................................................................................ 5 Surface solder mounting ....................................................................................................................... 7 3 Module pin assignment ............................................................................................... 8 3.1 Application pins ..................................................................................................................................... 8 3.2 Test points ............................................................................................................................................. 9 3.2.1 Top layer test points ................................................................................................................. 9 3.2.2 Bottom layer test points ............................................................................................................ 9 4 Electrical Characteristics .......................................................................................... 11 4.1 Absolute Maximum Ratings ................................................................................................................. 11 4.2 Recommended Operating Conditions ................................................................................................. 11 4.3 Power Consumption ............................................................................................................................ 11 4.4 Module performance data ................................................................................................................... 12 5 NV Memory Information ............................................................................................ 13 6 Boot loader ................................................................................................................ 13 7 Radio Certification ..................................................................................................... 14 7.1 United States (FCC) ............................................................................................................................ 14 7.2 Europe (ETSI) ..................................................................................................................................... 14 7.3 Industry Canada (IC) Compliance statements ..................................................................................... 15 8 Ordering Information ................................................................................................. 16 9 References ................................................................................................................. 17 10 Revision History ........................................................................................................ 17 ATSAMR21B18-MZ210PA [PRELIMINARY DATASHEET] 2 Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 1 Integrated Devices and Block Diagram 1.1 Module Block Diagram The module has been optimized for minimum costs in lighting applications as a primary design goal. Therefore the list of peripheral devices is rather short with only a serial FLASH memory. Figure 1-1 shows the block diagram for the module. The harmonic filter is purely capacitive and the antenna is integrated on the PCB. Beside some test points, the module interface is providing five GPIO lines only. See section 3 for detailed information. ATSAMR21B18-MZ210PA MX25L2006EZUK ATSAMR21E18 Differential -12G SPI Harmonic Filter ARM? Cortex?-M0+ 2-Mbit DataFlash 5 GPIO Figure 1-1. Module Block Diagram 1.2 Integrated system peripherals A serial FLASH memory has been integrated to support over-the-air software upgrade functions. The memory interface is using a SERCOM based SPI. 1.2.1 Serial Flash interconnect DataFLASH uC Signal Function uC pin Port & SERCOM Configuration SO MISO 22 / PA24 PA24 SERCOM3 PAD[2] DIPO=0x2 SI MOSI 23 / PA25 PA25 SERCOM3 PAD[3] DOPO=0x2 SCK SCK 27 / PA28 PA28 SERCOM3 PAD[1] DOPO=0x2 #CS GPIO 25 / PA27 PA27 to be set low in software before SPI access Table 1-1. Microcontroller / data FLASH connection The signals in this table are not available as module IO. More information about the FLASH IC can be found in its related datasheet in section 7. (Macronix) 1.2.2 Available UART interfaces There are two UART interfaces available for external use. SERCOM2 is available at test points for debug use while SERCOM1 is available at connector X1 for application use. The test points for SERCOM2 are duplicated on the PCB top layer and on the bottom layer. See Table 1-2 for detailed information. ATSAMR21B18-MZ210PA [PRELIMINARY DATASHEET] 3 Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 Differential Antenna ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125?C is a distinguishing feature. Features ? ATSAMR21 Single-chip ARM? Cortex?-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/O?s ? Max. operating freq. 48 MHz ? 128-bit AES crypto engine ? 32-bit MAC symbol counter ? Temperature sensor ? Automatic transmission modes ? MX25L2006EZUK-12G 2-Mbit DataFlash ? Lowest cost RF front end design with PCB antenna ? FCC / ETSI compliant harmonic filter ? Single 2.7V - 3.6V supply ? Extended industrial temperature range -40?C to 125?C ? Easy access 2mm pin header with several alternative functions ? 5 GPIO ? 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) ? 4 PWM outputs ? TWI (I2C up to 3.4MHz) ? SPI ? UART ? High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125?C is a distinguishing feature. Features ? ATSAMR21 Single-chip ARM? Cortex?-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/O?s ? Max. operating freq. 48 MHz ? 128-bit AES crypto engine ? 32-bit MAC symbol counter ? Temperature sensor ? Automatic transmission modes ? MX25L2006EZUK-12G 2-Mbit DataFlash ? Lowest cost RF front end design with PCB antenna ? FCC / ETSI compliant harmonic filter ? Single 2.7V - 3.6V supply ? Extended industrial temperature range -40?C to 125?C ? Easy access 2mm pin header with several alternative functions ? 5 GPIO ? 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) ? 4 PWM outputs ? TWI (I2C up to 3.4MHz) ? SPI ? UART ? High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 Table of Contents Description 1 Features 1 Table of Contents ............................................................................................................... 2 1 Integrated Devices and Block Diagram ...................................................................... 3 1.1 Module Block Diagram .......................................................................................................................... 3 1.2 Integrated system peripherals ............................................................................................................... 3 1.2.1 Serial Flash interconnect .......................................................................................................... 3 1.2.2 Available UART interfaces ........................................................................................................ 3 1.3 RF front end .......................................................................................................................................... 4 2 Mechanical Description ............................................................................................... 5 2.1 Mechanical Dimensions ........................................................................................................................ 5 2.2 Footprint Recommendation ................................................................................................................... 5 2.2.1 Pin header mounting ................................................................................................................ 5 Surface solder mounting ....................................................................................................................... 7 3 Module pin assignment ............................................................................................... 8 3.1 Application pins ..................................................................................................................................... 8 3.2 Test points ............................................................................................................................................. 9 3.2.1 Top layer test points ................................................................................................................. 9 3.2.2 Bottom layer test points ............................................................................................................ 9 4 Electrical Characteristics .......................................................................................... 11 4.1 Absolute Maximum Ratings ................................................................................................................. 11 4.2 Recommended Operating Conditions ................................................................................................. 11 4.3 Power Consumption ............................................................................................................................ 11 4.4 Module performance data ................................................................................................................... 12 5 NV Memory Information ............................................................................................ 13 6 Boot loader ................................................................................................................ 13 7 Radio Certification ..................................................................................................... 14 7.1 United States (FCC) ............................................................................................................................ 14 7.2 Europe (ETSI) ..................................................................................................................................... 14 7.3 Industry Canada (IC) Compliance statements ..................................................................................... 15 8 Ordering Information ................................................................................................. 16 9 References ................................................................................................................. 17 10 Revision History ........................................................................................................ 17 ATSAMR21B18-MZ210PA [PRELIMINARY DATASHEET] 2 Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125?C is a distinguishing feature. Features ? ATSAMR21 Single-chip ARM? Cortex?-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/O?s ? Max. operating freq. 48 MHz ? 128-bit AES crypto engine ? 32-bit MAC symbol counter ? Temperature sensor ? Automatic transmission modes ? MX25L2006EZUK-12G 2-Mbit DataFlash ? Lowest cost RF front end design with PCB antenna ? FCC / ETSI compliant harmonic filter ? Single 2.7V - 3.6V supply ? Extended industrial temperature range -40?C to 125?C ? Easy access 2mm pin header with several alternative functions ? 5 GPIO ? 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) ? 4 PWM outputs ? TWI (I2C up to 3.4MHz) ? SPI ? UART ? High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125?C is a distinguishing feature. Features ? ATSAMR21 Single-chip ARM? Cortex?-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/O?s ? Max. operating freq. 48 MHz ? 128-bit AES crypto engine ? 32-bit MAC symbol counter ? Temperature sensor ? Automatic transmission modes ? MX25L2006EZUK-12G 2-Mbit DataFlash ? Lowest cost RF front end design with PCB antenna ? FCC / ETSI compliant harmonic filter ? Single 2.7V - 3.6V supply ? Extended industrial temperature range -40?C to 125?C ? Easy access 2mm pin header with several alternative functions ? 5 GPIO ? 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) ? 4 PWM outputs ? TWI (I2C up to 3.4MHz) ? SPI ? UART ? High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 Table of Contents Description 1 Features 1 Table of Contents ............................................................................................................... 2 1 Integrated Devices and Block Diagram ...................................................................... 3 1.1 Module Block Diagram .......................................................................................................................... 3 1.2 Integrated system peripherals ............................................................................................................... 3 1.2.1 Serial Flash interconnect .......................................................................................................... 3 1.2.2 Available UART interfaces ........................................................................................................ 3 1.3 RF front end .......................................................................................................................................... 4 2 Mechanical Description ............................................................................................... 5 2.1 Mechanical Dimensions ........................................................................................................................ 5 2.2 Footprint Recommendation ................................................................................................................... 5 2.2.1 Pin header mounting ................................................................................................................ 5 Surface solder mounting ....................................................................................................................... 7 3 Module pin assignment ............................................................................................... 8 3.1 Application pins ..................................................................................................................................... 8 3.2 Test points ............................................................................................................................................. 9 3.2.1 Top layer test points ................................................................................................................. 9 3.2.2 Bottom layer test points ............................................................................................................ 9 4 Electrical Characteristics .......................................................................................... 11 4.1 Absolute Maximum Ratings ................................................................................................................. 11 4.2 Recommended Operating Conditions ................................................................................................. 11 4.3 Power Consumption ............................................................................................................................ 11 4.4 Module performance data ................................................................................................................... 12 5 NV Memory Information ............................................................................................ 13 6 Boot loader ................................................................................................................ 13 7 Radio Certification ..................................................................................................... 14 7.1 United States (FCC) ............................................................................................................................ 14 7.2 Europe (ETSI) ..................................................................................................................................... 14 7.3 Industry Canada (IC) Compliance statements ..................................................................................... 15 8 Ordering Information ................................................................................................. 16 9 References ................................................................................................................. 17 10 Revision History ........................................................................................................ 17 ATSAMR21B18-MZ210PA [PRELIMINARY DATASHEET] 2 Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 1 Integrated Devices and Block Diagram 1.1 Module Block Diagram The module has been optimized for minimum costs in lighting applications as a primary design goal. Therefore the list of peripheral devices is rather short with only a serial FLASH memory. Figure 1-1 shows the block diagram for the module. The harmonic filter is purely capacitive and the antenna is integrated on the PCB. Beside some test points, the module interface is providing five GPIO lines only. See section 3 for detailed information. ATSAMR21B18-MZ210PA MX25L2006EZUK ATSAMR21E18 Differential -12G SPI Harmonic Filter ARM? Cortex?-M0+ 2-Mbit DataFlash 5 GPIO Figure 1-1. Module Block Diagram 1.2 Integrated system peripherals A serial FLASH memory has been integrated to support over-the-air software upgrade functions. The memory interface is using a SERCOM based SPI. 1.2.1 Serial Flash interconnect DataFLASH uC Signal Function uC pin Port & SERCOM Configuration SO MISO 22 / PA24 PA24 SERCOM3 PAD[2] DIPO=0x2 SI MOSI 23 / PA25 PA25 SERCOM3 PAD[3] DOPO=0x2 SCK SCK 27 / PA28 PA28 SERCOM3 PAD[1] DOPO=0x2 #CS GPIO 25 / PA27 PA27 to be set low in software before SPI access Table 1-1. Microcontroller / data FLASH connection The signals in this table are not available as module IO. More information about the FLASH IC can be found in its related datasheet in section 7. (Macronix) 1.2.2 Available UART interfaces There are two UART interfaces available for external use. SERCOM2 is available at test points for debug use while SERCOM1 is available at connector X1 for application use. The test points for SERCOM2 are duplicated on the PCB top layer and on the bottom layer. See Table 1-2 for detailed information. ATSAMR21B18-MZ210PA [PRELIMINARY DATASHEET] 3 Atmel-42486B-ATSAMR21B18-MZ210PA_Datasheet_09/2015 Differential Antenna

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8542.31.00 61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products8542.31.00

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